JPS5821430B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5821430B2
JPS5821430B2 JP50028459A JP2845975A JPS5821430B2 JP S5821430 B2 JPS5821430 B2 JP S5821430B2 JP 50028459 A JP50028459 A JP 50028459A JP 2845975 A JP2845975 A JP 2845975A JP S5821430 B2 JPS5821430 B2 JP S5821430B2
Authority
JP
Japan
Prior art keywords
solder
paste
bonding pad
pad
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50028459A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51102559A (enExample
Inventor
一ノ瀬松雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP50028459A priority Critical patent/JPS5821430B2/ja
Publication of JPS51102559A publication Critical patent/JPS51102559A/ja
Publication of JPS5821430B2 publication Critical patent/JPS5821430B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/012—

Landscapes

  • Wire Bonding (AREA)
JP50028459A 1975-03-07 1975-03-07 半導体装置の製造方法 Expired JPS5821430B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50028459A JPS5821430B2 (ja) 1975-03-07 1975-03-07 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50028459A JPS5821430B2 (ja) 1975-03-07 1975-03-07 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS51102559A JPS51102559A (enExample) 1976-09-10
JPS5821430B2 true JPS5821430B2 (ja) 1983-04-30

Family

ID=12249238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50028459A Expired JPS5821430B2 (ja) 1975-03-07 1975-03-07 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5821430B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023129A (ja) * 2013-07-18 2015-02-02 三菱マテリアル株式会社 はんだバンプ製造方法
JP2015164223A (ja) * 2015-05-14 2015-09-10 三菱マテリアル株式会社 はんだバンプ製造方法および下地形成用ペースト

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5457957A (en) * 1977-10-18 1979-05-10 Mitsubishi Electric Corp Production of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023129A (ja) * 2013-07-18 2015-02-02 三菱マテリアル株式会社 はんだバンプ製造方法
JP2015164223A (ja) * 2015-05-14 2015-09-10 三菱マテリアル株式会社 はんだバンプ製造方法および下地形成用ペースト

Also Published As

Publication number Publication date
JPS51102559A (enExample) 1976-09-10

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