JPS57201042A - Testing method for semiconductor wafer - Google Patents

Testing method for semiconductor wafer

Info

Publication number
JPS57201042A
JPS57201042A JP56086579A JP8657981A JPS57201042A JP S57201042 A JPS57201042 A JP S57201042A JP 56086579 A JP56086579 A JP 56086579A JP 8657981 A JP8657981 A JP 8657981A JP S57201042 A JPS57201042 A JP S57201042A
Authority
JP
Japan
Prior art keywords
semiconductor
electrode
contacted
devices
same voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56086579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137777B2 (https=
Inventor
Michio Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56086579A priority Critical patent/JPS57201042A/ja
Publication of JPS57201042A publication Critical patent/JPS57201042A/ja
Publication of JPS6137777B2 publication Critical patent/JPS6137777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP56086579A 1981-06-05 1981-06-05 Testing method for semiconductor wafer Granted JPS57201042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56086579A JPS57201042A (en) 1981-06-05 1981-06-05 Testing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56086579A JPS57201042A (en) 1981-06-05 1981-06-05 Testing method for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS57201042A true JPS57201042A (en) 1982-12-09
JPS6137777B2 JPS6137777B2 (https=) 1986-08-26

Family

ID=13890910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56086579A Granted JPS57201042A (en) 1981-06-05 1981-06-05 Testing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57201042A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556731A (ja) * 1991-09-02 1993-03-09 Koichi Yamamoto ルアーの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051267A (https=) * 1973-09-07 1975-05-08
JPS5649536A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051267A (https=) * 1973-09-07 1975-05-08
JPS5649536A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS6137777B2 (https=) 1986-08-26

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