JPS6442371A - Method for joining by solder - Google Patents

Abstract

PURPOSE:To produce a base plate having superior heat conductivity and bonding strength, decreasing the shortage of solder by heating to melt a solder interposed between two plate materials to be jointed with a heating solid heating medium which is brought into contact with one of the plate materials, and thereafter quenching the plate materials with quenching the heating medium. CONSTITUTION:The heating solid heating medium 12, consisting of a highly heat-conducting metal of Al, etc., in which a cooling pipe 22 is connected with both side of openings of a through hole 21 pierced from one side surface to the other side surface, is mounted on a heating source 11 of a hot-plate, etc. A metal plate 13 as one of the plate materials is mounted onto the top face of the heating medium 12. A metallized ceramics plate 15 as another plate material is further positioned, through the solder 14, on the metal plate 13, and a vertically movable pressing-body 17 integrally attached with a silicone rubber 16 is provided thereon. Then, the heating source 11 is operated. By the generated heat, the metal plate 13, the solder 14, and the metallized ceramics plate 15 are heated, through the heating medium 12, to melt the solder 14. When both metal and ceramics plates 13, 15 are wetted with the molten solder, the heating is stopped by the signal from a thermocouple 24 and a solenoid valve 27 is opened to flow the cooling gas or liquid and thus the metal and ceramics plates 13 and 15 are quenched through the heating medium 11, and joined together.