JPS58169922A - オ−トプロ−バにおけるウエハ−のアライメント方法 - Google Patents

オ−トプロ−バにおけるウエハ−のアライメント方法

Info

Publication number
JPS58169922A
JPS58169922A JP5114082A JP5114082A JPS58169922A JP S58169922 A JPS58169922 A JP S58169922A JP 5114082 A JP5114082 A JP 5114082A JP 5114082 A JP5114082 A JP 5114082A JP S58169922 A JPS58169922 A JP S58169922A
Authority
JP
Japan
Prior art keywords
wafer
alignment
probe
needle
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5114082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216018B2 (enrdf_load_stackoverflow
Inventor
Hiromichi Mori
森　宏道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5114082A priority Critical patent/JPS58169922A/ja
Publication of JPS58169922A publication Critical patent/JPS58169922A/ja
Publication of JPS6216018B2 publication Critical patent/JPS6216018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP5114082A 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法 Granted JPS58169922A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5114082A JPS58169922A (ja) 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5114082A JPS58169922A (ja) 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法

Publications (2)

Publication Number Publication Date
JPS58169922A true JPS58169922A (ja) 1983-10-06
JPS6216018B2 JPS6216018B2 (enrdf_load_stackoverflow) 1987-04-10

Family

ID=12878509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5114082A Granted JPS58169922A (ja) 1982-03-31 1982-03-31 オ−トプロ−バにおけるウエハ−のアライメント方法

Country Status (1)

Country Link
JP (1) JPS58169922A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024030A (ja) * 1983-07-19 1985-02-06 Telmec Co Ltd 半導体ウエハ測定方法
JPS6024029A (ja) * 1983-07-19 1985-02-06 Telmec Co Ltd 半導体ウエハプローブ方法
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
JPS63265436A (ja) * 1987-04-23 1988-11-01 Tokyo Electron Ltd プロービング方法
JPS63271948A (ja) * 1987-04-28 1988-11-09 Tokyo Electron Ltd プロ−ビング方法
US4943767A (en) * 1986-08-21 1990-07-24 Tokyo Electron Limited Automatic wafer position aligning method for wafer prober

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024030A (ja) * 1983-07-19 1985-02-06 Telmec Co Ltd 半導体ウエハ測定方法
JPS6024029A (ja) * 1983-07-19 1985-02-06 Telmec Co Ltd 半導体ウエハプローブ方法
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
US4943767A (en) * 1986-08-21 1990-07-24 Tokyo Electron Limited Automatic wafer position aligning method for wafer prober
JPS63265436A (ja) * 1987-04-23 1988-11-01 Tokyo Electron Ltd プロービング方法
JPS63271948A (ja) * 1987-04-28 1988-11-09 Tokyo Electron Ltd プロ−ビング方法

Also Published As

Publication number Publication date
JPS6216018B2 (enrdf_load_stackoverflow) 1987-04-10

Similar Documents

Publication Publication Date Title
JP2963603B2 (ja) プローブ装置のアライメント方法
JPS6115341A (ja) ウエハプロ−バ
KR950015701A (ko) 프로우빙 방법 및 프로우브 장치
US7977957B2 (en) Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing
CN110470975B (zh) 晶圆特性测试系统和方法
JPH07297242A (ja) プローブ方法及びその装置
JPS58169922A (ja) オ−トプロ−バにおけるウエハ−のアライメント方法
JP2004063877A (ja) ウェハの位置決め修正方法
KR101091695B1 (ko) 얼라인먼트 기능을 갖는 반도체 검사장치와 얼라인먼트 방법
JP2005150224A (ja) プローブ情報を用いた半導体検査装置及び検査方法
JPH067561B2 (ja) 半導体ウエハチツプの位置合わせ方法
JP2005123293A (ja) プローブ検査方法
JPH0384945A (ja) 位置合せ方法およびそれを用いた検査装置
CN115407179A (zh) 一种利用测试焊点对应关系提高准确性的晶圆测试方法
JPH065690B2 (ja) 半導体ウエハプローブ方法
JPH08222611A (ja) ウェーハの位置合わせ方法
JPS6279640A (ja) ウエハプロ−バ装置
JPS6184029A (ja) 半導体検査装置
CN114563598A (zh) 一种对位调整方法、装置及设备
JP2939665B2 (ja) 半導体ウエハの測定方法
JP2694462B2 (ja) 半導体ウェーハチップの位置合わせ方法
JPH04283672A (ja) 分割試験ヘッドの位置補正方法及び装置
JPS6170735A (ja) 電気測定用アライメントマ−クを有するウエハまたはチツプ
JPH09213757A (ja) ウエハプローブ容易化方法
JPH09260443A (ja) 半導体装置及びそのテスト方法