JPS5838694A - 半導体ダイボンデイング用はんだ - Google Patents

半導体ダイボンデイング用はんだ

Info

Publication number
JPS5838694A
JPS5838694A JP13677181A JP13677181A JPS5838694A JP S5838694 A JPS5838694 A JP S5838694A JP 13677181 A JP13677181 A JP 13677181A JP 13677181 A JP13677181 A JP 13677181A JP S5838694 A JPS5838694 A JP S5838694A
Authority
JP
Japan
Prior art keywords
solder
semiconductor
semiconductor die
die bonding
mounting base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13677181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6335359B2 (enrdf_load_stackoverflow
Inventor
Hiroyuki Baba
博之 馬場
Osamu Kodan
小段　修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13677181A priority Critical patent/JPS5838694A/ja
Publication of JPS5838694A publication Critical patent/JPS5838694A/ja
Publication of JPS6335359B2 publication Critical patent/JPS6335359B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP13677181A 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ Granted JPS5838694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13677181A JPS5838694A (ja) 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13677181A JPS5838694A (ja) 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ

Publications (2)

Publication Number Publication Date
JPS5838694A true JPS5838694A (ja) 1983-03-07
JPS6335359B2 JPS6335359B2 (enrdf_load_stackoverflow) 1988-07-14

Family

ID=15183124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13677181A Granted JPS5838694A (ja) 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ

Country Status (1)

Country Link
JP (1) JPS5838694A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183993A (ja) * 1983-04-04 1984-10-19 Hitachi Ltd ろう接構造
JPS60166192A (ja) * 1984-02-07 1985-08-29 Furukawa Electric Co Ltd:The 高融点ハンダ
JPS61238932A (ja) * 1985-04-12 1986-10-24 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電気移動の活動度を減少する方法
JPS63127501A (ja) * 1986-11-17 1988-05-31 株式会社　サト−セン 過負荷溶断形抵抗器
CN111448643A (zh) * 2018-01-24 2020-07-24 三菱综合材料株式会社 半导体模块的接合层、半导体模块及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998358A (enrdf_load_stackoverflow) * 1973-01-25 1974-09-18
JPS55158485U (enrdf_load_stackoverflow) * 1979-04-27 1980-11-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998358A (enrdf_load_stackoverflow) * 1973-01-25 1974-09-18
JPS55158485U (enrdf_load_stackoverflow) * 1979-04-27 1980-11-14

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183993A (ja) * 1983-04-04 1984-10-19 Hitachi Ltd ろう接構造
JPS60166192A (ja) * 1984-02-07 1985-08-29 Furukawa Electric Co Ltd:The 高融点ハンダ
JPS61238932A (ja) * 1985-04-12 1986-10-24 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電気移動の活動度を減少する方法
JPS63127501A (ja) * 1986-11-17 1988-05-31 株式会社　サト−セン 過負荷溶断形抵抗器
CN111448643A (zh) * 2018-01-24 2020-07-24 三菱综合材料株式会社 半导体模块的接合层、半导体模块及其制造方法

Also Published As

Publication number Publication date
JPS6335359B2 (enrdf_load_stackoverflow) 1988-07-14

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