JPS5726452A - Testing method for semiconductor device - Google Patents
Testing method for semiconductor deviceInfo
- Publication number
- JPS5726452A JPS5726452A JP10200280A JP10200280A JPS5726452A JP S5726452 A JPS5726452 A JP S5726452A JP 10200280 A JP10200280 A JP 10200280A JP 10200280 A JP10200280 A JP 10200280A JP S5726452 A JPS5726452 A JP S5726452A
- Authority
- JP
- Japan
- Prior art keywords
- moisture resistance
- wafer
- substrate
- test
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To shorten the evaluating time of a semiconductor device by enabling the evaluation of the moisture resistance of the device as required as a wafer. CONSTITUTION:A wire 7 and a bias applying lead 8 are provided at a semiconductor wafer 6. The wafer 6 is mounted on a substrate, and the lead 8 is connected to a substrate terminal 9. The substrate is introduced into a furnace, the wafer 6 is exposed to high temperature and bias is applied from a lead wire 4 to perform an objective moisture resistance evaluation test. Since the test can be performed irrespective of the factors in the assembling step to the moisture resistance test according to this configuration and no resin sealing is necessary, the moisture resistance test only for the chip can be completed in a short time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10200280A JPS5726452A (en) | 1980-07-24 | 1980-07-24 | Testing method for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10200280A JPS5726452A (en) | 1980-07-24 | 1980-07-24 | Testing method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5726452A true JPS5726452A (en) | 1982-02-12 |
Family
ID=14315582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10200280A Pending JPS5726452A (en) | 1980-07-24 | 1980-07-24 | Testing method for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5726452A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121451A (en) * | 1984-11-19 | 1986-06-09 | Nec Corp | Testing process of semiconductor device |
JPS6291026A (en) * | 1985-10-17 | 1987-04-25 | Nec Corp | Mobile communication system |
-
1980
- 1980-07-24 JP JP10200280A patent/JPS5726452A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121451A (en) * | 1984-11-19 | 1986-06-09 | Nec Corp | Testing process of semiconductor device |
JPS6291026A (en) * | 1985-10-17 | 1987-04-25 | Nec Corp | Mobile communication system |
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