FR2352472A1 - Procede de fabrication d'un panneau de connexions, notamment du type circuit imprime - Google Patents
Procede de fabrication d'un panneau de connexions, notamment du type circuit imprimeInfo
- Publication number
- FR2352472A1 FR2352472A1 FR7715548A FR7715548A FR2352472A1 FR 2352472 A1 FR2352472 A1 FR 2352472A1 FR 7715548 A FR7715548 A FR 7715548A FR 7715548 A FR7715548 A FR 7715548A FR 2352472 A1 FR2352472 A1 FR 2352472A1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- printed circuit
- connection panel
- circuit type
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Punching Or Piercing (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762622766 DE2622766A1 (de) | 1976-05-21 | 1976-05-21 | Verfahren zur herstellung einer leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2352472A1 true FR2352472A1 (fr) | 1977-12-16 |
FR2352472B3 FR2352472B3 (fr) | 1980-03-28 |
Family
ID=5978647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7715548A Granted FR2352472A1 (fr) | 1976-05-21 | 1977-05-20 | Procede de fabrication d'un panneau de connexions, notamment du type circuit imprime |
Country Status (5)
Country | Link |
---|---|
DE (1) | DE2622766A1 (fr) |
ES (1) | ES457276A1 (fr) |
FR (1) | FR2352472A1 (fr) |
GB (1) | GB1581595A (fr) |
SE (1) | SE7705671L (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1713312A3 (fr) * | 2001-05-21 | 2009-01-14 | Matsushita Electric Works, Ltd. | Procédé de fabrication d'un panneau à circuit imprimé |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4405439C2 (de) * | 1994-02-21 | 2002-10-24 | Siemens Ag | Elektrische Schaltungsanordnung und Herstellverfahren dafür |
DE10205556A1 (de) * | 2002-02-11 | 2003-08-21 | Harting Automotive Gmbh & Co | Kodierelement für ein elektrisches Modul sowie elektrisches Modul mit einem solchen Kodierelement |
DE102007037366A1 (de) * | 2007-08-08 | 2009-02-19 | Robert Bosch Gmbh | Elektrische Schaltung sowie Verfahren zur Herstellung einer elektrischen Schaltung |
WO2013175261A1 (fr) * | 2012-05-21 | 2013-11-28 | Linxens Holding | Substrat d'interconnexion et son procédé de fabrication |
DE202021106104U1 (de) | 2021-11-09 | 2023-02-10 | Thorn Lighting Limited | Leiterplatte für ein LED-Modul, LED-Modul und LED-Leuchten |
-
1976
- 1976-05-21 DE DE19762622766 patent/DE2622766A1/de active Pending
-
1977
- 1977-03-28 ES ES457276A patent/ES457276A1/es not_active Expired
- 1977-05-16 SE SE7705671A patent/SE7705671L/xx unknown
- 1977-05-19 GB GB21186/77A patent/GB1581595A/en not_active Expired
- 1977-05-20 FR FR7715548A patent/FR2352472A1/fr active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1713312A3 (fr) * | 2001-05-21 | 2009-01-14 | Matsushita Electric Works, Ltd. | Procédé de fabrication d'un panneau à circuit imprimé |
Also Published As
Publication number | Publication date |
---|---|
SE7705671L (sv) | 1977-11-22 |
FR2352472B3 (fr) | 1980-03-28 |
ES457276A1 (es) | 1978-03-16 |
DE2622766A1 (de) | 1977-11-24 |
GB1581595A (en) | 1980-12-17 |
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