GB1368473A - Soldering iron tip for opening eyelet holes in printed circuit boards - Google Patents

Soldering iron tip for opening eyelet holes in printed circuit boards

Info

Publication number
GB1368473A
GB1368473A GB5009671A GB5009671A GB1368473A GB 1368473 A GB1368473 A GB 1368473A GB 5009671 A GB5009671 A GB 5009671A GB 5009671 A GB5009671 A GB 5009671A GB 1368473 A GB1368473 A GB 1368473A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
eyelet holes
soldering iron
iron tip
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5009671A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Halstead W M
Original Assignee
Halstead W M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Halstead W M filed Critical Halstead W M
Priority to GB5009671A priority Critical patent/GB1368473A/en
Publication of GB1368473A publication Critical patent/GB1368473A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/025—Bits or tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/045—Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

1368473 Unsoldering W M HALSTEAD 28 Oct 1971 50096/71 Heading B3R A soldering iron tip 10 for simultaneously opening a row of spaced solder-plugged eyelet holes 16 in a printed circuit board 17 is constructed as shown in Fig. 1. The comb-like member 14 is of heat conductive material and the prongs 15 are made of material to which solder does not readily adhere, e.g. stainless steel, aluminium. In Fig. 2 a tip with two members 14, 14<SP>1</SP> is shown and is used for opening two rows of eyelet holes.
GB5009671A 1971-10-28 1971-10-28 Soldering iron tip for opening eyelet holes in printed circuit boards Expired GB1368473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5009671A GB1368473A (en) 1971-10-28 1971-10-28 Soldering iron tip for opening eyelet holes in printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5009671A GB1368473A (en) 1971-10-28 1971-10-28 Soldering iron tip for opening eyelet holes in printed circuit boards

Publications (1)

Publication Number Publication Date
GB1368473A true GB1368473A (en) 1974-09-25

Family

ID=10454644

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5009671A Expired GB1368473A (en) 1971-10-28 1971-10-28 Soldering iron tip for opening eyelet holes in printed circuit boards

Country Status (1)

Country Link
GB (1) GB1368473A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837097A (en) * 2011-06-23 2012-12-26 神讯电脑(昆山)有限公司 Multifunctional electric soldering iron
CN108687420A (en) * 2018-07-31 2018-10-23 广西岑科电子工业有限公司 A kind of full-automatic inductance tin-soldering device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837097A (en) * 2011-06-23 2012-12-26 神讯电脑(昆山)有限公司 Multifunctional electric soldering iron
CN102837097B (en) * 2011-06-23 2016-01-20 神讯电脑(昆山)有限公司 Multi-functional electric soldering iron
CN108687420A (en) * 2018-07-31 2018-10-23 广西岑科电子工业有限公司 A kind of full-automatic inductance tin-soldering device

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees