JPS55145168A - Method and apparatus for controlling vacuum evaporation speed - Google Patents

Method and apparatus for controlling vacuum evaporation speed

Info

Publication number
JPS55145168A
JPS55145168A JP5068379A JP5068379A JPS55145168A JP S55145168 A JPS55145168 A JP S55145168A JP 5068379 A JP5068379 A JP 5068379A JP 5068379 A JP5068379 A JP 5068379A JP S55145168 A JPS55145168 A JP S55145168A
Authority
JP
Japan
Prior art keywords
plated
metallic particles
prescribed
heated
controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5068379A
Other languages
Japanese (ja)
Inventor
Toshihiko Odohira
Yoshikiyo Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP5068379A priority Critical patent/JPS55145168A/en
Publication of JPS55145168A publication Critical patent/JPS55145168A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To metallize the surface of a material to be plated with desired plated film at a high precision, by causing metallic particles to adhere to the surface of a controlling material heated to a prescribed temp., then by evaporating a portion of the adhered metal in order to metallize the surface of the material to be plated. CONSTITUTION:Material to be plated 14 is fed into a vacuum evaporation chamber 11 at a prescribed speed. After a controlling material 18 is heated to a prescribed temp., an evaporation source 16 contained in a crucible 17 is heated by a heating wire 19 to evaporate metallic particles. The evaporated metallic particles collide with the controlling material 18 set in the opening 21 and once adheres to the material 18. Among the metallic particles adhered to the controlling material 18, only those particles which are supplied with a prescribed temp. and energy are evaporated once again and migrate to the material 14 to be plated, leaving residual portion of the adhered metallic particles thereby metallizing the material 14 at a prescribed metallizing speed to form metallized layer of uniform wall thickness.
JP5068379A 1979-04-24 1979-04-24 Method and apparatus for controlling vacuum evaporation speed Pending JPS55145168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5068379A JPS55145168A (en) 1979-04-24 1979-04-24 Method and apparatus for controlling vacuum evaporation speed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5068379A JPS55145168A (en) 1979-04-24 1979-04-24 Method and apparatus for controlling vacuum evaporation speed

Publications (1)

Publication Number Publication Date
JPS55145168A true JPS55145168A (en) 1980-11-12

Family

ID=12865714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5068379A Pending JPS55145168A (en) 1979-04-24 1979-04-24 Method and apparatus for controlling vacuum evaporation speed

Country Status (1)

Country Link
JP (1) JPS55145168A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63277752A (en) * 1987-05-08 1988-11-15 Fuji Photo Film Co Ltd Vacuum deposition device
EP0982411A2 (en) * 1998-08-26 2000-03-01 TDK Corporation Evaporation source, apparatus and method for the preparation of organic EL device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63277752A (en) * 1987-05-08 1988-11-15 Fuji Photo Film Co Ltd Vacuum deposition device
EP0982411A2 (en) * 1998-08-26 2000-03-01 TDK Corporation Evaporation source, apparatus and method for the preparation of organic EL device
EP0982411A3 (en) * 1998-08-26 2001-02-28 TDK Corporation Evaporation source, apparatus and method for the preparation of organic EL device
US6296894B1 (en) 1998-08-26 2001-10-02 Tdk Corporation Evaporation source, apparatus and method for the preparation of organic El device

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