JPS548874A - Lead wire wiring circuit board and method of manufacturing same - Google Patents

Lead wire wiring circuit board and method of manufacturing same

Info

Publication number
JPS548874A
JPS548874A JP7029478A JP7029478A JPS548874A JP S548874 A JPS548874 A JP S548874A JP 7029478 A JP7029478 A JP 7029478A JP 7029478 A JP7029478 A JP 7029478A JP S548874 A JPS548874 A JP S548874A
Authority
JP
Japan
Prior art keywords
circuit board
lead wire
wiring circuit
manufacturing same
wire wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7029478A
Other languages
Japanese (ja)
Inventor
Bii Baa Jieimuzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS548874A publication Critical patent/JPS548874A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP7029478A 1977-06-20 1978-06-08 Lead wire wiring circuit board and method of manufacturing same Pending JPS548874A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (1)

Publication Number Publication Date
JPS548874A true JPS548874A (en) 1979-01-23

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7029478A Pending JPS548874A (en) 1977-06-20 1978-06-08 Lead wire wiring circuit board and method of manufacturing same

Country Status (13)

Country Link
JP (1) JPS548874A (en)
AT (1) AT374330B (en)
AU (1) AU523939B2 (en)
CA (1) CA1111569A (en)
CH (1) CH635715A5 (en)
DE (1) DE2827312C2 (en)
FR (1) FR2395673A1 (en)
GB (1) GB2004703B (en)
IL (1) IL54900A (en)
IT (1) IT1105425B (en)
NL (1) NL189107C (en)
SE (1) SE447191B (en)
ZA (1) ZA781637B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (en) * 1996-05-12 1997-10-02 Markus Woelfel Resin-sealed wired circuit board manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
ZA781637B (en) 1979-02-28
NL189107C (en) 1993-01-04
NL7806608A (en) 1978-12-22
SE447191B (en) 1986-10-27
IT1105425B (en) 1985-11-04
ATA413478A (en) 1983-08-15
DE2827312C2 (en) 1982-05-27
CH635715A5 (en) 1983-04-15
IL54900A0 (en) 1978-08-31
SE7806960L (en) 1978-12-21
AT374330B (en) 1984-04-10
AU3615478A (en) 1979-11-22
IT7849944A0 (en) 1978-06-20
FR2395673B1 (en) 1980-10-24
AU523939B2 (en) 1982-08-26
NL189107B (en) 1992-08-03
IL54900A (en) 1980-07-31
GB2004703A (en) 1979-04-04
FR2395673A1 (en) 1979-01-19
GB2004703B (en) 1982-01-13
DE2827312A1 (en) 1978-12-21
CA1111569A (en) 1981-10-27

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