JPS57211746A - Wafer conveying apparatus - Google Patents

Wafer conveying apparatus

Info

Publication number
JPS57211746A
JPS57211746A JP9774781A JP9774781A JPS57211746A JP S57211746 A JPS57211746 A JP S57211746A JP 9774781 A JP9774781 A JP 9774781A JP 9774781 A JP9774781 A JP 9774781A JP S57211746 A JPS57211746 A JP S57211746A
Authority
JP
Japan
Prior art keywords
wafers
wafer
belt
sucking head
wafer conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9774781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6129143B2 (zh
Inventor
Hideo Suzuki
Taku Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9774781A priority Critical patent/JPS57211746A/ja
Publication of JPS57211746A publication Critical patent/JPS57211746A/ja
Publication of JPS6129143B2 publication Critical patent/JPS6129143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Workpieces (AREA)
  • Specific Conveyance Elements (AREA)
  • Feeding Of Articles To Conveyors (AREA)
JP9774781A 1981-06-23 1981-06-23 Wafer conveying apparatus Granted JPS57211746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9774781A JPS57211746A (en) 1981-06-23 1981-06-23 Wafer conveying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9774781A JPS57211746A (en) 1981-06-23 1981-06-23 Wafer conveying apparatus

Publications (2)

Publication Number Publication Date
JPS57211746A true JPS57211746A (en) 1982-12-25
JPS6129143B2 JPS6129143B2 (zh) 1986-07-04

Family

ID=14200474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9774781A Granted JPS57211746A (en) 1981-06-23 1981-06-23 Wafer conveying apparatus

Country Status (1)

Country Link
JP (1) JPS57211746A (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147039A (ja) * 1982-02-24 1983-09-01 Toshiba Corp Ｃｖｄ装置用ウェハセッタ−
JPS60115223A (ja) * 1983-11-26 1985-06-21 Toshiba Mach Co Ltd マスク欠陥検査装置
CN102290486A (zh) * 2010-06-17 2011-12-21 细美事有限公司 用于加载或卸载基板的基板处理装置
TWI470729B (zh) * 2011-05-24 2015-01-21 Orbotech Lt Solar Llc 破損基板或晶圓回收系統及以該系統卸除破損晶圓碎片的方法
TWI500940B (zh) * 2010-04-20 2015-09-21 Shibuya Kogyo Co Ltd Item sorting device
US9287152B2 (en) 2009-12-10 2016-03-15 Orbotech LT Solar, LLC. Auto-sequencing multi-directional inline processing method
TWI747204B (zh) * 2020-03-19 2021-11-21 佳格食品股份有限公司 蓋體輸送機

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262463B2 (zh) * 1982-02-24 1987-12-26 Tokyo Shibaura Electric Co
JPS58147039A (ja) * 1982-02-24 1983-09-01 Toshiba Corp Ｃｖｄ装置用ウェハセッタ−
JPS60115223A (ja) * 1983-11-26 1985-06-21 Toshiba Mach Co Ltd マスク欠陥検査装置
US9287152B2 (en) 2009-12-10 2016-03-15 Orbotech LT Solar, LLC. Auto-sequencing multi-directional inline processing method
TWI500940B (zh) * 2010-04-20 2015-09-21 Shibuya Kogyo Co Ltd Item sorting device
CN102290486A (zh) * 2010-06-17 2011-12-21 细美事有限公司 用于加载或卸载基板的基板处理装置
US8738174B2 (en) 2010-06-17 2014-05-27 Semes Co., Ltd. Substrate processing apparatus and method for loading and unloading substrates
TWI455862B (zh) * 2010-06-17 2014-10-11 Semes Co Ltd 裝載及卸載基板用之基板處理裝置和方法
KR101329303B1 (ko) * 2010-06-17 2013-11-20 세메스 주식회사 기판들의 로딩 및 언로딩을 위한 기판 처리 장치
US20110313565A1 (en) * 2010-06-17 2011-12-22 Semes Co., Ltd. Substrate Processing Apparatus And Method For Loading And Unloading Substrates
TWI470729B (zh) * 2011-05-24 2015-01-21 Orbotech Lt Solar Llc 破損基板或晶圓回收系統及以該系統卸除破損晶圓碎片的方法
US9462921B2 (en) 2011-05-24 2016-10-11 Orbotech LT Solar, LLC. Broken wafer recovery system
TWI747204B (zh) * 2020-03-19 2021-11-21 佳格食品股份有限公司 蓋體輸送機

Also Published As

Publication number Publication date
JPS6129143B2 (zh) 1986-07-04

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