JPS5673490A - Circuit board device and method of manufacturing same - Google Patents

Circuit board device and method of manufacturing same

Info

Publication number
JPS5673490A
JPS5673490A JP14886280A JP14886280A JPS5673490A JP S5673490 A JPS5673490 A JP S5673490A JP 14886280 A JP14886280 A JP 14886280A JP 14886280 A JP14886280 A JP 14886280A JP S5673490 A JPS5673490 A JP S5673490A
Authority
JP
Japan
Prior art keywords
circuit board
board device
manufacturing same
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14886280A
Other languages
Japanese (ja)
Inventor
Ee Nabia Jieimu
Aaru Tsuuigu Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of JPS5673490A publication Critical patent/JPS5673490A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
JP14886280A 1979-10-23 1980-10-23 Circuit board device and method of manufacturing same Pending JPS5673490A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8728479A 1979-10-23 1979-10-23

Publications (1)

Publication Number Publication Date
JPS5673490A true JPS5673490A (en) 1981-06-18

Family

ID=22204256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14886280A Pending JPS5673490A (en) 1979-10-23 1980-10-23 Circuit board device and method of manufacturing same

Country Status (5)

Country Link
JP (1) JPS5673490A (en)
DE (1) DE3040054A1 (en)
FR (1) FR2468278A1 (en)
GB (1) GB2061623A (en)
NL (1) NL8005739A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502098A (en) * 1981-02-10 1985-02-26 Brown David F Circuit assembly
US4520339A (en) * 1982-04-26 1985-05-28 Kabushiki Kaisha Ishida Koki Seisakusho Load cell with adjustable bridge circuit
FR2536624A1 (en) * 1982-11-24 1984-05-25 Sev Alternateurs Method for mounting an electrical and/or electronic circuit inside a case, and circuit and case which are obtained by the method.
DE3346461A1 (en) * 1983-12-22 1985-07-04 Siemens AG, 1000 Berlin und 8000 München Method for manufacturing a telephone station
DE3500554C1 (en) * 1985-01-10 1986-01-09 Degussa Ag, 6000 Frankfurt Use of nickel alloys for glasses frames
FR2591054B1 (en) * 1985-08-29 1989-05-12 Merlin Gerin MOUNTING PRINTED CIRCUIT BOARDS
US4742183A (en) * 1986-10-24 1988-05-03 Napco Security Systems, Inc. Methods and techniques for fabricating foldable printed circuit boards
DE3743163A1 (en) * 1987-12-19 1989-06-29 Olympia Aeg Printed circuit board for an electrical circuit, especially in an office machine
DE3836033A1 (en) * 1988-10-22 1990-04-26 Hella Kg Hueck & Co Electrical apparatus, especially for motor vehicles
FR2670352B1 (en) * 1990-12-06 1994-04-01 Moulinex METHOD FOR ORIENTATION OF AT LEAST ONE ELECTRONIC COMPONENT PLACED ON A PRINTED CIRCUIT BOARD.
JP2606177B2 (en) * 1995-04-26 1997-04-30 日本電気株式会社 Printed wiring board
US20020078560A1 (en) * 2000-12-21 2002-06-27 Xerox Corporation Process for contemporaneous manufacture and interconnection between adjoining printed wiring boards
US6801436B2 (en) 2001-09-28 2004-10-05 Intel Corporation Extension mechanism and method for assembling overhanging components
DE202004021564U1 (en) * 2004-08-02 2009-03-12 Neuschäfer Elektronik GmbH Connecting element for printed circuit boards
FR2878401B1 (en) * 2004-11-22 2007-01-19 Valeo Vision Sa METHOD FOR MANUFACTURING SUPPORT OF INTERCONNECTED LIGHT EMITTING DIODES IN A THREE DIMENSIONAL ENVIRONMENT
DE202007005076U1 (en) * 2007-04-05 2007-08-02 Kiekert Ag Component carrier for locking systems

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1239226A (en) * 1958-10-30 1960-08-19 Philips Nv Device chassis with wiring formed by metal layers, and method of manufacture thereof
AT256275B (en) * 1965-06-01 1967-08-10 Philips Nv Circuit board which can be divided into at least two circuit board parts along a break line or break lines defined by a perforation, notches or the like
US3427715A (en) * 1966-06-13 1969-02-18 Motorola Inc Printed circuit fabrication
CH607543A5 (en) * 1976-11-15 1978-12-29 Zbinden & Co Two dimensional printed circuit board
US4085433A (en) * 1976-11-22 1978-04-18 Baranowski Conrad J Method and apparatus for improving packaging density of discrete electronic components
US4227238A (en) * 1977-09-28 1980-10-07 Nippon Gakki Seizo Kabushiki Kaisha Mounting and electrical connection means for operation unit for electric devices

Also Published As

Publication number Publication date
DE3040054A1 (en) 1981-05-07
FR2468278A1 (en) 1981-04-30
GB2061623A (en) 1981-05-13
NL8005739A (en) 1981-04-27

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