JPS58124254A - 半導体機器のリ−ド材用銅合金 - Google Patents

半導体機器のリ−ド材用銅合金

Info

Publication number
JPS58124254A
JPS58124254A JP606182A JP606182A JPS58124254A JP S58124254 A JPS58124254 A JP S58124254A JP 606182 A JP606182 A JP 606182A JP 606182 A JP606182 A JP 606182A JP S58124254 A JPS58124254 A JP S58124254A
Authority
JP
Japan
Prior art keywords
weight
alloy
lead material
copper alloy
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP606182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6314056B2 (enrdf_load_html_response
Inventor
Masahiro Tsuji
正博 辻
Michiharu Yamamoto
山本　道晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kogyo KK
Eneos Corp
Original Assignee
Nihon Kogyo KK
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kogyo KK, Nippon Mining Co Ltd filed Critical Nihon Kogyo KK
Priority to JP606182A priority Critical patent/JPS58124254A/ja
Publication of JPS58124254A publication Critical patent/JPS58124254A/ja
Publication of JPS6314056B2 publication Critical patent/JPS6314056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP606182A 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金 Granted JPS58124254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP606182A JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP606182A JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Related Child Applications (5)

Application Number Title Priority Date Filing Date
JP23369883A Division JPS59145745A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23370183A Division JPS59145748A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23370083A Division JPS59145747A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23369983A Division JPS59145746A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金
JP23370283A Division JPS59145749A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS58124254A true JPS58124254A (ja) 1983-07-23
JPS6314056B2 JPS6314056B2 (enrdf_load_html_response) 1988-03-29

Family

ID=11628069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP606182A Granted JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS58124254A (enrdf_load_html_response)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213847A (ja) * 1982-06-05 1983-12-12 Kobe Steel Ltd 電気電子部品用銅合金及びその製造法
JPS59136439A (ja) * 1983-01-26 1984-08-06 Sanpo Shindo Kogyo Kk 銅基合金
JPS6043448A (ja) * 1983-08-16 1985-03-08 Kobe Steel Ltd 端子・コネクター用銅合金の製造方法
JPS60218440A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60218442A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS61177348A (ja) * 1985-02-01 1986-08-09 Kobe Steel Ltd セラミツクパツケ−ジｉｃ用リ−ド材
US4650123A (en) * 1986-03-25 1987-03-17 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
US4700896A (en) * 1986-04-11 1987-10-20 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
JPH0741887A (ja) * 1992-09-24 1995-02-10 Poongsan Corp 電気、電子部品用銅合金及びその製造方法
JP2007017926A (ja) * 2005-06-07 2007-01-25 Kobe Steel Ltd 表示デバイス
JP2008282887A (ja) * 2007-05-09 2008-11-20 Tohoku Univ 液晶表示装置及びその製造方法
DE19643378C5 (de) * 1995-12-08 2010-12-16 Poongsan Corp, Pyeongtaek Produkt aus einer Kupferlegierung und Verfahren zu dessen Herstellung
US8451394B2 (en) 2007-05-09 2013-05-28 Altiam Services Ltd. Llc Liquid crystal display device and manufacturing method therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011586B2 (ja) * 2005-09-30 2012-08-29 Ｄｏｗａメタルテック株式会社 曲げ加工性と疲労特性を改善した銅合金板材及びその製法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314612A (en) * 1976-07-28 1978-02-09 Toshiba Corp Lead wire
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
JPS55104449A (en) * 1979-02-02 1980-08-09 Hitachi Ltd High-strength high-electrically-conductive copper alloy with superior weldability
JPS55158246A (en) * 1979-04-30 1980-12-09 Delta Enfield Metals Precipitation hardenable copper alloy
JPS56142840A (en) * 1980-04-04 1981-11-07 Hitachi Ltd Copper alloy having minute crystal grain
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314612A (en) * 1976-07-28 1978-02-09 Toshiba Corp Lead wire
JPS55104449A (en) * 1979-02-02 1980-08-09 Hitachi Ltd High-strength high-electrically-conductive copper alloy with superior weldability
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
JPS55158246A (en) * 1979-04-30 1980-12-09 Delta Enfield Metals Precipitation hardenable copper alloy
JPS56142840A (en) * 1980-04-04 1981-11-07 Hitachi Ltd Copper alloy having minute crystal grain
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58213847A (ja) * 1982-06-05 1983-12-12 Kobe Steel Ltd 電気電子部品用銅合金及びその製造法
JPS59136439A (ja) * 1983-01-26 1984-08-06 Sanpo Shindo Kogyo Kk 銅基合金
JPS6043448A (ja) * 1983-08-16 1985-03-08 Kobe Steel Ltd 端子・コネクター用銅合金の製造方法
JPS60218440A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60218442A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS61177348A (ja) * 1985-02-01 1986-08-09 Kobe Steel Ltd セラミツクパツケ−ジｉｃ用リ−ド材
US4650123A (en) * 1986-03-25 1987-03-17 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
US4700896A (en) * 1986-04-11 1987-10-20 Toyota Jidosha Kabushiki Kaisha Rotary type electrostatic spray painting device
JPH0741887A (ja) * 1992-09-24 1995-02-10 Poongsan Corp 電気、電子部品用銅合金及びその製造方法
DE19643378C5 (de) * 1995-12-08 2010-12-16 Poongsan Corp, Pyeongtaek Produkt aus einer Kupferlegierung und Verfahren zu dessen Herstellung
JP2007017926A (ja) * 2005-06-07 2007-01-25 Kobe Steel Ltd 表示デバイス
JP2008282887A (ja) * 2007-05-09 2008-11-20 Tohoku Univ 液晶表示装置及びその製造方法
US8451394B2 (en) 2007-05-09 2013-05-28 Altiam Services Ltd. Llc Liquid crystal display device and manufacturing method therefor

Also Published As

Publication number Publication date
JPS6314056B2 (enrdf_load_html_response) 1988-03-29

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