JPS5818960A - メモリ・セル - Google Patents

メモリ・セル

Info

Publication number
JPS5818960A
JPS5818960A JP57098628A JP9862882A JPS5818960A JP S5818960 A JPS5818960 A JP S5818960A JP 57098628 A JP57098628 A JP 57098628A JP 9862882 A JP9862882 A JP 9862882A JP S5818960 A JPS5818960 A JP S5818960A
Authority
JP
Japan
Prior art keywords
region
layer
bit
insulating layer
sense line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57098628A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03789B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
ドナルド・マツクアルピン・ケニイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5818960A publication Critical patent/JPS5818960A/ja
Publication of JPH03789B2 publication Critical patent/JPH03789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
JP57098628A 1981-07-22 1982-06-10 メモリ・セル Granted JPS5818960A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US286110 1981-07-22
US06/286,110 US4511911A (en) 1981-07-22 1981-07-22 Dense dynamic memory cell structure and process

Publications (2)

Publication Number Publication Date
JPS5818960A true JPS5818960A (ja) 1983-02-03
JPH03789B2 JPH03789B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-08

Family

ID=23097120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57098628A Granted JPS5818960A (ja) 1981-07-22 1982-06-10 メモリ・セル

Country Status (5)

Country Link
US (1) US4511911A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0070426B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5818960A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1183954A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3268109D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181669A (ja) * 1984-06-25 1986-04-25 テキサス　インスツルメンツ　インコ−ポレイテツド 電界効果トランジスタを作る方法
JPS6182464A (ja) * 1984-07-02 1986-04-26 テキサス　インスツルメンツ　インコ−ポレイテツド メモリ・セルとその製法
JPS63183904A (ja) * 1987-01-27 1988-07-29 Kanebo Ltd 可視光重合硬化性組成物
WO2011111512A1 (ja) 2010-03-10 2011-09-15 オムロン株式会社 電子部品、電子部品の製造方法および電子体温計

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137245A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd 大規模半導体メモリ
JPS58154256A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPH0612619B2 (ja) * 1982-09-22 1994-02-16 株式会社日立製作所 半導体メモリ装置
US4571816A (en) * 1984-12-11 1986-02-25 Rca Corporation Method of making a capacitor with standard self-aligned gate process
KR930010088B1 (ko) * 1985-04-24 1993-10-14 가부시기가이샤 히다찌세이꾸쇼 반도체 기억장치와 그 제조방법
JPS62198153A (ja) * 1986-02-26 1987-09-01 Nec Corp 半導体装置
JPH0789569B2 (ja) * 1986-03-26 1995-09-27 株式会社日立製作所 半導体集積回路装置及びその製造方法
US4914740A (en) * 1988-03-07 1990-04-03 International Business Corporation Charge amplifying trench memory cell
US4970689A (en) * 1988-03-07 1990-11-13 International Business Machines Corporation Charge amplifying trench memory cell
TW483089B (en) * 2001-02-07 2002-04-11 Macronix Int Co Ltd Method for reducing wire capacitance and its semiconductor structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL301884A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1962-12-17
GB1132810A (en) * 1966-03-30 1968-11-06 Matsushita Electronics Corp Field-effect transistor having insulated gates
US3387286A (en) * 1967-07-14 1968-06-04 Ibm Field-effect transistor memory
NL173110C (nl) * 1971-03-17 1983-12-01 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting, waarbij op een oppervlak van een halfgeleiderlichaam een uit ten minste twee deellagen van verschillend materiaal samengestelde maskeringslaag wordt aangebracht.
US4017883A (en) * 1971-07-06 1977-04-12 Ibm Corporation Single-electrode charge-coupled random access memory cell with impurity implanted gate region
US4014036A (en) * 1971-07-06 1977-03-22 Ibm Corporation Single-electrode charge-coupled random access memory cell
US3767983A (en) * 1972-08-23 1973-10-23 Bell Telephone Labor Inc Charge transfer device with improved transfer efficiency
US3841926A (en) * 1973-01-02 1974-10-15 Ibm Integrated circuit fabrication process
US3811076A (en) * 1973-01-02 1974-05-14 Ibm Field effect transistor integrated circuit and memory
NL185376C (nl) * 1976-10-25 1990-03-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting.
US4164751A (en) * 1976-11-10 1979-08-14 Texas Instruments Incorporated High capacity dynamic ram cell
US4135289A (en) * 1977-08-23 1979-01-23 Bell Telephone Laboratories, Incorporated Method for producing a buried junction memory device
US4326331A (en) * 1979-09-17 1982-04-27 Texas Instruments Incorporated High coupling ratio electrically programmable ROM
NL186886C (nl) * 1980-11-28 1992-03-16 Philips Nv Halfgeleiderinrichting.
US4373965A (en) * 1980-12-22 1983-02-15 Ncr Corporation Suppression of parasitic sidewall transistors in locos structures

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181669A (ja) * 1984-06-25 1986-04-25 テキサス　インスツルメンツ　インコ−ポレイテツド 電界効果トランジスタを作る方法
JPS6182464A (ja) * 1984-07-02 1986-04-26 テキサス　インスツルメンツ　インコ−ポレイテツド メモリ・セルとその製法
JPS63183904A (ja) * 1987-01-27 1988-07-29 Kanebo Ltd 可視光重合硬化性組成物
WO2011111512A1 (ja) 2010-03-10 2011-09-15 オムロン株式会社 電子部品、電子部品の製造方法および電子体温計

Also Published As

Publication number Publication date
US4511911A (en) 1985-04-16
EP0070426B1 (en) 1985-12-27
EP0070426A2 (en) 1983-01-26
EP0070426A3 (en) 1983-09-14
CA1183954A (en) 1985-03-12
DE3268109D1 (en) 1986-02-06
JPH03789B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-08

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