JPS5797616A - Base plate for vacuum equipment - Google Patents

Base plate for vacuum equipment

Info

Publication number
JPS5797616A
JPS5797616A JP17417480A JP17417480A JPS5797616A JP S5797616 A JPS5797616 A JP S5797616A JP 17417480 A JP17417480 A JP 17417480A JP 17417480 A JP17417480 A JP 17417480A JP S5797616 A JPS5797616 A JP S5797616A
Authority
JP
Japan
Prior art keywords
plate
adhered
base
copper plate
vacuum equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17417480A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038100B2 (enrdf_load_stackoverflow
Inventor
Masahiko Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP17417480A priority Critical patent/JPS5797616A/ja
Publication of JPS5797616A publication Critical patent/JPS5797616A/ja
Publication of JPH038100B2 publication Critical patent/JPH038100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP17417480A 1980-12-10 1980-12-10 Base plate for vacuum equipment Granted JPS5797616A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17417480A JPS5797616A (en) 1980-12-10 1980-12-10 Base plate for vacuum equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17417480A JPS5797616A (en) 1980-12-10 1980-12-10 Base plate for vacuum equipment

Publications (2)

Publication Number Publication Date
JPS5797616A true JPS5797616A (en) 1982-06-17
JPH038100B2 JPH038100B2 (enrdf_load_stackoverflow) 1991-02-05

Family

ID=15973994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17417480A Granted JPS5797616A (en) 1980-12-10 1980-12-10 Base plate for vacuum equipment

Country Status (1)

Country Link
JP (1) JPS5797616A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200963A (ja) * 1984-03-23 1985-10-11 Hitachi Ltd 薄膜形成装置
JPS6214431A (ja) * 1985-07-11 1987-01-23 Tokuda Seisakusho Ltd プラズマ処理装置
JPS63276225A (ja) * 1987-05-08 1988-11-14 Tokyo Electron Ltd アッシング装置
JPS63284820A (ja) * 1987-05-15 1988-11-22 Fujitsu Ltd ドライエッチング装置
JPH01225121A (ja) * 1988-03-04 1989-09-08 Hitachi Ltd 低温ドライエッチング装置
JPH01315135A (ja) * 1988-03-11 1989-12-20 Sumitomo Metal Ind Ltd プラズマエッチング装置
JPH04181725A (ja) * 1990-11-16 1992-06-29 Ngk Insulators Ltd 半導体ウエハー加熱用セラミックスヒーター
JPH04356921A (ja) * 1991-06-03 1992-12-10 Fujitsu Ltd ドライエッチング装置のウェハ保持盤
JP2008284557A (ja) * 2007-05-15 2008-11-27 Shinko Seiki Co Ltd 加熱冷却装置
JP2017506825A (ja) * 2014-02-12 2017-03-09 アクセリス テクノロジーズ, インコーポレイテッド 一定質量流量多層冷却液経路静電チャック

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200963A (ja) * 1984-03-23 1985-10-11 Hitachi Ltd 薄膜形成装置
JPS6214431A (ja) * 1985-07-11 1987-01-23 Tokuda Seisakusho Ltd プラズマ処理装置
JPS63276225A (ja) * 1987-05-08 1988-11-14 Tokyo Electron Ltd アッシング装置
JPS63284820A (ja) * 1987-05-15 1988-11-22 Fujitsu Ltd ドライエッチング装置
JPH01225121A (ja) * 1988-03-04 1989-09-08 Hitachi Ltd 低温ドライエッチング装置
JPH01315135A (ja) * 1988-03-11 1989-12-20 Sumitomo Metal Ind Ltd プラズマエッチング装置
JPH04181725A (ja) * 1990-11-16 1992-06-29 Ngk Insulators Ltd 半導体ウエハー加熱用セラミックスヒーター
JPH04356921A (ja) * 1991-06-03 1992-12-10 Fujitsu Ltd ドライエッチング装置のウェハ保持盤
JP2008284557A (ja) * 2007-05-15 2008-11-27 Shinko Seiki Co Ltd 加熱冷却装置
JP2017506825A (ja) * 2014-02-12 2017-03-09 アクセリス テクノロジーズ, インコーポレイテッド 一定質量流量多層冷却液経路静電チャック

Also Published As

Publication number Publication date
JPH038100B2 (enrdf_load_stackoverflow) 1991-02-05

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