JPS582054A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS582054A
JPS582054A JP56100337A JP10033781A JPS582054A JP S582054 A JPS582054 A JP S582054A JP 56100337 A JP56100337 A JP 56100337A JP 10033781 A JP10033781 A JP 10033781A JP S582054 A JPS582054 A JP S582054A
Authority
JP
Japan
Prior art keywords
package
terminals
printed circuit
circuit board
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56100337A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234184B2 (OSRAM
Inventor
Yasunori Kanai
金井　泰憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56100337A priority Critical patent/JPS582054A/ja
Priority to EP82303255A priority patent/EP0069505B1/en
Priority to US06/391,161 priority patent/US4530002A/en
Priority to DE8282303255T priority patent/DE3277269D1/de
Publication of JPS582054A publication Critical patent/JPS582054A/ja
Publication of JPH0234184B2 publication Critical patent/JPH0234184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP56100337A 1981-06-26 1981-06-26 半導体装置 Granted JPS582054A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56100337A JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置
EP82303255A EP0069505B1 (en) 1981-06-26 1982-06-22 Semiconductor device connection lead formation
US06/391,161 US4530002A (en) 1981-06-26 1982-06-22 Connection lead arrangement for a semiconductor device
DE8282303255T DE3277269D1 (en) 1981-06-26 1982-06-22 Semiconductor device connection lead formation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56100337A JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS582054A true JPS582054A (ja) 1983-01-07
JPH0234184B2 JPH0234184B2 (OSRAM) 1990-08-01

Family

ID=14271316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56100337A Granted JPS582054A (ja) 1981-06-26 1981-06-26 半導体装置

Country Status (4)

Country Link
US (1) US4530002A (OSRAM)
EP (1) EP0069505B1 (OSRAM)
JP (1) JPS582054A (OSRAM)
DE (1) DE3277269D1 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789511A (en) * 1985-06-04 1988-12-06 University Of Manchester Institute Of Science And Technology Material processing
USRE44251E1 (en) 1996-09-12 2013-06-04 Ibiden Co., Ltd. Circuit board for mounting electronic parts

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117211B1 (en) * 1983-02-18 1991-04-17 Fairchild Semiconductor Corporation Method for fabricating a package for an integrated circuit
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
JPS6189643A (ja) * 1984-10-09 1986-05-07 Toshiba Corp 半導体装置及びその製造方法
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
EP0268181B1 (en) * 1986-11-15 1992-07-29 Matsushita Electric Works, Ltd. Plastic molded pin grid chip carrier package
US4914741A (en) * 1987-06-08 1990-04-03 Digital Equipment Corporation Tape automated bonding semiconductor package
US5089881A (en) * 1988-11-03 1992-02-18 Micro Substrates, Inc. Fine-pitch chip carrier
JP2760829B2 (ja) * 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
WO1991000619A1 (en) * 1989-06-30 1991-01-10 Raychem Corporation Flying leads for integrated circuits
JP3137977B2 (ja) * 1990-09-19 2001-02-26 富士通株式会社 多数のリードビンを有する半導体装置
JPH05102262A (ja) * 1991-10-03 1993-04-23 Hitachi Ltd 半導体装置及びそれを実装した実装装置
JPH06244231A (ja) * 1993-02-01 1994-09-02 Motorola Inc 気密半導体デバイスおよびその製造方法
US5563446A (en) * 1994-01-25 1996-10-08 Lsi Logic Corporation Surface mount peripheral leaded and ball grid array package
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5889333A (en) * 1994-08-09 1999-03-30 Fujitsu Limited Semiconductor device and method for manufacturing such
US5508556A (en) * 1994-09-02 1996-04-16 Motorola, Inc. Leaded semiconductor device having accessible power supply pad terminals
US6016852A (en) * 1994-12-01 2000-01-25 Intel Corporation Leaded grid array IC package having coplanar bent leads for surface mount technology
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
JP2959480B2 (ja) * 1996-08-12 1999-10-06 日本電気株式会社 半導体装置及びその製造方法
JPH10242374A (ja) * 1997-02-27 1998-09-11 Oki Electric Ind Co Ltd 半導体装置
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
JP2001185640A (ja) 1999-12-24 2001-07-06 Nec Corp 表面実装型パッケージ及び電子部品並びに電子部品の製造方法
US6992378B2 (en) 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US6936502B2 (en) * 2003-05-14 2005-08-30 Nortel Networks Limited Package modification for channel-routed circuit boards
US20080280463A1 (en) * 2007-05-09 2008-11-13 Mercury Computer Systems, Inc. Rugged Chip Packaging
DE102007040662A1 (de) * 2007-08-27 2009-03-26 Elster Meßtechnik GmbH Verfahren zur Montage von elektronischen Bauteilen und elektromechanischen Komponenten auf einer Leiterplatte
JP7443780B2 (ja) * 2020-01-17 2024-03-06 富士電機株式会社 多層基板回路構造
DE102020208214A1 (de) 2020-07-01 2022-01-05 Zf Friedrichshafen Ag Leiterplatte, Inverter, Kraftfahrzeug sowie Verfahren zur Herstellung einer Leiterplatte

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538078A (en) * 1978-09-11 1980-03-17 Mitsubishi Electric Corp Semiconductor integrated circuit device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
JPS53129863A (en) * 1977-04-19 1978-11-13 Fujitsu Ltd Multilayer printed board
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538078A (en) * 1978-09-11 1980-03-17 Mitsubishi Electric Corp Semiconductor integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789511A (en) * 1985-06-04 1988-12-06 University Of Manchester Institute Of Science And Technology Material processing
USRE44251E1 (en) 1996-09-12 2013-06-04 Ibiden Co., Ltd. Circuit board for mounting electronic parts

Also Published As

Publication number Publication date
US4530002A (en) 1985-07-16
DE3277269D1 (en) 1987-10-15
EP0069505A3 (en) 1985-01-02
EP0069505B1 (en) 1987-09-09
JPH0234184B2 (OSRAM) 1990-08-01
EP0069505A2 (en) 1983-01-12

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