JPS58117234A - 熱伝導性材料 - Google Patents

熱伝導性材料

Info

Publication number
JPS58117234A
JPS58117234A JP57000027A JP2782A JPS58117234A JP S58117234 A JPS58117234 A JP S58117234A JP 57000027 A JP57000027 A JP 57000027A JP 2782 A JP2782 A JP 2782A JP S58117234 A JPS58117234 A JP S58117234A
Authority
JP
Japan
Prior art keywords
thermally conductive
conductive material
weight
vinyl acetate
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57000027A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219144B2 (enExample
Inventor
Kunio Yonahara
与那原　邦夫
Kazuo Fushimi
伏見　和夫
Shingo Aimoto
相本　信悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp, Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Corp
Priority to JP57000027A priority Critical patent/JPS58117234A/ja
Publication of JPS58117234A publication Critical patent/JPS58117234A/ja
Publication of JPH0219144B2 publication Critical patent/JPH0219144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Organic Insulating Materials (AREA)
JP57000027A 1982-01-05 1982-01-05 熱伝導性材料 Granted JPS58117234A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57000027A JPS58117234A (ja) 1982-01-05 1982-01-05 熱伝導性材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57000027A JPS58117234A (ja) 1982-01-05 1982-01-05 熱伝導性材料

Publications (2)

Publication Number Publication Date
JPS58117234A true JPS58117234A (ja) 1983-07-12
JPH0219144B2 JPH0219144B2 (enExample) 1990-04-27

Family

ID=11462889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57000027A Granted JPS58117234A (ja) 1982-01-05 1982-01-05 熱伝導性材料

Country Status (1)

Country Link
JP (1) JPS58117234A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136298A (ja) * 1983-12-23 1985-07-19 松下電工株式会社 多層配線板
JPS60136296A (ja) * 1983-12-23 1985-07-19 松下電工株式会社 多層配線板
JPS62131033A (ja) * 1985-12-03 1987-06-13 Asahi Chem Ind Co Ltd 熱可塑性樹脂成形品
JPH10135591A (ja) * 1996-10-29 1998-05-22 Matsushita Electric Ind Co Ltd 熱伝導性基板および熱伝導性配線基板
FR2784261A1 (fr) * 1998-10-05 2000-04-07 Ge Medical Syst Sa Materiau d'isolation electrique et de refroidissement de conductivite thermique accrue et application a l'isolation d'un dispositif d'alimentation haute tension
JP2005097550A (ja) * 2003-07-31 2005-04-14 Natl Starch & Chem Investment Holding Corp サーマルインターフェース材料
EP1328141A3 (de) * 2002-01-12 2007-12-26 Schefenacker Vision Systems Germany GmbH & Co. KG Leiterbahn aus flexiblem Material, Baueinheit mit einer solchen flexiblen Leiterbahn und Verfahren zur Herstellung einer solchen Leiterbahn
EP1328140A3 (de) * 2002-01-12 2007-12-26 Schefenacker Vision Systems Germany GmbH & Co. KG Leiterbahn aus flexiblem Material, Baueinheit mit einer solchen flexiblen Leiterbahn und Verfahren zur Herstellung einer solchen Leiterbahn

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136298A (ja) * 1983-12-23 1985-07-19 松下電工株式会社 多層配線板
JPS60136296A (ja) * 1983-12-23 1985-07-19 松下電工株式会社 多層配線板
JPS62131033A (ja) * 1985-12-03 1987-06-13 Asahi Chem Ind Co Ltd 熱可塑性樹脂成形品
JPH10135591A (ja) * 1996-10-29 1998-05-22 Matsushita Electric Ind Co Ltd 熱伝導性基板および熱伝導性配線基板
FR2784261A1 (fr) * 1998-10-05 2000-04-07 Ge Medical Syst Sa Materiau d'isolation electrique et de refroidissement de conductivite thermique accrue et application a l'isolation d'un dispositif d'alimentation haute tension
EP0993238A1 (en) * 1998-10-05 2000-04-12 Ge Medical Systems Sa Electrical insulation and cooling material for a high-voltage supply device
EP1328141A3 (de) * 2002-01-12 2007-12-26 Schefenacker Vision Systems Germany GmbH & Co. KG Leiterbahn aus flexiblem Material, Baueinheit mit einer solchen flexiblen Leiterbahn und Verfahren zur Herstellung einer solchen Leiterbahn
EP1328140A3 (de) * 2002-01-12 2007-12-26 Schefenacker Vision Systems Germany GmbH & Co. KG Leiterbahn aus flexiblem Material, Baueinheit mit einer solchen flexiblen Leiterbahn und Verfahren zur Herstellung einer solchen Leiterbahn
JP2005097550A (ja) * 2003-07-31 2005-04-14 Natl Starch & Chem Investment Holding Corp サーマルインターフェース材料

Also Published As

Publication number Publication date
JPH0219144B2 (enExample) 1990-04-27

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