ES457276A1 - Un procedimiento para confeccionar una placa de circuito im-preso. - Google Patents

Un procedimiento para confeccionar una placa de circuito im-preso.

Info

Publication number
ES457276A1
ES457276A1 ES457276A ES457276A ES457276A1 ES 457276 A1 ES457276 A1 ES 457276A1 ES 457276 A ES457276 A ES 457276A ES 457276 A ES457276 A ES 457276A ES 457276 A1 ES457276 A1 ES 457276A1
Authority
ES
Spain
Prior art keywords
production
electrical conductor
conductor arrangements
insulating material
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES457276A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westfaelische Metall Industrie KG Hueck and Co
Original Assignee
Westfaelische Metall Industrie KG Hueck and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westfaelische Metall Industrie KG Hueck and Co filed Critical Westfaelische Metall Industrie KG Hueck and Co
Publication of ES457276A1 publication Critical patent/ES457276A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Punching Or Piercing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Un procedimiento para confeccionar una placa de circuito impreso consistente en una placa de material aislante con vías metálicas conductivas aplicadas encima, en la que las vías conductivas, unidas todavía entre sí mediante bridas sueltas, se aplican sobre la placa de material aislante, procediéndose al desacoplamiento eléctrico de las diversas vías conductivas mediante el corte ulterior de las bridas.
ES457276A 1976-05-21 1977-03-28 Un procedimiento para confeccionar una placa de circuito im-preso. Expired ES457276A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762622766 DE2622766A1 (de) 1976-05-21 1976-05-21 Verfahren zur herstellung einer leiterplatte

Publications (1)

Publication Number Publication Date
ES457276A1 true ES457276A1 (es) 1978-03-16

Family

ID=5978647

Family Applications (1)

Application Number Title Priority Date Filing Date
ES457276A Expired ES457276A1 (es) 1976-05-21 1977-03-28 Un procedimiento para confeccionar una placa de circuito im-preso.

Country Status (5)

Country Link
DE (1) DE2622766A1 (es)
ES (1) ES457276A1 (es)
FR (1) FR2352472A1 (es)
GB (1) GB1581595A (es)
SE (1) SE7705671L (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4405439C2 (de) * 1994-02-21 2002-10-24 Siemens Ag Elektrische Schaltungsanordnung und Herstellverfahren dafür
KR100492498B1 (ko) * 2001-05-21 2005-05-30 마츠시다 덴코 가부시키가이샤 프린트 배선판의 제조 방법
DE10205556A1 (de) * 2002-02-11 2003-08-21 Harting Automotive Gmbh & Co Kodierelement für ein elektrisches Modul sowie elektrisches Modul mit einem solchen Kodierelement
DE102007037366A1 (de) * 2007-08-08 2009-02-19 Robert Bosch Gmbh Elektrische Schaltung sowie Verfahren zur Herstellung einer elektrischen Schaltung
EP2853140B1 (en) * 2012-05-21 2020-07-29 Linxens Holding Interconnection substrate and method of manufacturing the same
DE202021106104U1 (de) 2021-11-09 2023-02-10 Thorn Lighting Limited Leiterplatte für ein LED-Modul, LED-Modul und LED-Leuchten

Also Published As

Publication number Publication date
FR2352472A1 (fr) 1977-12-16
SE7705671L (sv) 1977-11-22
DE2622766A1 (de) 1977-11-24
FR2352472B3 (es) 1980-03-28
GB1581595A (en) 1980-12-17

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