JPS57212225A - Epoxy resin composition for encapsulation of semiconductor - Google Patents
Epoxy resin composition for encapsulation of semiconductorInfo
- Publication number
- JPS57212225A JPS57212225A JP9784081A JP9784081A JPS57212225A JP S57212225 A JPS57212225 A JP S57212225A JP 9784081 A JP9784081 A JP 9784081A JP 9784081 A JP9784081 A JP 9784081A JP S57212225 A JPS57212225 A JP S57212225A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- novolak
- diameter
- silica powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000005538 encapsulation Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000000843 powder Substances 0.000 abstract 4
- 229920003986 novolac Polymers 0.000 abstract 3
- 238000013329 compounding Methods 0.000 abstract 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 229910002026 crystalline silica Inorganic materials 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000005350 fused silica glass Substances 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9784081A JPS57212225A (en) | 1981-06-24 | 1981-06-24 | Epoxy resin composition for encapsulation of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9784081A JPS57212225A (en) | 1981-06-24 | 1981-06-24 | Epoxy resin composition for encapsulation of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57212225A true JPS57212225A (en) | 1982-12-27 |
| JPS627211B2 JPS627211B2 (enrdf_load_stackoverflow) | 1987-02-16 |
Family
ID=14202908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9784081A Granted JPS57212225A (en) | 1981-06-24 | 1981-06-24 | Epoxy resin composition for encapsulation of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57212225A (enrdf_load_stackoverflow) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608014U (ja) * | 1983-06-29 | 1985-01-21 | カルソニックカンセイ株式会社 | 座板一体型ラジエ−タ用金型 |
| JPS6164145A (ja) * | 1984-09-05 | 1986-04-02 | Mitsubishi Electric Corp | 樹脂封止形半導体装置 |
| JPS61143466A (ja) * | 1984-12-18 | 1986-07-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPS63108021A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPS63128020A (ja) * | 1986-11-18 | 1988-05-31 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPS63160255A (ja) * | 1986-12-23 | 1988-07-04 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPS6473748A (en) * | 1987-09-16 | 1989-03-20 | Nitto Denko Corp | Semiconductor device |
| JPH01206655A (ja) * | 1988-02-15 | 1989-08-18 | Nitto Denko Corp | 半導体装置およびそれに用いるエポキシ樹脂組成物 |
| JPH01206656A (ja) * | 1988-02-15 | 1989-08-18 | Nitto Denko Corp | 半導体装置 |
| US5202753A (en) * | 1990-11-26 | 1993-04-13 | Nippondenso Co., Ltd. | Resin-sealed semiconductor device |
| US5349240A (en) * | 1991-10-30 | 1994-09-20 | Nippondenso Co., Ltd. | Semiconductor device package having a sealing silicone gel with spherical fillers |
| JPH0770282A (ja) * | 1994-05-09 | 1995-03-14 | Hitachi Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPH08104730A (ja) * | 1995-06-20 | 1996-04-23 | Nitto Denko Corp | 半導体封止用樹脂組成物 |
| US5719225A (en) * | 1994-06-13 | 1998-02-17 | Sumitomo Chemical Company, Ltd. | Filler-containing resin composition suitable for injection molding and transfer molding |
| WO1998051743A1 (fr) * | 1997-05-14 | 1998-11-19 | Mitsubishi Rayon Co., Ltd. | Composition de resines (meth)acryliques pour piece moulee par injection thermodurcie, procede pour la preparation de cette composition et procede pour la production de pieces moulees en resines (meth)acryliques |
| US6844633B2 (en) | 2001-08-02 | 2005-01-18 | Nec Electronics Corporation | Sealing resin, resin-sealed semiconductor and system-in-package |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
| US3975757A (en) * | 1974-05-31 | 1976-08-17 | National Semiconductor Corporation | Molded electrical device |
| US4042550A (en) * | 1975-11-28 | 1977-08-16 | Allied Chemical Corporation | Encapsulant compositions based on anhydride-hardened epoxy resins |
| JPS537756A (en) * | 1976-07-10 | 1978-01-24 | Fujitsu Ltd | Low-pressure molding material of diallyl phthalate |
| JPS5414143A (en) * | 1977-07-05 | 1979-02-02 | Michio Morimoto | Automatic frequency control circuit |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5529532A (en) * | 1978-08-23 | 1980-03-01 | Toshiba Corp | Epoxy resin composition |
| JPS55165916A (en) * | 1979-06-11 | 1980-12-24 | Shikoku Chem Corp | Epoxy resin composition |
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5659837A (en) * | 1979-09-28 | 1981-05-23 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS5693749A (en) * | 1979-12-27 | 1981-07-29 | Hitachi Chem Co Ltd | Epoxy resin composition |
-
1981
- 1981-06-24 JP JP9784081A patent/JPS57212225A/ja active Granted
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
| US3975757A (en) * | 1974-05-31 | 1976-08-17 | National Semiconductor Corporation | Molded electrical device |
| US4042550A (en) * | 1975-11-28 | 1977-08-16 | Allied Chemical Corporation | Encapsulant compositions based on anhydride-hardened epoxy resins |
| JPS537756A (en) * | 1976-07-10 | 1978-01-24 | Fujitsu Ltd | Low-pressure molding material of diallyl phthalate |
| JPS5414143A (en) * | 1977-07-05 | 1979-02-02 | Michio Morimoto | Automatic frequency control circuit |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5529532A (en) * | 1978-08-23 | 1980-03-01 | Toshiba Corp | Epoxy resin composition |
| JPS55165916A (en) * | 1979-06-11 | 1980-12-24 | Shikoku Chem Corp | Epoxy resin composition |
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5659837A (en) * | 1979-09-28 | 1981-05-23 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS5693749A (en) * | 1979-12-27 | 1981-07-29 | Hitachi Chem Co Ltd | Epoxy resin composition |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608014U (ja) * | 1983-06-29 | 1985-01-21 | カルソニックカンセイ株式会社 | 座板一体型ラジエ−タ用金型 |
| JPS6164145A (ja) * | 1984-09-05 | 1986-04-02 | Mitsubishi Electric Corp | 樹脂封止形半導体装置 |
| JPS61143466A (ja) * | 1984-12-18 | 1986-07-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPS63108021A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPS63128020A (ja) * | 1986-11-18 | 1988-05-31 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JPH0680863A (ja) * | 1986-11-18 | 1994-03-22 | Hitachi Ltd | エポキシ樹脂組成物 |
| JPS63160255A (ja) * | 1986-12-23 | 1988-07-04 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPS6473748A (en) * | 1987-09-16 | 1989-03-20 | Nitto Denko Corp | Semiconductor device |
| JPH01206656A (ja) * | 1988-02-15 | 1989-08-18 | Nitto Denko Corp | 半導体装置 |
| JPH01206655A (ja) * | 1988-02-15 | 1989-08-18 | Nitto Denko Corp | 半導体装置およびそれに用いるエポキシ樹脂組成物 |
| US5202753A (en) * | 1990-11-26 | 1993-04-13 | Nippondenso Co., Ltd. | Resin-sealed semiconductor device |
| US5349240A (en) * | 1991-10-30 | 1994-09-20 | Nippondenso Co., Ltd. | Semiconductor device package having a sealing silicone gel with spherical fillers |
| JPH0770282A (ja) * | 1994-05-09 | 1995-03-14 | Hitachi Ltd | 半導体封止用エポキシ樹脂組成物 |
| US5719225A (en) * | 1994-06-13 | 1998-02-17 | Sumitomo Chemical Company, Ltd. | Filler-containing resin composition suitable for injection molding and transfer molding |
| US5780145A (en) * | 1994-06-13 | 1998-07-14 | Sumitomo Chemical Company, Limited | Filler-containing resin composition suitable for injection molding and transfer molding |
| JPH08104730A (ja) * | 1995-06-20 | 1996-04-23 | Nitto Denko Corp | 半導体封止用樹脂組成物 |
| WO1998051743A1 (fr) * | 1997-05-14 | 1998-11-19 | Mitsubishi Rayon Co., Ltd. | Composition de resines (meth)acryliques pour piece moulee par injection thermodurcie, procede pour la preparation de cette composition et procede pour la production de pieces moulees en resines (meth)acryliques |
| US6844633B2 (en) | 2001-08-02 | 2005-01-18 | Nec Electronics Corporation | Sealing resin, resin-sealed semiconductor and system-in-package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS627211B2 (enrdf_load_stackoverflow) | 1987-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS57212225A (en) | Epoxy resin composition for encapsulation of semiconductor | |
| JPS57212224A (en) | Epoxy resin composition for encapsulation of semiconductor | |
| JPS554952A (en) | Semiconductor device | |
| JPS5610947A (en) | Semiconductor sealing resin composition | |
| JPS5529526A (en) | Polyphenylene sulfide resin composition | |
| JPS5529532A (en) | Epoxy resin composition | |
| JPS55118952A (en) | Epoxy resin composition for sealing semiconductor | |
| KR960000984A (ko) | 성형용 수지 조성물 | |
| JPS5723625A (en) | Epoxy resin composition and resin-sealed semiconductor device | |
| JPS56122145A (en) | Resin composition for sealing semiconductor device | |
| JPS5359798A (en) | Epoxy resin composition of excellent warm-water resistance | |
| JPS5356294A (en) | Thermosetting resin composition | |
| JPS5525461A (en) | Resin composition for encapsulation of semiconductor | |
| JPS57210647A (en) | Semiconductor device | |
| JPS555929A (en) | Semiconductor sealing epoxy resin composition | |
| JPS5747742A (en) | Glass for coating and semiconductor device coated with said glass | |
| JPS57123249A (en) | Epoxy resin molding compound | |
| JPS57115853A (en) | Resin-sealed semiconductor device | |
| JPS57165452A (en) | Resin composition having thermal conductivity | |
| JPS57162747A (en) | Epoxy resin composition | |
| JPS5740524A (en) | Epoxy resin composition | |
| JPS57153455A (en) | Resin molded type semiconductor device | |
| JPS55137153A (en) | Electrical insulating resin composition | |
| JPS578253A (en) | Resin composition | |
| JPS5580739A (en) | Seal bonding material |