JPS58151095A - 集積回路用基板及びその製造方法 - Google Patents
集積回路用基板及びその製造方法Info
- Publication number
- JPS58151095A JPS58151095A JP3273182A JP3273182A JPS58151095A JP S58151095 A JPS58151095 A JP S58151095A JP 3273182 A JP3273182 A JP 3273182A JP 3273182 A JP3273182 A JP 3273182A JP S58151095 A JPS58151095 A JP S58151095A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor layer
- substrate
- conductor
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 238000007751 thermal spraying Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 241001092070 Eriobotrya Species 0.000 claims 1
- 235000009008 Eriobotrya japonica Nutrition 0.000 claims 1
- 235000014121 butter Nutrition 0.000 claims 1
- 239000010410 layer Substances 0.000 description 49
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 4
- 238000007750 plasma spraying Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229940098465 tincture Drugs 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3273182A JPS58151095A (ja) | 1982-03-02 | 1982-03-02 | 集積回路用基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3273182A JPS58151095A (ja) | 1982-03-02 | 1982-03-02 | 集積回路用基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58151095A true JPS58151095A (ja) | 1983-09-08 |
| JPS62596B2 JPS62596B2 (enrdf_load_stackoverflow) | 1987-01-08 |
Family
ID=12366979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3273182A Granted JPS58151095A (ja) | 1982-03-02 | 1982-03-02 | 集積回路用基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58151095A (enrdf_load_stackoverflow) |
-
1982
- 1982-03-02 JP JP3273182A patent/JPS58151095A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62596B2 (enrdf_load_stackoverflow) | 1987-01-08 |
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