JPS5838694A - 半導体ダイボンデイング用はんだ - Google Patents

半導体ダイボンデイング用はんだ

Info

Publication number
JPS5838694A
JPS5838694A JP56136771A JP13677181A JPS5838694A JP S5838694 A JPS5838694 A JP S5838694A JP 56136771 A JP56136771 A JP 56136771A JP 13677181 A JP13677181 A JP 13677181A JP S5838694 A JPS5838694 A JP S5838694A
Authority
JP
Japan
Prior art keywords
solder
semiconductor
die bonding
semiconductor die
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56136771A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6335359B2 (cg-RX-API-DMAC10.html
Inventor
Hiroyuki Baba
博之 馬場
Osamu Kodan
小段　修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56136771A priority Critical patent/JPS5838694A/ja
Publication of JPS5838694A publication Critical patent/JPS5838694A/ja
Publication of JPS6335359B2 publication Critical patent/JPS6335359B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • H10W72/30—
    • H10W72/073—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP56136771A 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ Granted JPS5838694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56136771A JPS5838694A (ja) 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56136771A JPS5838694A (ja) 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ

Publications (2)

Publication Number Publication Date
JPS5838694A true JPS5838694A (ja) 1983-03-07
JPS6335359B2 JPS6335359B2 (cg-RX-API-DMAC10.html) 1988-07-14

Family

ID=15183124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56136771A Granted JPS5838694A (ja) 1981-08-31 1981-08-31 半導体ダイボンデイング用はんだ

Country Status (1)

Country Link
JP (1) JPS5838694A (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183993A (ja) * 1983-04-04 1984-10-19 Hitachi Ltd ろう接構造
JPS60166192A (ja) * 1984-02-07 1985-08-29 Furukawa Electric Co Ltd:The 高融点ハンダ
JPS61238932A (ja) * 1985-04-12 1986-10-24 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電気移動の活動度を減少する方法
JPS63127501A (ja) * 1986-11-17 1988-05-31 株式会社　サト−セン 過負荷溶断形抵抗器
CN111448643A (zh) * 2018-01-24 2020-07-24 三菱综合材料株式会社 半导体模块的接合层、半导体模块及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998358A (cg-RX-API-DMAC10.html) * 1973-01-25 1974-09-18
JPS55158485U (cg-RX-API-DMAC10.html) * 1979-04-27 1980-11-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998358A (cg-RX-API-DMAC10.html) * 1973-01-25 1974-09-18
JPS55158485U (cg-RX-API-DMAC10.html) * 1979-04-27 1980-11-14

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183993A (ja) * 1983-04-04 1984-10-19 Hitachi Ltd ろう接構造
JPS60166192A (ja) * 1984-02-07 1985-08-29 Furukawa Electric Co Ltd:The 高融点ハンダ
JPS61238932A (ja) * 1985-04-12 1986-10-24 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電気移動の活動度を減少する方法
JPS63127501A (ja) * 1986-11-17 1988-05-31 株式会社　サト−セン 過負荷溶断形抵抗器
CN111448643A (zh) * 2018-01-24 2020-07-24 三菱综合材料株式会社 半导体模块的接合层、半导体模块及其制造方法

Also Published As

Publication number Publication date
JPS6335359B2 (cg-RX-API-DMAC10.html) 1988-07-14

Similar Documents

Publication Publication Date Title
JPS6187396A (ja) 電子回路装置とその製造方法
JP2009060101A (ja) 電子機器
JP2002301588A (ja) はんだ箔および半導体装置および電子装置
US12394769B2 (en) Batch soldering of different elements in power module
JP2001230351A (ja) 電子モジュール用接合材料、モジュール型半導体装置及びその製造方法
JPS60242653A (ja) リ−ドフレ−ム用複合材
JPH10294337A (ja) 半導体装置及びその製造方法
JPS5838694A (ja) 半導体ダイボンデイング用はんだ
JPS5936426B2 (ja) Ｉｃ用リ−ドフレ−ム
CN110957290A (zh) 包括包含化合物sn/sb的焊料化合物的半导体器件
JP2000068396A (ja) ハーメチックシール用カバー
JPS5936425B2 (ja) 中間層を有するリ−ドフレ−ム構造
JPH02278743A (ja) インジウム半田の接合構造
JPS62216251A (ja) 高熱伝導性基板
JPS6034265B2 (ja) 電子部品
JPS6244817B2 (cg-RX-API-DMAC10.html)
JP2533675B2 (ja) 半導体装置及びその製造方法
JPS5927537A (ja) 半導体装置
JPH03208355A (ja) 半導体装置及びその製造方法
JPS6312385B2 (cg-RX-API-DMAC10.html)
JPS5815252A (ja) バンプ構造
JPH08204081A (ja) 半導体装置用リードフレーム及び半導体装置とその製造法
JP3142912B2 (ja) はんだ材料
JPH01143227A (ja) 混成集積回路装置
JPS6244545Y2 (cg-RX-API-DMAC10.html)