JPS5785971A - Thin film former - Google Patents
Thin film formerInfo
- Publication number
- JPS5785971A JPS5785971A JP16167380A JP16167380A JPS5785971A JP S5785971 A JPS5785971 A JP S5785971A JP 16167380 A JP16167380 A JP 16167380A JP 16167380 A JP16167380 A JP 16167380A JP S5785971 A JPS5785971 A JP S5785971A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- vessel
- impurities
- inside wall
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To prevent falling of dust and inclusion of impurities, etc. at the forming of thin films surely by enclosing the thin film forming part in a vacuum vessel by using a hot plate. CONSTITUTION:A hot plate 7 of a torus shape or the like is disposed to enclose a thin film forming part consisting of a sputter vapor depositing part provided with electrodes 3a, 3b, etc. in a vacuum vessel 1, and a heater 8 is mounted on the outside circumferential surface of the plate 7. Then, the heater 7 is heated and therefore the evaporating material stuck on the plate 7 during film forming sticks tightly to the plate 7 by forming dense and strong films, so that falling of the dust and the like once stuck to the inside wall of the vessel 1 and peeled therefrom is prevented. If the electrodes 3a, 3b and the plate 7 are heated prior to film formation, strains and impurities can be expelled from the inside wall of the vessel 1. Further, the evaporating material is beforehand evaporated to form films on the plate 7 before a substrate 6 is contained therein, by which the deposition of the impurities from the plate 7 and the impurity deposition from the plate 7 and the inside wall of the vessel 1 by the impact of sputtered ions are prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16167380A JPS5785971A (en) | 1980-11-17 | 1980-11-17 | Thin film former |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16167380A JPS5785971A (en) | 1980-11-17 | 1980-11-17 | Thin film former |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5785971A true JPS5785971A (en) | 1982-05-28 |
Family
ID=15739663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16167380A Pending JPS5785971A (en) | 1980-11-17 | 1980-11-17 | Thin film former |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5785971A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980461U (en) * | 1982-11-18 | 1984-05-31 | 三洋電機株式会社 | vacuum equipment |
JPH04123257U (en) * | 1991-04-16 | 1992-11-06 | ソニー株式会社 | Bias ECR plasma CVD equipment |
EP0562035A1 (en) * | 1990-12-11 | 1993-09-29 | Lam Research Corporation | Minimization of particle generation in cvd reactors and methods |
JP2010223382A (en) * | 2009-03-24 | 2010-10-07 | Choshu Denki:Kk | Expansion and contraction device |
-
1980
- 1980-11-17 JP JP16167380A patent/JPS5785971A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980461U (en) * | 1982-11-18 | 1984-05-31 | 三洋電機株式会社 | vacuum equipment |
EP0562035A1 (en) * | 1990-12-11 | 1993-09-29 | Lam Research Corporation | Minimization of particle generation in cvd reactors and methods |
EP0562035A4 (en) * | 1990-12-11 | 1995-12-13 | Lam Res Corp | Minimization of particle generation in cvd reactors and methods |
JPH04123257U (en) * | 1991-04-16 | 1992-11-06 | ソニー株式会社 | Bias ECR plasma CVD equipment |
JP2010223382A (en) * | 2009-03-24 | 2010-10-07 | Choshu Denki:Kk | Expansion and contraction device |
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