JPS57181149A - Electronic part and mounting therefor - Google Patents

Electronic part and mounting therefor

Info

Publication number
JPS57181149A
JPS57181149A JP56066468A JP6646881A JPS57181149A JP S57181149 A JPS57181149 A JP S57181149A JP 56066468 A JP56066468 A JP 56066468A JP 6646881 A JP6646881 A JP 6646881A JP S57181149 A JPS57181149 A JP S57181149A
Authority
JP
Japan
Prior art keywords
leads
straight
many
electronic part
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56066468A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6251502B2 (enExample
Inventor
Toshihiro Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56066468A priority Critical patent/JPS57181149A/ja
Publication of JPS57181149A publication Critical patent/JPS57181149A/ja
Publication of JPS6251502B2 publication Critical patent/JPS6251502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56066468A 1981-05-01 1981-05-01 Electronic part and mounting therefor Granted JPS57181149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56066468A JPS57181149A (en) 1981-05-01 1981-05-01 Electronic part and mounting therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56066468A JPS57181149A (en) 1981-05-01 1981-05-01 Electronic part and mounting therefor

Publications (2)

Publication Number Publication Date
JPS57181149A true JPS57181149A (en) 1982-11-08
JPS6251502B2 JPS6251502B2 (enExample) 1987-10-30

Family

ID=13316640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56066468A Granted JPS57181149A (en) 1981-05-01 1981-05-01 Electronic part and mounting therefor

Country Status (1)

Country Link
JP (1) JPS57181149A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215846A (ja) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd ピングリツドアレイ
US5055912A (en) * 1990-05-18 1991-10-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131868A (en) * 1978-04-04 1979-10-13 Nec Corp Electronic apparatus terminal for through-hole
JPS54184069U (enExample) * 1978-06-16 1979-12-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131868A (en) * 1978-04-04 1979-10-13 Nec Corp Electronic apparatus terminal for through-hole
JPS54184069U (enExample) * 1978-06-16 1979-12-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215846A (ja) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd ピングリツドアレイ
US5055912A (en) * 1990-05-18 1991-10-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
JPS6251502B2 (enExample) 1987-10-30

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