JPS58155727A - 半導体装置の樹脂封止金型 - Google Patents

半導体装置の樹脂封止金型

Info

Publication number
JPS58155727A
JPS58155727A JP3852182A JP3852182A JPS58155727A JP S58155727 A JPS58155727 A JP S58155727A JP 3852182 A JP3852182 A JP 3852182A JP 3852182 A JP3852182 A JP 3852182A JP S58155727 A JPS58155727 A JP S58155727A
Authority
JP
Japan
Prior art keywords
resin
mold
sealing
air
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3852182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240851B2 (US07655688-20100202-C00086.png
Inventor
Koji Yanagiya
柳谷　孝二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3852182A priority Critical patent/JPS58155727A/ja
Publication of JPS58155727A publication Critical patent/JPS58155727A/ja
Publication of JPS6240851B2 publication Critical patent/JPS6240851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP3852182A 1982-03-10 1982-03-10 半導体装置の樹脂封止金型 Granted JPS58155727A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3852182A JPS58155727A (ja) 1982-03-10 1982-03-10 半導体装置の樹脂封止金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3852182A JPS58155727A (ja) 1982-03-10 1982-03-10 半導体装置の樹脂封止金型

Publications (2)

Publication Number Publication Date
JPS58155727A true JPS58155727A (ja) 1983-09-16
JPS6240851B2 JPS6240851B2 (US07655688-20100202-C00086.png) 1987-08-31

Family

ID=12527572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3852182A Granted JPS58155727A (ja) 1982-03-10 1982-03-10 半導体装置の樹脂封止金型

Country Status (1)

Country Link
JP (1) JPS58155727A (US07655688-20100202-C00086.png)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064818U (ja) * 1983-10-13 1985-05-08 トーワ株式会社 トランスフア−モ−ルド金型装置
JPS6185829A (ja) * 1984-10-03 1986-05-01 Michio Osada 半導体素子のトランスフア樹脂モ−ルド成形方法
JPS62113572A (ja) * 1985-11-13 1987-05-25 Hitachi Ltd プラテンローラの製造装置
JPS6388411U (US07655688-20100202-C00086.png) * 1986-11-28 1988-06-08
JP2006159690A (ja) * 2004-12-08 2006-06-22 Apic Yamada Corp 樹脂モールド金型および樹脂モールド装置
NL2000488C2 (nl) * 2007-02-15 2008-08-18 Fico Bv Werkwijze en inrichting voor het met behulp van onderdruk omhullen van elektronische componenten.
KR100930737B1 (ko) 2009-07-08 2009-12-09 동현정공(주) 진공흡입을 위한 오버 플로우부를 구비하는 플라스틱 성형 진공 금형
JP2009292076A (ja) * 2008-06-06 2009-12-17 Apic Yamada Corp トランスファモールド装置とこれを用いたトランスファモールド方法
KR100933025B1 (ko) 2009-07-08 2009-12-21 동현정공(주) 진공흡입을 위한 오버 플로우부를 구비하는 플라스틱 성형 진공 금형
JP2014075443A (ja) * 2012-10-03 2014-04-24 Shin Etsu Chem Co Ltd 半導体装置の製造方法及び半導体装置
CN106738704A (zh) * 2017-01-10 2017-05-31 佛山市顺德区百年科技有限公司 真空注塑模具和注塑机

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064818U (ja) * 1983-10-13 1985-05-08 トーワ株式会社 トランスフア−モ−ルド金型装置
JPS646266Y2 (US07655688-20100202-C00086.png) * 1983-10-13 1989-02-17
JPS6185829A (ja) * 1984-10-03 1986-05-01 Michio Osada 半導体素子のトランスフア樹脂モ−ルド成形方法
JPH0418464B2 (US07655688-20100202-C00086.png) * 1984-10-03 1992-03-27 Michio Osada
JPS62113572A (ja) * 1985-11-13 1987-05-25 Hitachi Ltd プラテンローラの製造装置
JPS6388411U (US07655688-20100202-C00086.png) * 1986-11-28 1988-06-08
JPH0345781Y2 (US07655688-20100202-C00086.png) * 1986-11-28 1991-09-27
JP2006159690A (ja) * 2004-12-08 2006-06-22 Apic Yamada Corp 樹脂モールド金型および樹脂モールド装置
NL2000488C2 (nl) * 2007-02-15 2008-08-18 Fico Bv Werkwijze en inrichting voor het met behulp van onderdruk omhullen van elektronische componenten.
WO2008100146A2 (en) * 2007-02-15 2008-08-21 Fico B.V. Method and device for encapsulating electronic components using underpressure
WO2008100146A3 (en) * 2007-02-15 2008-11-27 Fico Bv Method and device for encapsulating electronic components using underpressure
JP2009292076A (ja) * 2008-06-06 2009-12-17 Apic Yamada Corp トランスファモールド装置とこれを用いたトランスファモールド方法
KR100930737B1 (ko) 2009-07-08 2009-12-09 동현정공(주) 진공흡입을 위한 오버 플로우부를 구비하는 플라스틱 성형 진공 금형
KR100933025B1 (ko) 2009-07-08 2009-12-21 동현정공(주) 진공흡입을 위한 오버 플로우부를 구비하는 플라스틱 성형 진공 금형
JP2014075443A (ja) * 2012-10-03 2014-04-24 Shin Etsu Chem Co Ltd 半導体装置の製造方法及び半導体装置
CN106738704A (zh) * 2017-01-10 2017-05-31 佛山市顺德区百年科技有限公司 真空注塑模具和注塑机

Also Published As

Publication number Publication date
JPS6240851B2 (US07655688-20100202-C00086.png) 1987-08-31

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