JPS57123998A - Treatment of molten tin of tin electroplated steel plate - Google Patents
Treatment of molten tin of tin electroplated steel plateInfo
- Publication number
- JPS57123998A JPS57123998A JP961781A JP961781A JPS57123998A JP S57123998 A JPS57123998 A JP S57123998A JP 961781 A JP961781 A JP 961781A JP 961781 A JP961781 A JP 961781A JP S57123998 A JPS57123998 A JP S57123998A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- steel plate
- iron
- high frequency
- frequency induction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To improve metallic gloss and wettability of pure tin solder by electrodepositing tin on a steel strip then melting the tin in a high frequency induction furnace, and water-cooling the same quickly thereby reducing an iron-tin alloy layer.
CONSTITUTION: A tin electroplated steel plate made by electrodepositing tin on a steel strip is heated to above the m.p. of tin by using a high frequency induction heating furnace or a high frequency induction heating furnace making combination use of the resistance heating to heat the steel plate with the Joule heat generated by direct conduction of electricity as a heat source. By these heating furnaces, the surface of the steel plate is quickly heated to melt only the tin of the surface layer, thereby forming an iron-tin alloy layer and improving corrosion resistance and metallic gloss. Next, in order to limit the growth of the iron-tin alloy layer, the steel material is cooled to the m.p. or below with water within 0.3 second upon melting of the tin, whereby the pure solder wettability is improved.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP961781A JPS57123998A (en) | 1981-01-27 | 1981-01-27 | Treatment of molten tin of tin electroplated steel plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP961781A JPS57123998A (en) | 1981-01-27 | 1981-01-27 | Treatment of molten tin of tin electroplated steel plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57123998A true JPS57123998A (en) | 1982-08-02 |
Family
ID=11725240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP961781A Pending JPS57123998A (en) | 1981-01-27 | 1981-01-27 | Treatment of molten tin of tin electroplated steel plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57123998A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02173294A (en) * | 1988-12-26 | 1990-07-04 | Nippon Mining Co Ltd | Reflow treatment of tin or tin alloy plated material |
JPH02270988A (en) * | 1989-04-11 | 1990-11-06 | Nippon Mining Co Ltd | Reflow solder plating material |
CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
CN103436933A (en) * | 2013-08-19 | 2013-12-11 | 新冶高科技集团有限公司 | Composite softening and melting method and device for electrotinning production line |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49117332A (en) * | 1973-03-14 | 1974-11-09 |
-
1981
- 1981-01-27 JP JP961781A patent/JPS57123998A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49117332A (en) * | 1973-03-14 | 1974-11-09 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02173294A (en) * | 1988-12-26 | 1990-07-04 | Nippon Mining Co Ltd | Reflow treatment of tin or tin alloy plated material |
JPH02270988A (en) * | 1989-04-11 | 1990-11-06 | Nippon Mining Co Ltd | Reflow solder plating material |
JPH0564720B2 (en) * | 1989-04-11 | 1993-09-16 | Nippon Mining Co Ltd | |
CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
CN103436933A (en) * | 2013-08-19 | 2013-12-11 | 新冶高科技集团有限公司 | Composite softening and melting method and device for electrotinning production line |
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