JPS5797616A - Base plate for vacuum equipment - Google Patents

Base plate for vacuum equipment

Info

Publication number
JPS5797616A
JPS5797616A JP17417480A JP17417480A JPS5797616A JP S5797616 A JPS5797616 A JP S5797616A JP 17417480 A JP17417480 A JP 17417480A JP 17417480 A JP17417480 A JP 17417480A JP S5797616 A JPS5797616 A JP S5797616A
Authority
JP
Japan
Prior art keywords
plate
adhered
base
copper plate
vacuum equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17417480A
Other languages
Japanese (ja)
Other versions
JPH038100B2 (en
Inventor
Masahiko Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP17417480A priority Critical patent/JPS5797616A/en
Publication of JPS5797616A publication Critical patent/JPS5797616A/en
Publication of JPH038100B2 publication Critical patent/JPH038100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To enhance uniformity of temperature on the upper face of a base plate for vacuum equipment and to enlarge mechanical strength thereof by a method wherein the major part of a plane consisting of two metal plates coming in contact with each other and being piled up is adhered completely with a solder material excluding groove parts. CONSTITUTION:The metal plate 33 with engraved grooves 31 thereon to make cooling water to flow is covered with the copper plate 34. The contact faces of the metal plate 33 and the copper plate 34 are adhered completely by soldering excluding the groove 31 parts. Moreover a stainless plate 35 and the copper plate 34 are also adhered completely by soldering. By this constitution, because the respective plates are adhered with nearly the whole surface, mechanical strength is enlarged. Moreover heat is transmitted effectively even when the base is heated from the lower face, and uniformity of temperature on the upper face of the base is extremely superior.
JP17417480A 1980-12-10 1980-12-10 Base plate for vacuum equipment Granted JPS5797616A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17417480A JPS5797616A (en) 1980-12-10 1980-12-10 Base plate for vacuum equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17417480A JPS5797616A (en) 1980-12-10 1980-12-10 Base plate for vacuum equipment

Publications (2)

Publication Number Publication Date
JPS5797616A true JPS5797616A (en) 1982-06-17
JPH038100B2 JPH038100B2 (en) 1991-02-05

Family

ID=15973994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17417480A Granted JPS5797616A (en) 1980-12-10 1980-12-10 Base plate for vacuum equipment

Country Status (1)

Country Link
JP (1) JPS5797616A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200963A (en) * 1984-03-23 1985-10-11 Hitachi Ltd Apparatus for forming thin film
JPS6214431A (en) * 1985-07-11 1987-01-23 Tokuda Seisakusho Ltd Plasma treating device
JPS63276225A (en) * 1987-05-08 1988-11-14 Tokyo Electron Ltd Ashing system
JPS63284820A (en) * 1987-05-15 1988-11-22 Fujitsu Ltd Dry-etching equipment
JPH01225121A (en) * 1988-03-04 1989-09-08 Hitachi Ltd Low-temperature dry etching system
JPH01315135A (en) * 1988-03-11 1989-12-20 Sumitomo Metal Ind Ltd Plasma etching apparatus
JPH04181725A (en) * 1990-11-16 1992-06-29 Ngk Insulators Ltd Ceramic heater for heating semiconductor wafer
JPH04356921A (en) * 1991-06-03 1992-12-10 Fujitsu Ltd Wafer holding disk in dry etching apparatus
JP2008284557A (en) * 2007-05-15 2008-11-27 Shinko Seiki Co Ltd Heating/cooling apparatus
JP2017506825A (en) * 2014-02-12 2017-03-09 アクセリス テクノロジーズ， インコーポレイテッド Constant mass flow multilayer coolant path electrostatic chuck

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200963A (en) * 1984-03-23 1985-10-11 Hitachi Ltd Apparatus for forming thin film
JPH0565586B2 (en) * 1984-03-23 1993-09-20 Hitachi Ltd
JPS6214431A (en) * 1985-07-11 1987-01-23 Tokuda Seisakusho Ltd Plasma treating device
JPH051976B2 (en) * 1985-07-11 1993-01-11 Shibaura Eng Works Ltd
JPS63276225A (en) * 1987-05-08 1988-11-14 Tokyo Electron Ltd Ashing system
JPS63284820A (en) * 1987-05-15 1988-11-22 Fujitsu Ltd Dry-etching equipment
JPH01225121A (en) * 1988-03-04 1989-09-08 Hitachi Ltd Low-temperature dry etching system
JPH01315135A (en) * 1988-03-11 1989-12-20 Sumitomo Metal Ind Ltd Plasma etching apparatus
JPH04181725A (en) * 1990-11-16 1992-06-29 Ngk Insulators Ltd Ceramic heater for heating semiconductor wafer
JPH04356921A (en) * 1991-06-03 1992-12-10 Fujitsu Ltd Wafer holding disk in dry etching apparatus
JP2008284557A (en) * 2007-05-15 2008-11-27 Shinko Seiki Co Ltd Heating/cooling apparatus
JP2017506825A (en) * 2014-02-12 2017-03-09 アクセリス テクノロジーズ， インコーポレイテッド Constant mass flow multilayer coolant path electrostatic chuck

Also Published As

Publication number Publication date
JPH038100B2 (en) 1991-02-05

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