JPS6471141A - Inspection device for semiconductor element - Google Patents

Inspection device for semiconductor element

Info

Publication number
JPS6471141A
JPS6471141A JP22635187A JP22635187A JPS6471141A JP S6471141 A JPS6471141 A JP S6471141A JP 22635187 A JP22635187 A JP 22635187A JP 22635187 A JP22635187 A JP 22635187A JP S6471141 A JPS6471141 A JP S6471141A
Authority
JP
Japan
Prior art keywords
tube
sections
outside
elastic force
movable pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22635187A
Other languages
Japanese (ja)
Other versions
JP2539453B2 (en
Inventor
Susumu Kasukabe
Masafumi Okubo
Yutaka Akiba
Minoru Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62226351A priority Critical patent/JP2539453B2/en
Priority to US07/209,637 priority patent/US4931726A/en
Publication of JPS6471141A publication Critical patent/JPS6471141A/en
Application granted granted Critical
Publication of JP2539453B2 publication Critical patent/JP2539453B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To inspect an element efficiently even when a stepped section is formed to an object to be inspected or the object gets trouble by composing a probe of two movable pins, nose sections of which are projected to the outside from both end sections of a tube at all times by the elastic force of a spring. CONSTITUTION:Probes 21 are mounted only by the same number as electrodes 15, and the probe 21 is constituted of a conductive tube 21a and two movable pins 21c, 21d, nose sections of which are projected to the outside from both end sections of the tube 21a at all times by the elastic force of a spring 21b movably fitted into the tube 21a. A conductive substrate 17 movably fits the tube 21a into a through-hole 17a with a clearance. Since the movable pins are pushed to the outside by elastic force, they can be brought into contact by specified force with electrodes to be contacted even when a number of stepped sections are shaped.
JP62226351A 1987-06-22 1987-09-11 Semiconductor element inspection equipment Expired - Lifetime JP2539453B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62226351A JP2539453B2 (en) 1987-09-11 1987-09-11 Semiconductor element inspection equipment
US07/209,637 US4931726A (en) 1987-06-22 1988-06-21 Apparatus for testing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62226351A JP2539453B2 (en) 1987-09-11 1987-09-11 Semiconductor element inspection equipment

Publications (2)

Publication Number Publication Date
JPS6471141A true JPS6471141A (en) 1989-03-16
JP2539453B2 JP2539453B2 (en) 1996-10-02

Family

ID=16843798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62226351A Expired - Lifetime JP2539453B2 (en) 1987-06-22 1987-09-11 Semiconductor element inspection equipment

Country Status (1)

Country Link
JP (1) JP2539453B2 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366300U (en) * 1989-10-24 1991-06-27
JPH04336441A (en) * 1991-05-14 1992-11-24 Mitsubishi Electric Corp Microwave probe head
JPH05275034A (en) * 1992-03-27 1993-10-22 Toshiba Corp X-ray image tube
WO1999004274A1 (en) * 1997-07-14 1999-01-28 Nhk Spring Co., Ltd. Conductive contact
JPH11248747A (en) * 1997-11-05 1999-09-17 Feinmetall Gmbh Test head for microscopic structure with interface
WO2000016106A1 (en) * 1998-09-10 2000-03-23 Ibiden Co., Ltd. Checker head and method of manufacturing the checker head
JP2001318107A (en) * 2000-05-01 2001-11-16 Nhk Spring Co Ltd Conductive contactor
US6323667B1 (en) 1996-12-27 2001-11-27 Nhk Spring Co., Ltd. Contact probe unit
US6417684B1 (en) 1997-11-05 2002-07-09 Feinmetall Gmbh Securement of test points in a test head
US6617863B1 (en) * 1998-04-03 2003-09-09 Hitachi, Ltd. Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
JP2006098376A (en) * 2004-09-30 2006-04-13 Yokowo Co Ltd Inspection unit
US7049837B2 (en) 2002-10-02 2006-05-23 Renesas Technology Corp. Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
US7423439B2 (en) 2005-10-05 2008-09-09 Renesas Technology Corp. Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
JP4880120B2 (en) * 1998-07-10 2012-02-22 日本発條株式会社 Conductive contact
JP2020537161A (en) * 2017-11-30 2020-12-17 リーノ インダストリアル インコーポレイテッド Inspection equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62123568U (en) * 1986-01-29 1987-08-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62123568U (en) * 1986-01-29 1987-08-05

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366300U (en) * 1989-10-24 1991-06-27
JPH04336441A (en) * 1991-05-14 1992-11-24 Mitsubishi Electric Corp Microwave probe head
JPH05275034A (en) * 1992-03-27 1993-10-22 Toshiba Corp X-ray image tube
US6323667B1 (en) 1996-12-27 2001-11-27 Nhk Spring Co., Ltd. Contact probe unit
WO1999004274A1 (en) * 1997-07-14 1999-01-28 Nhk Spring Co., Ltd. Conductive contact
US6337572B1 (en) 1997-07-14 2002-01-08 Nhk Spring Co., Ltd. Electric contact probe unit
JPH11248747A (en) * 1997-11-05 1999-09-17 Feinmetall Gmbh Test head for microscopic structure with interface
US6417684B1 (en) 1997-11-05 2002-07-09 Feinmetall Gmbh Securement of test points in a test head
US6617863B1 (en) * 1998-04-03 2003-09-09 Hitachi, Ltd. Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
US6900646B2 (en) 1998-04-03 2005-05-31 Hitachi, Ltd. Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
JP4880120B2 (en) * 1998-07-10 2012-02-22 日本発條株式会社 Conductive contact
US6535010B2 (en) 1998-09-10 2003-03-18 Ibiden Co., Ltd. Checker head and a method of manufacturing the same
WO2000016106A1 (en) * 1998-09-10 2000-03-23 Ibiden Co., Ltd. Checker head and method of manufacturing the checker head
JP2001318107A (en) * 2000-05-01 2001-11-16 Nhk Spring Co Ltd Conductive contactor
US7049837B2 (en) 2002-10-02 2006-05-23 Renesas Technology Corp. Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
JP2006098376A (en) * 2004-09-30 2006-04-13 Yokowo Co Ltd Inspection unit
US7423439B2 (en) 2005-10-05 2008-09-09 Renesas Technology Corp. Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
JP2020537161A (en) * 2017-11-30 2020-12-17 リーノ インダストリアル インコーポレイテッド Inspection equipment
US11391757B2 (en) 2017-11-30 2022-07-19 Leeno Industrial Inc. Test device
US11726111B2 (en) 2017-11-30 2023-08-15 Leeno Industrial Inc. Test device

Also Published As

Publication number Publication date
JP2539453B2 (en) 1996-10-02

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