ZA781637B - Wire scribed circuit board and method for the manufacture thereof - Google Patents

Wire scribed circuit board and method for the manufacture thereof

Info

Publication number
ZA781637B
ZA781637B ZA00781637A ZA781637A ZA781637B ZA 781637 B ZA781637 B ZA 781637B ZA 00781637 A ZA00781637 A ZA 00781637A ZA 781637 A ZA781637 A ZA 781637A ZA 781637 B ZA781637 B ZA 781637B
Authority
ZA
South Africa
Prior art keywords
manufacture
circuit board
wire scribed
scribed circuit
wire
Prior art date
Application number
ZA00781637A
Inventor
J Burr
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ZA781637B publication Critical patent/ZA781637B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
ZA00781637A 1977-06-20 1978-03-21 Wire scribed circuit board and method for the manufacture thereof ZA781637B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (1)

Publication Number Publication Date
ZA781637B true ZA781637B (en) 1979-02-28

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA00781637A ZA781637B (en) 1977-06-20 1978-03-21 Wire scribed circuit board and method for the manufacture thereof

Country Status (13)

Country Link
JP (1) JPS548874A (en)
AT (1) AT374330B (en)
AU (1) AU523939B2 (en)
CA (1) CA1111569A (en)
CH (1) CH635715A5 (en)
DE (1) DE2827312C2 (en)
FR (1) FR2395673A1 (en)
GB (1) GB2004703B (en)
IL (1) IL54900A (en)
IT (1) IT1105425B (en)
NL (1) NL189107C (en)
SE (1) SE447191B (en)
ZA (1) ZA781637B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (en) * 1996-05-12 1997-10-02 Markus Woelfel Resin-sealed wired circuit board manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
AT374330B (en) 1984-04-10
JPS548874A (en) 1979-01-23
IT7849944A0 (en) 1978-06-20
CA1111569A (en) 1981-10-27
NL189107B (en) 1992-08-03
IT1105425B (en) 1985-11-04
IL54900A (en) 1980-07-31
AU3615478A (en) 1979-11-22
GB2004703B (en) 1982-01-13
FR2395673A1 (en) 1979-01-19
SE7806960L (en) 1978-12-21
DE2827312C2 (en) 1982-05-27
ATA413478A (en) 1983-08-15
FR2395673B1 (en) 1980-10-24
SE447191B (en) 1986-10-27
CH635715A5 (en) 1983-04-15
GB2004703A (en) 1979-04-04
NL7806608A (en) 1978-12-22
AU523939B2 (en) 1982-08-26
DE2827312A1 (en) 1978-12-21
IL54900A0 (en) 1978-08-31
NL189107C (en) 1993-01-04

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