JPH06140485A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce an area of a semiconductor chip by providing pad electrodes for measurement having larger sizes on a semiconductor wafer on the outside of the chip and reducing the sizes of pad electrodes for connecting outside on the semiconductor chip. CONSTITUTION:When pad electrodes 4 for measurement having larger sizes are provided on a semiconductor wafer 1 outside a semiconductor chip area and the electrodes 4 are connected to pad electrodes 3 for connecting outside on a semiconductor chip 2 through metallic wires 5, the sizes of the electrodes 3 can be reduced. At the time of performing measurement on the chip 2, the pad electrodes 4 are used and, at the time of incorporating the chip 2 in a package, the pad electrodes 3 are used. Therefore, the area of the semiconductor chip 2 can be reduced, since the need of providing the pad electrodes for measurement which require large sizes on the semiconductor chip is eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to an external connection electrode for a semiconductor chip.

[0002]

2. Description of the Related Art In a conventional semiconductor device, as shown in FIG. 3, each semiconductor chip 2 formed on a semiconductor wafer 1 is provided with an external connection pad electrode 3, and the semiconductor chip 2 operates as designed. To see if
Each of a plurality of external connection pad electrodes 3 provided on each semiconductor chip 2 on the semiconductor wafer 1 is brought into contact with each electrode of a measurement jig having a large number of needle-shaped electrodes, and a test signal is applied, The pass / fail judgment was made based on the obtained output signal of the semiconductor chip 2.

[0003]

In this conventional semiconductor device, in order to measure each semiconductor chip, each of the external connection pad electrodes of the semiconductor chip is aligned and then the electrodes of the measuring jig are mounted. Need to make contact.

Therefore, high precision is required for alignment, and the external connection pad electrode of the semiconductor chip cannot be made small.

Therefore, when the number of pad electrodes for external connection increases, the chip area increases, the manufacturing cost rises, and the semiconductor chip cannot be mounted in a small package.

[0006]

The semiconductor device of the present invention comprises:
A semiconductor chip having a pad electrode for external connection formed on a semiconductor wafer, and a measurement pad electrode provided on the semiconductor wafer other than the semiconductor chip region and connected to the pad electrode for external connection by metal wiring. I have it.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a layout diagram showing a first embodiment of the present invention.

As shown in FIG. 1, the pad electrode 3 for external connection provided on each of the semiconductor chips 2 formed on the semiconductor wafer 1 and the large area provided on a region other than the region of the semiconductor chip 2 of the semiconductor wafer 1 are measured. The metal pad 5 is connected to the pad electrode 4 for use.

FIG. 2 is a layout diagram showing a second embodiment of the present invention.

As shown in FIG. 2, a measurement terminal region 6 is provided adjacent to each of the semiconductor chips 2, and the measurement pad electrode 4 arranged in the measurement terminal region 6 and the inside of the semiconductor chip 2 are provided. A metal wiring 5 connects the external connection pad electrode 3 to each other.

The semiconductor chip 2 is divided by the measuring pad electrodes 3 after the quality is judged, and is separated from the measuring pad electrodes 3.

[0013]

As described above, according to the present invention, the measuring pad electrode, which is connected to the external connecting pad electrode provided in the semiconductor chip through the metal wiring, is provided on the semiconductor wafer other than the semiconductor chip region. It is not necessary to provide a measurement pad electrode that requires a large size in the chip, and the size of the external connection pad electrode on the semiconductor chip can be reduced.

Therefore, the chip area can be reduced and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a layout diagram showing a first embodiment of the present invention.

FIG. 2 is a layout diagram showing a second embodiment of the present invention.

FIG. 3 is a layout diagram showing an example of a conventional semiconductor device.

[Explanation of symbols]

 1 semiconductor wafer 2 semiconductor chip 3 pad electrode for external connection 4 pad electrode for measurement 5 metal wiring 6 measurement terminal area

Claims (2)

[Claims] 1. A measurement in which a semiconductor chip having a pad electrode for external connection formed on a semiconductor wafer and a pad provided for external connection provided on a semiconductor wafer other than the semiconductor chip region are connected by metal wiring. A semiconductor device, comprising: a pad electrode for a semiconductor device. 2. The measuring pad electrode is provided in a connection terminal region provided adjacent to each of the semiconductor chips.
The semiconductor device described.