JPS627211B2 - - Google Patents

Info

Publication number
JPS627211B2
JPS627211B2 JP56097840A JP9784081A JPS627211B2 JP S627211 B2 JPS627211 B2 JP S627211B2 JP 56097840 A JP56097840 A JP 56097840A JP 9784081 A JP9784081 A JP 9784081A JP S627211 B2 JPS627211 B2 JP S627211B2
Authority
JP
Japan
Prior art keywords
epoxy resin
less
weight
silica powder
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56097840A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57212225A (en
Inventor
Kazuo Iko
Takahiro Yoshioka
Kazuyuki Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9784081A priority Critical patent/JPS57212225A/ja
Publication of JPS57212225A publication Critical patent/JPS57212225A/ja
Publication of JPS627211B2 publication Critical patent/JPS627211B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9784081A 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor Granted JPS57212225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9784081A JPS57212225A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9784081A JPS57212225A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Publications (2)

Publication Number Publication Date
JPS57212225A JPS57212225A (en) 1982-12-27
JPS627211B2 true JPS627211B2 (enrdf_load_stackoverflow) 1987-02-16

Family

ID=14202908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9784081A Granted JPS57212225A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Country Status (1)

Country Link
JP (1) JPS57212225A (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608014U (ja) * 1983-06-29 1985-01-21 カルソニックカンセイ株式会社 座板一体型ラジエ−タ用金型
JPS6164145A (ja) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp 樹脂封止形半導体装置
JPS61143466A (ja) * 1984-12-18 1986-07-01 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS63108021A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd 樹脂封止型半導体装置
JPS63128020A (ja) * 1986-11-18 1988-05-31 Hitachi Ltd 樹脂封止型半導体装置
JP2572761B2 (ja) * 1986-12-23 1997-01-16 日東電工株式会社 半導体装置
JP2755383B2 (ja) * 1987-09-16 1998-05-20 日東電工株式会社 半導体装置
JP2635350B2 (ja) * 1988-02-15 1997-07-30 日東電工株式会社 半導体装置およびそれに用いるエポキシ樹脂組成物
JP2588922B2 (ja) * 1988-02-15 1997-03-12 日東電工株式会社 半導体装置
JP2918328B2 (ja) * 1990-11-26 1999-07-12 株式会社デンソー 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置
JP2927081B2 (ja) * 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
JP2702401B2 (ja) * 1994-05-09 1998-01-21 株式会社日立製作所 樹脂封止型半導体装置とその製法
US5719225A (en) * 1994-06-13 1998-02-17 Sumitomo Chemical Company, Ltd. Filler-containing resin composition suitable for injection molding and transfer molding
JP2747247B2 (ja) * 1995-06-20 1998-05-06 日東電工株式会社 半導体封止用樹脂組成物
EP0982363A4 (en) * 1997-05-14 2001-03-21 Mitsubishi Rayon Co (METH) ACRYLIC RESIN COMPOSITION FOR HEAT-CURING INJECTION MOLDING, METHOD FOR PRODUCING THE COMPOSITION AND METHOD FOR PRODUCING THE (METH) ACRYLIC RESIN MOLDS
KR100481236B1 (ko) 2001-08-02 2005-04-07 엔이씨 일렉트로닉스 가부시키가이샤 밀봉 수지, 수지-밀봉형 반도체 및 시스템-인-패키지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
JPS537756A (en) * 1976-07-10 1978-01-24 Fujitsu Ltd Low-pressure molding material of diallyl phthalate
JPS5414143A (en) * 1977-07-05 1979-02-02 Michio Morimoto Automatic frequency control circuit
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165916A (en) * 1979-06-11 1980-12-24 Shikoku Chem Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5693749A (en) * 1979-12-27 1981-07-29 Hitachi Chem Co Ltd Epoxy resin composition

Also Published As

Publication number Publication date
JPS57212225A (en) 1982-12-27

Similar Documents

Publication Publication Date Title
JPS627211B2 (enrdf_load_stackoverflow)
JPH05239321A (ja) エポキシ樹脂組成物および半導体封止装置
JPH08245755A (ja) エポキシ樹脂組成物および電子部品封止装置
JPH05247181A (ja) エポキシ樹脂組成物および半導体封止装置
JPS61101522A (ja) 封止用樹脂組成物
JPH10173103A (ja) 半導体封止用エポキシ樹脂組成物
JP2576713B2 (ja) エポキシ樹脂組成物及び半導体装置
JP3941558B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2593503B2 (ja) エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPH05247182A (ja) エポキシ樹脂組成物および半導体封止装置
JPH1030049A (ja) エポキシ樹脂組成物および電子部品封止装置
JP2002080694A (ja) エポキシ樹脂組成物及び半導体装置
JPH08134330A (ja) Ｔａｂ封止用エポキシ樹脂組成物及びｔａｂ装置
JPS61101523A (ja) 封止用樹脂組成物
JP4608736B2 (ja) 半導体封止用エポキシ樹脂組成物の製造方法
JP2001261936A (ja) エポキシ樹脂組成物及び半導体装置
JPH05239190A (ja) エポキシ樹脂組成物および半導体封止装置
JPS61101521A (ja) 封止用樹脂組成物
JP2741254B2 (ja) エポキシ樹脂組成物
JP2811933B2 (ja) 封止用エポキシ樹脂組成物
JP4379972B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2000186214A (ja) 封止用樹脂組成物および半導体装置
JP2000038516A (ja) 封止用樹脂組成物および半導体装置
JPH093169A (ja) 封止用樹脂組成物および電子部品封止装置
JP3506423B2 (ja) 封止用樹脂組成物および半導体封止装置