JPS57192047A - Wiring layer in semiconductor device and manufacture thereof - Google Patents

Wiring layer in semiconductor device and manufacture thereof

Info

Publication number
JPS57192047A
JPS57192047A JP56077401A JP7740181A JPS57192047A JP S57192047 A JPS57192047 A JP S57192047A JP 56077401 A JP56077401 A JP 56077401A JP 7740181 A JP7740181 A JP 7740181A JP S57192047 A JPS57192047 A JP S57192047A
Authority
JP
Japan
Prior art keywords
platinum
layer
semiconductor device
silicide
polysilicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56077401A
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Funada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56077401A priority Critical patent/JPS57192047A/ja
Priority to DE19823218974 priority patent/DE3218974A1/de
Publication of JPS57192047A publication Critical patent/JPS57192047A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W20/4451—
    • H10W20/066—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56077401A 1981-05-20 1981-05-20 Wiring layer in semiconductor device and manufacture thereof Pending JPS57192047A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56077401A JPS57192047A (en) 1981-05-20 1981-05-20 Wiring layer in semiconductor device and manufacture thereof
DE19823218974 DE3218974A1 (de) 1981-05-20 1982-05-19 Leiterverbindungsschicht fuer halbleitervorrichtungen und verfahren zu ihrer herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56077401A JPS57192047A (en) 1981-05-20 1981-05-20 Wiring layer in semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS57192047A true JPS57192047A (en) 1982-11-26

Family

ID=13632873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56077401A Pending JPS57192047A (en) 1981-05-20 1981-05-20 Wiring layer in semiconductor device and manufacture thereof

Country Status (2)

Country Link
JP (1) JPS57192047A (cg-RX-API-DMAC10.html)
DE (1) DE3218974A1 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120354U (cg-RX-API-DMAC10.html) * 1986-01-22 1987-07-30
JPH07221096A (ja) * 1994-01-24 1995-08-18 Lg Semicon Co Ltd シリサイドプラグ形成方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154040A (ja) * 1983-02-22 1984-09-03 Toshiba Corp 半導体装置の製造方法
DE3314879A1 (de) * 1983-04-25 1984-10-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von stabilen, niederohmigen kontakten in integrierten halbleiterschaltungen
JPS62172755A (ja) * 1986-01-27 1987-07-29 Canon Inc フオトセンサの作製方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131189A (ja) * 1974-09-11 1976-03-17 Sony Corp Handotaisochi
JPS5521131A (en) * 1978-08-01 1980-02-15 Seiko Epson Corp Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4265935A (en) * 1977-04-28 1981-05-05 Micro Power Systems Inc. High temperature refractory metal contact assembly and multiple layer interconnect structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131189A (ja) * 1974-09-11 1976-03-17 Sony Corp Handotaisochi
JPS5521131A (en) * 1978-08-01 1980-02-15 Seiko Epson Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62120354U (cg-RX-API-DMAC10.html) * 1986-01-22 1987-07-30
JPH07221096A (ja) * 1994-01-24 1995-08-18 Lg Semicon Co Ltd シリサイドプラグ形成方法

Also Published As

Publication number Publication date
DE3218974A1 (de) 1982-12-16
DE3218974C2 (cg-RX-API-DMAC10.html) 1992-05-14

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