FR2395673B1 - - Google Patents

Info

Publication number
FR2395673B1
FR2395673B1 FR7818362A FR7818362A FR2395673B1 FR 2395673 B1 FR2395673 B1 FR 2395673B1 FR 7818362 A FR7818362 A FR 7818362A FR 7818362 A FR7818362 A FR 7818362A FR 2395673 B1 FR2395673 B1 FR 2395673B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7818362A
Other languages
French (fr)
Other versions
FR2395673A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2395673A1 publication Critical patent/FR2395673A1/en
Application granted granted Critical
Publication of FR2395673B1 publication Critical patent/FR2395673B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
FR7818362A 1977-06-20 1978-06-20 CIRCUIT PANEL CONTAINING CONDUCTORS LAYED FOLLOWING A PREFIXED TRACE AND PROCESS FOR ITS MANUFACTURING Granted FR2395673A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (2)

Publication Number Publication Date
FR2395673A1 FR2395673A1 (en) 1979-01-19
FR2395673B1 true FR2395673B1 (en) 1980-10-24

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7818362A Granted FR2395673A1 (en) 1977-06-20 1978-06-20 CIRCUIT PANEL CONTAINING CONDUCTORS LAYED FOLLOWING A PREFIXED TRACE AND PROCESS FOR ITS MANUFACTURING

Country Status (13)

Country Link
JP (1) JPS548874A (en)
AT (1) AT374330B (en)
AU (1) AU523939B2 (en)
CA (1) CA1111569A (en)
CH (1) CH635715A5 (en)
DE (1) DE2827312C2 (en)
FR (1) FR2395673A1 (en)
GB (1) GB2004703B (en)
IL (1) IL54900A (en)
IT (1) IT1105425B (en)
NL (1) NL189107C (en)
SE (1) SE447191B (en)
ZA (1) ZA781637B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (en) * 1996-05-12 1997-10-02 Markus Woelfel Resin-sealed wired circuit board manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
DE2827312A1 (en) 1978-12-21
IL54900A0 (en) 1978-08-31
AU3615478A (en) 1979-11-22
IT7849944A0 (en) 1978-06-20
CH635715A5 (en) 1983-04-15
AU523939B2 (en) 1982-08-26
SE447191B (en) 1986-10-27
NL7806608A (en) 1978-12-22
GB2004703A (en) 1979-04-04
ZA781637B (en) 1979-02-28
ATA413478A (en) 1983-08-15
SE7806960L (en) 1978-12-21
CA1111569A (en) 1981-10-27
NL189107C (en) 1993-01-04
GB2004703B (en) 1982-01-13
FR2395673A1 (en) 1979-01-19
IL54900A (en) 1980-07-31
JPS548874A (en) 1979-01-23
AT374330B (en) 1984-04-10
NL189107B (en) 1992-08-03
IT1105425B (en) 1985-11-04
DE2827312C2 (en) 1982-05-27

Similar Documents

Publication Publication Date Title
FR2376026B1 (en)
FR2378965B1 (en)
FR2377961B1 (en)
FR2395673B1 (en)
FR2378924B3 (en)
FR2377299B1 (en)
FR2378662B1 (en)
AU3353778A (en)
FR2377169B1 (en)
FR2376629B3 (en)
FR2377966B1 (en)
AR210643A1 (en)
AU495917B2 (en)
AU71461S (en)
BG25813A1 (en)
BG25826A1 (en)
BG23462A1 (en)
BG24331A1 (en)
BG24713A1 (en)
BG25808A1 (en)
BG25809A1 (en)
BG25810A1 (en)
BG25811A1 (en)
BG25812A1 (en)
BE873002A (en)

Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
ST Notification of lapse