JPS6471141A - Inspection device for semiconductor element - Google Patents
Inspection device for semiconductor elementInfo
- Publication number
- JPS6471141A JPS6471141A JP22635187A JP22635187A JPS6471141A JP S6471141 A JPS6471141 A JP S6471141A JP 22635187 A JP22635187 A JP 22635187A JP 22635187 A JP22635187 A JP 22635187A JP S6471141 A JPS6471141 A JP S6471141A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- sections
- outside
- elastic force
- movable pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To inspect an element efficiently even when a stepped section is formed to an object to be inspected or the object gets trouble by composing a probe of two movable pins, nose sections of which are projected to the outside from both end sections of a tube at all times by the elastic force of a spring. CONSTITUTION:Probes 21 are mounted only by the same number as electrodes 15, and the probe 21 is constituted of a conductive tube 21a and two movable pins 21c, 21d, nose sections of which are projected to the outside from both end sections of the tube 21a at all times by the elastic force of a spring 21b movably fitted into the tube 21a. A conductive substrate 17 movably fits the tube 21a into a through-hole 17a with a clearance. Since the movable pins are pushed to the outside by elastic force, they can be brought into contact by specified force with electrodes to be contacted even when a number of stepped sections are shaped.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62226351A JP2539453B2 (en) | 1987-09-11 | 1987-09-11 | Semiconductor element inspection equipment |
US07/209,637 US4931726A (en) | 1987-06-22 | 1988-06-21 | Apparatus for testing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62226351A JP2539453B2 (en) | 1987-09-11 | 1987-09-11 | Semiconductor element inspection equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6471141A true JPS6471141A (en) | 1989-03-16 |
JP2539453B2 JP2539453B2 (en) | 1996-10-02 |
Family
ID=16843798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62226351A Expired - Lifetime JP2539453B2 (en) | 1987-06-22 | 1987-09-11 | Semiconductor element inspection equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2539453B2 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0366300U (en) * | 1989-10-24 | 1991-06-27 | ||
JPH04336441A (en) * | 1991-05-14 | 1992-11-24 | Mitsubishi Electric Corp | Microwave probe head |
JPH05275034A (en) * | 1992-03-27 | 1993-10-22 | Toshiba Corp | X-ray image tube |
WO1999004274A1 (en) * | 1997-07-14 | 1999-01-28 | Nhk Spring Co., Ltd. | Conductive contact |
JPH11248747A (en) * | 1997-11-05 | 1999-09-17 | Feinmetall Gmbh | Test head for microscopic structure with interface |
WO2000016106A1 (en) * | 1998-09-10 | 2000-03-23 | Ibiden Co., Ltd. | Checker head and method of manufacturing the checker head |
JP2001318107A (en) * | 2000-05-01 | 2001-11-16 | Nhk Spring Co Ltd | Conductive contactor |
US6323667B1 (en) | 1996-12-27 | 2001-11-27 | Nhk Spring Co., Ltd. | Contact probe unit |
US6417684B1 (en) | 1997-11-05 | 2002-07-09 | Feinmetall Gmbh | Securement of test points in a test head |
US6617863B1 (en) * | 1998-04-03 | 2003-09-09 | Hitachi, Ltd. | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
JP2006098376A (en) * | 2004-09-30 | 2006-04-13 | Yokowo Co Ltd | Inspection unit |
US7049837B2 (en) | 2002-10-02 | 2006-05-23 | Renesas Technology Corp. | Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method |
US7423439B2 (en) | 2005-10-05 | 2008-09-09 | Renesas Technology Corp. | Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device |
JP4880120B2 (en) * | 1998-07-10 | 2012-02-22 | 日本発條株式会社 | Conductive contact |
JP2020537161A (en) * | 2017-11-30 | 2020-12-17 | リーノ インダストリアル インコーポレイテッド | Inspection equipment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62123568U (en) * | 1986-01-29 | 1987-08-05 |
-
1987
- 1987-09-11 JP JP62226351A patent/JP2539453B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62123568U (en) * | 1986-01-29 | 1987-08-05 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0366300U (en) * | 1989-10-24 | 1991-06-27 | ||
JPH04336441A (en) * | 1991-05-14 | 1992-11-24 | Mitsubishi Electric Corp | Microwave probe head |
JPH05275034A (en) * | 1992-03-27 | 1993-10-22 | Toshiba Corp | X-ray image tube |
US6323667B1 (en) | 1996-12-27 | 2001-11-27 | Nhk Spring Co., Ltd. | Contact probe unit |
WO1999004274A1 (en) * | 1997-07-14 | 1999-01-28 | Nhk Spring Co., Ltd. | Conductive contact |
US6337572B1 (en) | 1997-07-14 | 2002-01-08 | Nhk Spring Co., Ltd. | Electric contact probe unit |
JPH11248747A (en) * | 1997-11-05 | 1999-09-17 | Feinmetall Gmbh | Test head for microscopic structure with interface |
US6417684B1 (en) | 1997-11-05 | 2002-07-09 | Feinmetall Gmbh | Securement of test points in a test head |
US6617863B1 (en) * | 1998-04-03 | 2003-09-09 | Hitachi, Ltd. | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
US6900646B2 (en) | 1998-04-03 | 2005-05-31 | Hitachi, Ltd. | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
JP4880120B2 (en) * | 1998-07-10 | 2012-02-22 | 日本発條株式会社 | Conductive contact |
US6535010B2 (en) | 1998-09-10 | 2003-03-18 | Ibiden Co., Ltd. | Checker head and a method of manufacturing the same |
WO2000016106A1 (en) * | 1998-09-10 | 2000-03-23 | Ibiden Co., Ltd. | Checker head and method of manufacturing the checker head |
JP2001318107A (en) * | 2000-05-01 | 2001-11-16 | Nhk Spring Co Ltd | Conductive contactor |
US7049837B2 (en) | 2002-10-02 | 2006-05-23 | Renesas Technology Corp. | Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method |
JP2006098376A (en) * | 2004-09-30 | 2006-04-13 | Yokowo Co Ltd | Inspection unit |
US7423439B2 (en) | 2005-10-05 | 2008-09-09 | Renesas Technology Corp. | Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device |
JP2020537161A (en) * | 2017-11-30 | 2020-12-17 | リーノ インダストリアル インコーポレイテッド | Inspection equipment |
US11391757B2 (en) | 2017-11-30 | 2022-07-19 | Leeno Industrial Inc. | Test device |
US11726111B2 (en) | 2017-11-30 | 2023-08-15 | Leeno Industrial Inc. | Test device |
Also Published As
Publication number | Publication date |
---|---|
JP2539453B2 (en) | 1996-10-02 |
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Legal Events
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FPAY | Renewal fee payment (prs date is renewal date of database) |
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