JPS564248A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS564248A JPS564248A JP7983079A JP7983079A JPS564248A JP S564248 A JPS564248 A JP S564248A JP 7983079 A JP7983079 A JP 7983079A JP 7983079 A JP7983079 A JP 7983079A JP S564248 A JPS564248 A JP S564248A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polycrystalline
- wiring
- ptsi
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To increase electric conductivity and manufacture a device of high reliability, by providing a metal silicide on a region of a wiring or electrodes made of a polycrystalline semiconductor layer to produce a connecting part between the wiring or electrodes and an upper wiring. CONSTITUTION:A base 8a and an emitter 8b are provided in an Si substrate 8. The first layer of a wiring and electrodes is made of polycrystalline layer 10 on an SiO2 layer 9. SiO2 14 is produced around the layer 10. Pt is coated by evaporation on the entire obverse side. Heat treatment of the selective condition under a nonoxidizing atmosphere is performed to provide PtSi 12 by a prescribed width W inside the entire periphery of the polycrystalline Si layer 10 and etch off the remaining Pt. Oxidation is caused under pressure to produce a thick SiO2 film 15 on the polycrystalline Si 10 and a thin film 16 on the PtSi 12. Etching is then performed to expose the PtSi 12. The second layer of wiring is made by a conventional method. A connecting part is thus made of the PtSi so that electric conductivity is increased, connection area is reduced, the wirings are not deteriorated by high-concentration impurities in the polycrystalline Si and the height difference of the connecting part is small. This results in enabling high integration with high reliability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7983079A JPS564248A (en) | 1979-06-25 | 1979-06-25 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7983079A JPS564248A (en) | 1979-06-25 | 1979-06-25 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS564248A true JPS564248A (en) | 1981-01-17 |
Family
ID=13701117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7983079A Pending JPS564248A (en) | 1979-06-25 | 1979-06-25 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS564248A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58222540A (en) * | 1982-06-18 | 1983-12-24 | Sanyo Electric Co Ltd | Preparation of semiconductor device |
| JPS60130325A (en) * | 1983-12-09 | 1985-07-11 | ランハム マシ− ナリ− カンパニ− インコ−ポレ−テツド | Oven |
| JPS60174585U (en) * | 1984-04-25 | 1985-11-19 | 株式会社 藤澤製作所 | Oven with superheated steam supply mechanism |
| JPS6423121U (en) * | 1987-07-31 | 1989-02-07 | ||
| JPS6423120U (en) * | 1987-07-31 | 1989-02-07 |
-
1979
- 1979-06-25 JP JP7983079A patent/JPS564248A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58222540A (en) * | 1982-06-18 | 1983-12-24 | Sanyo Electric Co Ltd | Preparation of semiconductor device |
| JPS60130325A (en) * | 1983-12-09 | 1985-07-11 | ランハム マシ− ナリ− カンパニ− インコ−ポレ−テツド | Oven |
| JPH0362376B2 (en) * | 1983-12-09 | 1991-09-25 | Ranhamu Mashiinarii Co Inc | |
| JPS60174585U (en) * | 1984-04-25 | 1985-11-19 | 株式会社 藤澤製作所 | Oven with superheated steam supply mechanism |
| JPS6423121U (en) * | 1987-07-31 | 1989-02-07 | ||
| JPS6423120U (en) * | 1987-07-31 | 1989-02-07 | ||
| JPH057769Y2 (en) * | 1987-07-31 | 1993-02-26 | ||
| JPH0513057Y2 (en) * | 1987-07-31 | 1993-04-06 |
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