ES437449A1 - Un metodo y su correspondiente aparato para estabilizar tem-poralmente y soldar en masa componentes electricos y elec- tronicos en un tablero de circuito - Google Patents
Un metodo y su correspondiente aparato para estabilizar tem-poralmente y soldar en masa componentes electricos y elec- tronicos en un tablero de circuitoInfo
- Publication number
- ES437449A1 ES437449A1 ES437449A ES437449A ES437449A1 ES 437449 A1 ES437449 A1 ES 437449A1 ES 437449 A ES437449 A ES 437449A ES 437449 A ES437449 A ES 437449A ES 437449 A1 ES437449 A1 ES 437449A1
- Authority
- ES
- Spain
- Prior art keywords
- circuit board
- electronic components
- board
- conductors
- temporarily supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
1.Un método y su correspondiente aparato para estabilizar temporalmente y soldar en masa componentes eléctricos y electrónicos en un tablero de circuito; teniendo dicho tablero adyacentemente por lo menos algunas de sus perforaciones, un patrón metálico al que los conductores pueden acoplarse subsiguientemente por medio de una soldadura y donde los conductores de los componentes se extienden a través de por lo menos alguna de las perforaciones en el tablero, caracterizándose dicho método porque se acoplan dicho tablero y conductores uno al otro con un material fundible compatible con dicha soldadura y que tiene una temperatura de punto de fusión por debajo de la temperatura de punto de fusión de dicha soldadura.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/469,536 US3973322A (en) | 1974-05-13 | 1974-05-13 | Mass soldering system and method |
US05/508,052 US4127692A (en) | 1974-05-13 | 1974-09-23 | Jig for mass soldering system |
US05/555,271 US3966110A (en) | 1974-09-23 | 1975-03-11 | Stabilizer system with ultrasonic soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
ES437449A1 true ES437449A1 (es) | 1980-05-16 |
Family
ID=27413104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES437449A Expired ES437449A1 (es) | 1974-05-13 | 1975-05-05 | Un metodo y su correspondiente aparato para estabilizar tem-poralmente y soldar en masa componentes electricos y elec- tronicos en un tablero de circuito |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS50153273A (es) |
AR (1) | AR209440A1 (es) |
AU (1) | AU505736B2 (es) |
BR (1) | BR7502672A (es) |
CA (1) | CA1046353A (es) |
DE (1) | DE2520124A1 (es) |
ES (1) | ES437449A1 (es) |
FR (1) | FR2271742B1 (es) |
GB (1) | GB1508676A (es) |
IT (1) | IT1035609B (es) |
NL (1) | NL7505222A (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS523164A (en) * | 1975-06-27 | 1977-01-11 | Aiwa Co | Method of securing electric components printed circuit board |
JPS5392468A (en) * | 1977-01-25 | 1978-08-14 | Kondo Kenji | Method of soldering printed circuit board |
JPS54769A (en) * | 1977-06-03 | 1979-01-06 | Fujitsu Ltd | Semiautomatic soldering system for print board |
JPS54111675A (en) * | 1978-02-22 | 1979-09-01 | Fujitsu Ltd | Soldering method of printed board |
US10374645B2 (en) | 2015-04-20 | 2019-08-06 | Interdigital Ce Patent Holdings | Holding slot for electronic device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2333661A1 (de) * | 1973-07-02 | 1975-01-23 | Schmaltz Gmbh Friedr | Kurbelwellenschleifmaschine |
-
1975
- 1975-04-11 GB GB14991/75A patent/GB1508676A/en not_active Expired
- 1975-04-16 AU AU80212/75A patent/AU505736B2/en not_active Ceased
- 1975-04-28 CA CA225,671A patent/CA1046353A/en not_active Expired
- 1975-05-02 BR BR3399/75A patent/BR7502672A/pt unknown
- 1975-05-02 NL NL7505222A patent/NL7505222A/xx not_active Application Discontinuation
- 1975-05-05 ES ES437449A patent/ES437449A1/es not_active Expired
- 1975-05-05 IT IT49427/75A patent/IT1035609B/it active
- 1975-05-06 JP JP50054172A patent/JPS50153273A/ja active Pending
- 1975-05-06 AR AR258646A patent/AR209440A1/es active
- 1975-05-06 FR FR7514131A patent/FR2271742B1/fr not_active Expired
- 1975-05-06 DE DE19752520124 patent/DE2520124A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE2520124A1 (de) | 1975-11-27 |
FR2271742B1 (es) | 1980-10-31 |
GB1508676A (en) | 1978-04-26 |
AU8021275A (en) | 1976-10-21 |
JPS50153273A (es) | 1975-12-10 |
IT1035609B (it) | 1979-10-20 |
FR2271742A1 (es) | 1975-12-12 |
CA1046353A (en) | 1979-01-16 |
BR7502672A (pt) | 1976-03-23 |
NL7505222A (nl) | 1975-11-17 |
AR209440A1 (es) | 1977-04-29 |
AU505736B2 (en) | 1979-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19980202 |