JPS5817649A - 電子部品パツケ−ジ - Google Patents

電子部品パツケ−ジ

Info

Publication number
JPS5817649A
JPS5817649A JP56115901A JP11590181A JPS5817649A JP S5817649 A JPS5817649 A JP S5817649A JP 56115901 A JP56115901 A JP 56115901A JP 11590181 A JP11590181 A JP 11590181A JP S5817649 A JPS5817649 A JP S5817649A
Authority
JP
Japan
Prior art keywords
plating
lead frame
plating layer
rhodium
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56115901A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6259892B2 (enExample
Inventor
Masayoshi Shimizu
清水　昌吉
Eiji Aoki
英二 青木
Susumu Kida
貴田　進
Ariteru Kanazawa
金沢　有輝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56115901A priority Critical patent/JPS5817649A/ja
Priority to US06/400,013 priority patent/US4590672A/en
Priority to EP82303929A priority patent/EP0074168B1/en
Priority to DE8282303929T priority patent/DE3268393D1/de
Publication of JPS5817649A publication Critical patent/JPS5817649A/ja
Publication of JPS6259892B2 publication Critical patent/JPS6259892B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W70/457—
    • H10W95/00—
    • H10W70/682—
    • H10W72/075—
    • H10W72/50—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/952—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Casings For Electric Apparatus (AREA)
JP56115901A 1981-07-24 1981-07-24 電子部品パツケ−ジ Granted JPS5817649A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56115901A JPS5817649A (ja) 1981-07-24 1981-07-24 電子部品パツケ−ジ
US06/400,013 US4590672A (en) 1981-07-24 1982-07-20 Package for electronic device and method for producing same
EP82303929A EP0074168B1 (en) 1981-07-24 1982-07-23 Device and method for packaging electronic devices
DE8282303929T DE3268393D1 (en) 1981-07-24 1982-07-23 Device and method for packaging electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56115901A JPS5817649A (ja) 1981-07-24 1981-07-24 電子部品パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5817649A true JPS5817649A (ja) 1983-02-01
JPS6259892B2 JPS6259892B2 (enExample) 1987-12-14

Family

ID=14674005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56115901A Granted JPS5817649A (ja) 1981-07-24 1981-07-24 電子部品パツケ−ジ

Country Status (4)

Country Link
US (1) US4590672A (enExample)
EP (1) EP0074168B1 (enExample)
JP (1) JPS5817649A (enExample)
DE (1) DE3268393D1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001546A (en) * 1983-07-27 1991-03-19 Olin Corporation Clad metal lead frame substrates
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
DE3578830D1 (de) * 1984-06-14 1990-08-30 Advanced Micro Devices Inc Mehrschicht-waermesenkpackung fuer integrierte schaltung.
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
US4814947A (en) * 1988-02-17 1989-03-21 North American Philips Corporation Surface mounted electronic device with selectively solderable leads
EP0335608B1 (en) * 1988-03-28 1995-06-14 Texas Instruments Incorporated Lead frame with reduced corrosion
US5049974A (en) * 1989-05-15 1991-09-17 Roger Corporation Interconnect device and method of manufacture thereof
US5223746A (en) * 1989-06-14 1993-06-29 Hitachi, Ltd. Packaging structure for a solid-state imaging device with selectively aluminium coated leads
JPH03129862A (ja) * 1989-10-16 1991-06-03 Nec Corp ガラス封止型半導体装置
US5438161A (en) * 1993-06-04 1995-08-01 S&C Electric Company Apparatus with interconnection arrangement
TW201227898A (en) * 2010-12-24 2012-07-01 Unimicron Technology Corp Package substrate and fabrication method thereof
DE102016202763B4 (de) 2015-03-12 2023-12-14 Schott Ag Angepasste Durchführung
GB2539750B (en) * 2015-03-12 2021-04-28 Schott Ag Matched seal feedthrough

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827756U (enExample) * 1971-08-07 1973-04-04
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu
JPS51115775A (en) * 1975-04-04 1976-10-12 Nec Corp Semiconductor apparatus

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE96608C (enExample) *
US3007855A (en) * 1958-12-29 1961-11-07 Bell Telephone Labor Inc Rhodium plating
GB940277A (en) * 1960-08-25 1963-10-30 Carman Lab Inc Improvements in semiconductor devices
DE1249466B (enExample) * 1963-10-29 1900-01-01
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3304362A (en) * 1964-12-31 1967-02-14 Inland Electronic Products Cor Glass-to-metal seals in electronic devices
GB1166992A (en) * 1965-08-27 1969-10-15 Plessey Co Ltd Improvements in or relating to Electrical Conductors
US3484533A (en) * 1966-09-29 1969-12-16 Texas Instruments Inc Method for fabricating semiconductor package and resulting article of manufacture
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
US3585075A (en) * 1969-02-26 1971-06-15 Bell Telephone Labor Inc Schottky barrier diode
JPS4810904B1 (enExample) * 1969-03-12 1973-04-09
NL6909889A (enExample) * 1969-06-27 1970-12-29 Philips Nv
US3647712A (en) * 1970-09-04 1972-03-07 Kerr Mc Gee Chem Corp Mixture of alcohols and fluorinated beta-diketones useful as extractant in recovery of vanadium
NL7018378A (enExample) * 1970-12-17 1972-06-20
DE2135488A1 (de) * 1971-03-23 1973-04-19 Interelectric Ag Verfahren zum herstellen eines systemtraegers fuer integrierte schaltkreise
US3878554A (en) * 1971-03-25 1975-04-15 Fujitsu Ltd Semiconductor device
US3748712A (en) * 1971-03-30 1973-07-31 Franklin Mint Corp Tarnish resistant plating for silver articles
US3765970A (en) * 1971-06-24 1973-10-16 Rca Corp Method of making beam leads for semiconductor devices
US3686080A (en) * 1971-07-21 1972-08-22 Rca Corp Method of fabrication of semiconductor devices
GB1383297A (en) * 1972-02-23 1974-02-12 Plessey Co Ltd Electrical integrated circuit package
US3886578A (en) * 1973-02-26 1975-05-27 Multi State Devices Ltd Low ohmic resistance platinum contacts for vanadium oxide thin film devices
US3932880A (en) * 1974-11-26 1976-01-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with Schottky barrier
US4068022A (en) * 1974-12-10 1978-01-10 Western Electric Company, Inc. Methods of strengthening bonds
JPS522170A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Electronic parts
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
US4337133A (en) * 1979-06-20 1982-06-29 Bell Telephone Laboratories, Incorporated Hard gold surfaces
DE3021665A1 (de) * 1980-06-10 1981-12-17 Degussa Ag, 6000 Frankfurt Stark saures goldlegierungsbad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827756U (enExample) * 1971-08-07 1973-04-04
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu
JPS51115775A (en) * 1975-04-04 1976-10-12 Nec Corp Semiconductor apparatus

Also Published As

Publication number Publication date
DE3268393D1 (en) 1986-02-20
US4590672A (en) 1986-05-27
EP0074168A1 (en) 1983-03-16
EP0074168B1 (en) 1986-01-08
JPS6259892B2 (enExample) 1987-12-14

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