JPH08316407A - Manufacture of composite semiconductor package - Google Patents

Abstract

PURPOSE: To perform selection test of built-in semiconductor chips by using the same method used for a single semiconductor chip, in a composite semiconductor package. CONSTITUTION: In a composite semiconductor package in which a plurality of semiconductor chips 12, 13 are included, signal 16 which directly connects the part between the internal semiconductor chips 12, 13 is led out by a lead frame 15 of a divided shape, as individual signals of chips, to the outside as terminals, and selection test is performed. After the selection test, the divided lead frames are short-circuitted by a method like soldering, and signal connection between the semiconductor chips is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a composite semiconductor package, and more particularly to a method for manufacturing a composite semiconductor package containing a plurality of semiconductor chips of a semiconductor integrated circuit.

[0002]

2. Description of the Related Art Generally, a semiconductor is one in which one semiconductor chip is housed in one package. However, in the case where a plurality of semiconductors are required to be miniaturized and thinned as a request from a device using the semiconductor. There is. As an example of a solution to such a case, there is a so-called compound semiconductor in which a plurality of semiconductor chips are housed in one package.
In addition, in a normal semiconductor, a signal of the semiconductor chip is taken out of the package by connecting the semiconductor chip and the terminal of the package with a conductive frame called a lead frame.

FIG. 5 shows a composite semiconductor of Conventional Example 1. FIG. 5 is a view showing the inside of the composite semiconductor package of the first conventional example. In the composite semiconductor, a package (51) includes a semiconductor chip (52) and a semiconductor chip (53). The semiconductor chip (52) and the semiconductor chip (5
The signal from 3) to the outside of the package is connected to the package terminal by the lead frame (54) as in a normal semiconductor package.
Signal (55) for direct connection between the semiconductor chip (53) and
With regard to (2), it is directly connected inside the package and is not taken out as a terminal to the outside of the package (51). This composite semiconductor has an advantage that a plurality of semiconductors are integrated into one package and signals between the semiconductor packages are connected on the substrate, and the signals are accommodated in the semiconductor package, so that the wiring on the substrate is reduced. .

FIG. 7 shows a composite semiconductor of Conventional Example 2. FIG. 7 is a diagram showing the inside of a conventional composite type semiconductor package proposed in Japanese Patent Laid-Open No. 62-85457 of FIG. 7, in which a plurality of semiconductor chips are housed in the case of a semiconductor package having a pin grid array structure. The semiconductor chip (73) is mounted on the package (71), the semiconductor chip (74) is mounted on the package (72), and then the packages (71) and (72) are combined to form a composite semiconductor package. The signal of the semiconductor chip (73) is connected to the terminal (75), and the signal of the semiconductor chip (74) is connected to the terminal (76). The signal of the semiconductor chip can be taken out as a terminal to the outside of the package. It is possible.

[0005]

As described above, in the composite semiconductor of Conventional Example 1, among the signals of a plurality of semiconductor chips contained in one package, the signals directly connected between the semiconductor chips are in the package. A direct connection is made in. Normally, it is necessary to inspect a semiconductor to determine whether it is a good product or a defective product at the time of completion, but with a single semiconductor, an inspection machine called a semiconductor tester inputs a signal to the input terminal for the package terminal of the semiconductor, By checking the signal at the output terminal, it is determined whether the semiconductor is good or bad.

However, in the above-described composite semiconductor of the first conventional example, the signal directly connected between the semiconductor chips is not taken out as a package terminal to the outside.
A semiconductor tester cannot give an input to this signal or inspect its output. Therefore, there is a problem that the sorting means created for the sorting inspection of the single semiconductor cannot be used as it is for the sorting inspection of the composite semiconductor of Conventional Example 1, and it is taken out to the outside as the composite semiconductor. There is a problem in that it is necessary to newly create a sorting means that uses only existing signals.

That is, even when a semiconductor manufactured as an ordinary single semiconductor is newly developed as a composite semiconductor in order to reduce the size of a package, the sorting method already prepared can be used as it is. First, there is the problem that a selection method must be newly developed. Therefore, the conventional composite type semiconductor has a drawback in that the time and effort involved in designing / evaluating etc. when developing an ordinary single semiconductor as a composite type semiconductor increases.

Further, in the composite type semiconductor of Conventional Example 2 shown in FIG. 7, the signal of the semiconductor chip (73) is connected to the terminal (75) and the signal of the semiconductor chip (74) is connected to the terminal (76). Therefore, the selection inspection can be performed independently. However, the pingrit array package has a disadvantage that the manufacturing cost is high due to its complicated structure, and the structure of the package is complicated and the assembling work is also complicated, resulting in a high manufacturing cost.

[0009]

According to the present invention, in a method of manufacturing a composite type semiconductor package containing a plurality of semiconductor chips, a predetermined lead frame is connected to the plurality of semiconductor chips of the composite type semiconductor package to serve as external terminals. By taking out and connecting the signals for directly connecting the semiconductor chips individually to lead frames having a divided shape and taking them out as terminals to the outside, and then short-circuiting the lead frames having the divided shapes, the semiconductor chips are separated from each other. A method of manufacturing a composite type semiconductor package is characterized in that a signal for direct connection is connected. The present invention also provides
Signals that directly connect between semiconductor chips are individually connected to lead frames having a divided shape and taken out as terminals, and the semiconductor chips are selected and inspected for all signals of the semiconductor chip, and then have the divided shape. A method of manufacturing a composite type semiconductor package, characterized in that a lead frame is short-circuited.

[0010]

The present invention has a divided lead frame for taking out the signals of a plurality of semiconductor chips contained in the composite type semiconductor package as the individual signals of the chips to the outside of the package as terminals. Since it has a means for connecting signals between semiconductor chips by shorting the lead frame by means such as soldering, it is possible to reduce the signal wiring outside the package, which is one of the advantages of the composite type semiconductor. It is possible to perform the sorting inspection of each semiconductor chip.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. [Embodiment 1] A first embodiment of the present invention is shown in FIGS.
Described in. FIG. 1 is a diagram showing an internal state of a composite semiconductor package according to an embodiment of the present invention, FIG. 2 is a perspective view of the package, and FIG. 3 is an enlarged view of terminals of the composite semiconductor package. As shown in FIG. 1 and FIG. 2, the semiconductor chip (12) and the semiconductor chip (13) are composed of a composite semiconductor package (1
It is implemented in 1). A normal signal (17) is taken out as a terminal to the outside of the composite type semiconductor package (11) by connecting it to the lead frame (14) by a conductive wire.

The semiconductor chip (12) and the semiconductor chip (1
The signal (16) for directly connecting 3) is applied to the semiconductor chip (1
The lead frame (15) connected to 2) and the lead frame (15) connected to the semiconductor chip (13) are divided into shapes. That is, the semiconductor chip (1
2) The signal (1) that directly connects the semiconductor chip (13)
6) is connected to each frame of the lead frame (15) having the divided shape, and is taken out as two terminals to the outside of the package. In this way, all the signals of the semiconductor chip (12) and the semiconductor chip (13) are taken out as terminals to the outside of the composite type semiconductor package (11).

Next, a semiconductor chip selection inspection will be described. FIG. 6 is a view showing the inside of a single semiconductor package. Considering the semiconductor chip sorting inspection when the semiconductor chip (12) already exists as a single product, all signals of the semiconductor chip (12) are lead frames. (62)
And is taken out of the package (61). In this case, the selection inspection is performed by observing the input signal or output signal of all the signals taken out.

In the composite type semiconductor package (11) of this embodiment shown in FIG. 1, the signal (16) for directly connecting the semiconductor chip (12) and the semiconductor chip (13) has a divided lead frame (15). Since all the signals of the semiconductor chip (12) and the semiconductor chip (13) are connected to the outside of the composite semiconductor package (11) as terminals, as shown in FIG.
The method used in the sorting inspection of the single semiconductors can be used as it is in the sorting inspection of the semiconductor chips.
Therefore, it is not necessary to develop a new screening inspection method.

Next, as shown in the enlarged view of the terminals of the composite type semiconductor package of FIG. 3, the divided lead frames are joined (short-circuited). After the semiconductor chips are selected and inspected as described above, the divided lead frames (15) are short-circuited by means such as soldering as shown in FIG. Finish as a leadframe (31) similar to the normal leadframe (14) as shown. As a result, the semiconductor chip (12) and the semiconductor chip (13) are directly connected between the chips of the signal (16), and a predetermined function as a compound semiconductor is realized.

[Embodiment 2] FIG. 4 is a view showing the inside of a composite type semiconductor package of the second embodiment 4. In the case where there are four signals (16) for directly connecting between the semiconductor chip (12) and the semiconductor chip (13), the lead frame (15) having a divided shape is connected to the outside of the package. Four terminals are taken out, and all signals of the semiconductor chip (12) and the semiconductor chip (13) are taken out as terminals to the outside of the composite type semiconductor package. As described above, in the first embodiment, an example in which the number of signals directly connecting between the semiconductor chips is two has been described, but the number of signals (16) directly connecting between the semiconductor chips (12) and (13) is four. Even in the case where there is a book, it can be realized by an example as shown in FIG. Further, even when the number of signals is five or more, it can be similarly realized.

[0017]

As described above, according to the present invention, the signals of the individual semiconductor chips are separated from each other by the divided lead frames for the signals which directly connect the semiconductor chips incorporated in the composite semiconductor package. As a result, the semiconductors can be individually inspected for inspection by taking them out of the package. For this reason, even when a new compound semiconductor is developed by using the sorting inspection method that was conventionally a single semiconductor, the sorting inspection can be performed, so that the time and effort required for development can be shortened. There is an effect that can be. In addition, after completion of the selection inspection, signals between semiconductor chips can be directly connected by short-circuiting the divided lead frame terminals by means such as soldering, which is one of the advantages of composite semiconductors. It is possible to obtain the effect of reducing the signal wiring in. Further, since the lead frame used for the composite semiconductor of the present invention has a relatively simple structure, it can be manufactured at a price comparable to that of the conventional lead frame, and the manufacturing cost of the composite semiconductor is also low. It also has the effect of being able to hold down.

[Brief description of drawings]

FIG. 1 is a diagram showing the inside of a composite semiconductor package of the present invention.

FIG. 2 is a perspective view of a composite semiconductor package of the present invention.

FIG. 3 is an enlarged view of terminals of the composite semiconductor package of the present invention.

FIG. 4 is a diagram showing the inside of a composite semiconductor package of the present invention.

FIG. 5 is a view showing the inside of a conventional composite semiconductor package.

FIG. 6 is a diagram showing the inside of a single semiconductor package.

FIG. 7 is a diagram showing the inside of a conventional composite semiconductor package.

[Explanation of symbols]

 11 composite type semiconductor package 12 semiconductor chip 13 semiconductor chip 14 lead frame 15 lead frame 16 signal 17 signal 31 lead frame 51 composite type semiconductor package 52 semiconductor chip 53 semiconductor chip 54 lead frame 55 signal 61 semiconductor package 62 lead frame 71 semiconductor package 72 Semiconductor package 73 Semiconductor chip 74 Semiconductor chip 75 terminal 76 terminal

Claims (2)

[Claims] 1. A method of manufacturing a composite type semiconductor package containing a plurality of semiconductor chips, wherein a predetermined lead frame is connected to a plurality of semiconductor chips of the composite type semiconductor package and is taken out as a terminal to the outside, and between the semiconductor chips. Signals for direct connection are connected between the semiconductor chips by individually connecting the signals to be directly connected to the lead frame having a divided shape and taking out as terminals to the outside, and then short-circuiting the lead frame having the divided shape. A method of manufacturing a composite semiconductor package, comprising: 2. A signal for directly connecting between semiconductor chips is individually connected to a lead frame having a divided shape and taken out as a terminal, and a semiconductor chip selection inspection is performed on all signals of the semiconductor chip, The method of manufacturing a composite type semiconductor package according to claim 1, wherein lead frames having a divided shape are short-circuited.