JPH0252262A - Electric inspecting method for multi-chip package - Google Patents

Abstract

PURPOSE:To take a measurement in a short time inspection at low cost by inspecting individual chip components including mounted dedicated LSIs through exposed electrodes and input/output leads connected electrically to the electrodes of the respective chips. CONSTITUTION:A cap 2 seals the IC chip components mounted and packaged on a specific surface of an insulating substrate 1. Then the input/output lead terminals and exposed electrodes 4 are connected electrically to the electrodes of the IC chip components. When electric connections among the electrodes of the IC chip components and of the input/output terminals are inspected, the electric inspection of the individual IC chip components except the dedicated LSIs is performed by inputting and outputting electric signals which are controlled by a specific test program through the electrodes 4 and terminals 3. Then the electric inspection of the individual dedicated LSI elements is carried out similarly by inputting and outputting electric signals which are controlled by test programs for the time of the manufacturing of the LSI elements and the time of design specifications.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to an electrical inspection method for a multi-chip package, and particularly to a method for electrically inspecting a multi-chip package in which a dedicated LSI element is mounted and sealed as a chip component. Concerns methods for testing electrical function and electrical connections.

(Prior Art) For the purpose of downsizing and improving the performance of electrical circuits and electrical components, multi-chip packages have been developed in which a plurality of IC chip components including dedicated LSI elements are mounted and sealed. That is, IC chip components including a VLSI element are mounted or mounted on a predetermined surface of an insulating substrate with the electrodes electrically connected to each other and the electrodes and input/output cathode terminals, and these IC chip components are sealed by covering them with, for example, a cap. A multi-chip package has been developed in which exposed electrodes are disposed on the back surface of the insulating substrate and are electrically connected to the electrodes of the mounted and sealed IC chip components. As for the multi-chip package, required electrical tests are carried out by inputting a predetermined signal pattern through the cathode of the multi-chip package and inspecting the output cover pattern through the output cathode.

(Problem to be solved by the invention) By the way, with recent advances in semiconductor technology, highly integrated LSIs have been developed, and the circuit scale of multi-chip packages equipped with dedicated LSI elements has become enormous. At the same time, there is a need for an electrical inspection method that can sufficiently detect defects in order to ensure the reliability of multi-chip packages. In other words, if a predetermined signal pattern is input through the input cathode and electrical inspection is performed from the output cover pattern output through the output cathode, the signal pattern will be long and complicated, so the signal The current situation is that development and selection of patterns requires a lot of time and effort, resulting in delays in product development of multi-chip packages and increased development costs.

[Structure of the Invention (Means for Solving the Problems) According to the method of the present invention, when electrically inspecting the multi-chip package, it is possible to electrically connect the electrodes of each chip component including the dedicated LSI mounted thereon. In order to conduct electrical inspections of each chip component through exposed electrodes and input/output cathodes, and to inspect the electrical connections between electrodes and input/output cathodes, the dedicated LSI
The main point is to apply software (test programs, connection data, etc.) during device development.

(Function) When electrically inspecting each IC chip component and inspecting the electrical connection through exposed electrodes for a multi-chip package having the above configuration in which a plurality of IC chip components including a dedicated LSI element are mounted or mounted. In particular, the initial data of the dedicated LSI element is applied to the electrical inspection of the dedicated LSI element. In other words, necessary electrical inspections for dedicated LSI devices can be performed simply without requiring the development of new test programs or software.

(Example) The present invention will be described in detail below. First, a multi-chip package such as the one shown in FIGS. 1 to 3 is prepared, in which a plurality of IC chip components including dedicated LSI elements are mounted or mounted. Figure 1 is a top view, Figure 2 is a side view, and Figure 3 is a top view.
The figure is a bottom view, and 1 is an insulating substrate, and 2 is a cap, which serves to seal the IC chip components mounted and mounted on a predetermined surface of the insulating substrate 1. Further, 3 is a lead terminal electrically connected to the electrodes of the IC chip component, and 4 is an exposed electrode electrically connected to the electrodes of the same IC chip component. Next, the multi-chip package is inspected for electrical connections between the electrodes of the IC chip components and electrical connections between the lead leads.
A predetermined electrical test is performed on each chip component via the exposed electrode 4 and the input/output lead terminal 3. In other words, each IC chip component (dedicated LS
(excluding I elements). After that, the remaining IC
For each chip component, that is, a dedicated LSI element, each dedicated L
Electrical inspection of each dedicated LSI element is performed by inputting and outputting electrical signals (signal patterns) controlled by a test program at the time of product production or design specification of the SI element itself. In this way, the required electrical inspection is performed on the multi-chip package having the above configuration.

In the above, when electrically inspecting a multi-chip package made up of multiple IC chip components including dedicated LSI elements mounted and mounted, the electrical inspection of the connection between electrodes and input and output cathodes, and the electrical inspection of the dedicated LSI element are performed in the following order: Although the necessary electrical tests were carried out in the above steps, the test order is not limited to the above order and may be changed as appropriate.

[Effects of the Invention] As described above, according to the method for electrically inspecting multi-chip packages according to the present invention, for each type of multi-chip package,
Necessary electrical inspections can be easily performed without the need to develop new test programs or software. In other words, a dedicated LSI
In electrical inspection and characteristic evaluation of multi-chip packages mounted with IC chip parts including elements, general IC chip parts are tested at the time of development and commercialization (initial data).
Since the above test program is applied, the above-mentioned electrical inspection can be performed at low cost, and the inspection time can be shortened overall. This has led to the development of custom multi-chip packages,
It can be said that it contributes to shortening the period of commercialization and reducing development costs, and brings many practical advantages.

[Brief explanation of the drawing]

The accompanying drawings show an example of the structure of a multi-chip package to which the electrical inspection method according to the present invention is applied, in which FIG. 1 is a top view, FIG. 2 is a side view, and FIG. 3 is a bottom view. 1... Insulating board 2... Cap 3... Input/output cathode terminal 4... Exposed electrode

Claims (1)

[Claims] The electrodes are electrically connected to each other on a predetermined surface of the insulating substrate, while the dedicated LS is electrically connected to the input and output cathode terminals.
A method for electrically inspecting a multi-chip package on which a chip component including an I element is mounted and sealed and comprising an exposed electrode electrically connected to an electrode of the chip component, the method comprising: When conducting the electrical inspection of each chip component, the electrical connection between electrodes, and the electrical connection of input/output leads, the software used when developing the dedicated LSI element is applied to the electrical inspection of the dedicated LSI element. A method for electrically inspecting a multi-chip package.