JPS55145168A - Method and apparatus for controlling vacuum evaporation speed - Google Patents
Method and apparatus for controlling vacuum evaporation speedInfo
- Publication number
- JPS55145168A JPS55145168A JP5068379A JP5068379A JPS55145168A JP S55145168 A JPS55145168 A JP S55145168A JP 5068379 A JP5068379 A JP 5068379A JP 5068379 A JP5068379 A JP 5068379A JP S55145168 A JPS55145168 A JP S55145168A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- metallic particles
- prescribed
- heated
- controlling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To metallize the surface of a material to be plated with desired plated film at a high precision, by causing metallic particles to adhere to the surface of a controlling material heated to a prescribed temp., then by evaporating a portion of the adhered metal in order to metallize the surface of the material to be plated. CONSTITUTION:Material to be plated 14 is fed into a vacuum evaporation chamber 11 at a prescribed speed. After a controlling material 18 is heated to a prescribed temp., an evaporation source 16 contained in a crucible 17 is heated by a heating wire 19 to evaporate metallic particles. The evaporated metallic particles collide with the controlling material 18 set in the opening 21 and once adheres to the material 18. Among the metallic particles adhered to the controlling material 18, only those particles which are supplied with a prescribed temp. and energy are evaporated once again and migrate to the material 14 to be plated, leaving residual portion of the adhered metallic particles thereby metallizing the material 14 at a prescribed metallizing speed to form metallized layer of uniform wall thickness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5068379A JPS55145168A (en) | 1979-04-24 | 1979-04-24 | Method and apparatus for controlling vacuum evaporation speed |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5068379A JPS55145168A (en) | 1979-04-24 | 1979-04-24 | Method and apparatus for controlling vacuum evaporation speed |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55145168A true JPS55145168A (en) | 1980-11-12 |
Family
ID=12865714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5068379A Pending JPS55145168A (en) | 1979-04-24 | 1979-04-24 | Method and apparatus for controlling vacuum evaporation speed |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55145168A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63277752A (en) * | 1987-05-08 | 1988-11-15 | Fuji Photo Film Co Ltd | Vacuum deposition device |
EP0982411A2 (en) * | 1998-08-26 | 2000-03-01 | TDK Corporation | Evaporation source, apparatus and method for the preparation of organic EL device |
-
1979
- 1979-04-24 JP JP5068379A patent/JPS55145168A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63277752A (en) * | 1987-05-08 | 1988-11-15 | Fuji Photo Film Co Ltd | Vacuum deposition device |
EP0982411A2 (en) * | 1998-08-26 | 2000-03-01 | TDK Corporation | Evaporation source, apparatus and method for the preparation of organic EL device |
EP0982411A3 (en) * | 1998-08-26 | 2001-02-28 | TDK Corporation | Evaporation source, apparatus and method for the preparation of organic EL device |
US6296894B1 (en) | 1998-08-26 | 2001-10-02 | Tdk Corporation | Evaporation source, apparatus and method for the preparation of organic El device |
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