GB2061623A - Interconnecting conductive paths between a main circuit board and adjacent circuit boards - Google Patents
Interconnecting conductive paths between a main circuit board and adjacent circuit boards Download PDFInfo
- Publication number
- GB2061623A GB2061623A GB8029845A GB8029845A GB2061623A GB 2061623 A GB2061623 A GB 2061623A GB 8029845 A GB8029845 A GB 8029845A GB 8029845 A GB8029845 A GB 8029845A GB 2061623 A GB2061623 A GB 2061623A
- Authority
- GB
- United Kingdom
- Prior art keywords
- board
- circuit
- boards
- connectors
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10848—Thinned leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A single circuit board 10 is provided with aligned spaced openings 12 which have ends of circuit paths located on each side of the openings. Electrical components 18 are loaded into the board which are interconnected by the circuit paths and electrical connectors 20 are inserted into the ends of the circuit paths across the openings. The components and connectors are soldered in position and the board is tested. Areas between the spaced openings are removed to form two or more separate circuit boards 10a, 10b, 10c. The electrical connectors are bent so that one circuit board is positioned at an angle with respect to the other board. <IMAGE>
Description
SPECIFICATION
Method and apparatus of interconnecting conductive paths between a main circuit board and adjacent circuit boards
Background of the Invention
The present invention relates to a method and apparatus of interconnecting conductive paths and more particularly to a method and apparatus of interconnecting conductive paths between a main circuit board and adjacent circuit boards.
Various schemes have been utilized to interconnect conductive paths of adjacent circuit boards when the boards are disposed parallel to each other, in the same plane or at an angle with respect to one another. These interconnection schemes are disclosed in U.
S. Patent Nos. 2,740,097; 3,184,645; 3,362,005; 3,772,776; 4,109,299 and
French Patent No. 1,239,226.
These schemes are directed to particular concepts of making interconnections between conductive paths of adjacent circuit boards after the boards have had components added thereto, they have been soldered in place and then tested. This is normal practice, however it takes time and expense to treat each circuit board separately, and, after they have been interconnected, tests will be conducted to make certain the circuits on the boards have been properly interconnected as required.
Summary of the Invention
A large circuit board is formed which is divided into a main circuit board and at least one secondary circuit board. Oblong openings separate the main circuit board from the secondary circuit board and the boards are provided with small areas between the oblong openings to maintain the boards together for purposes of installing electrical and electronic components therein, inserting electrical connectors across the oblong openings where the ends of circuit paths of each board are located to interconnect these circuit paths, flow soldering the components and connectors in position, testing the boards, removing the areas between the oblong openings, and bending the electrical connectors so that the secondary board is disposed at an angle with respect to the main board.
A primary object of the present invention is to form a large circuit board into a main circuit board and at least one secondary circuit board, interconnect the circuit paths therebetween, by aligned connectors, flow solder the components and connectors and test the board.
Another object of the present invention is the provision of applying electrical connectors to the ends of the circuit paths of a circuit board which have electrical components therein, soldering the components and connectors to the board, testing the board and separating the board into separate circuit boards along the connectors.
A further object of the present invention is to provide a circuit interconnecting ends of circuit paths across openings in the board, soldering the components and connectors to the board, testing the board, removing areas of the board between the openings to separate the board into separate circuit boards interconnected by the connectors and bending the electrical connectors to position the separate boards at an angle with respect to one another.
An additional object of the present invention is the provision of a circuit board having circuit paths thereon for interconnecting electrical components, aligned openings located in the board which are separated by areas, ends of circuit paths disposed on each side of the openings for receiving electrical connectors to interconnect the circuit paths, the areas between the aligned openings are removable to separate the board into separate circuit boards and the separate boards can be disposed at an angle with respect to one by bending the connectors.
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of a preferred embodiment of the invention as illustrated in the accompanying drawing.
Brief Description of the Drawing
Figure 1 is a top plan view of a circuit board soldered in position;
Figure 2 is a perspective view of the board of Fig. 1 illustrating the board being separated into separate circuit boards disposed at an angle with respect to one another;
Figure 3 is a cross-sectional view taken along lines 3-3 of Fig. 1; and
Figure 4 is a cross-sectional view taken along the lines 4-4 of Fig. 2.
Detailed Description of the Invention
Turning now to the drawings, a main printed or etched circuit board 10 is formed of a suitable insulating material and it has aligned ablong openings 12 formed therein and they are separated by areas 14. In this way, board 10 is separated into a main board 1 Oa and secondary boards 1 Ob and circuit paths 16 of conductive material are provided on board 10 and ends of some of the circuit paths surround holes extending through boards 1 Oa, 1 Ob and 10c in which leads of electrical components 18 are inserted. Circuit board 10 can have conductive paths on the top and bottom surfaces thereof or it can be a conventional multilayer circuit board as desired.The conductive paths interconnect the electrical components to form electronic circuits on each of boards 1 ova, 1 Ob and 10c.
Some ends of circuit paths 16 terminate adjacent oblong openings 12 in an aligned row on each side of the openings and thereacross and these ends surround connectorreceiving holes that extend through boards 1 ova, 1 Ob and lOc. Ends of stapleshaped or U-shaped electrical connectors 20 are positioned in respective aligned holes across openings 12 to interconnect circuit paths between boards 1 Oa, 1 Ob and 1 Oc. In this way, electronic circuits on each board 1 ova, 1 Ob and
1 0c are interconnected. The bights of electri- cal connectors 20 are crimped thereby deformed to form bending sections 22.The connectors are formed and inserted in the aligned holes in the ends of the circuit paths by a machine that cuts a continuously4ed tincoated copper wire to a desired length, the cut wire is formed into a U-shape and the bight is crimped, then the U-shaped connector is inserted into respective aligned holes.
In practice, board 10 is loaded with electrical components and these components and circuit paths form electronic circuits on boards 10a, lOb and 1 Oc and electrical connectors are inserted into the aligned holes across openings 12 to interconnect the circuits. The leads of the components and ends of the connectors can be inserted into the board holes manually, by operator-controlled ma- chines or by computer-controlled machines.
After insertion of the components and connectors into board 10, it is then soldered by conventional soldering techniques such as, for example, flow soldering. The board is then tested by conventional board-testing equipment, and, when testing has been completed, areas 14 are removed by cutting or the like
Boards 1 Ob and 1 Oc are then disposed at an angle with respect to board 1 Oa by bending connectors 20 about bending sections 22.
Thus, electrical connectors 20 act as hinge means as well as mechanical support means to support the boards relative to one another.
Boards 1 Ob and 1 Oc can be disposed at any angular disposition to accommodate any confi- guration. Thus, the completed board 10, with boards 1 Ob and 1 Oc disposed at right angles with respect to board 1 ova, can constitute the complete circuit arrangement for an electronic instrument and this board can be positioned in an electronic cabinet which will be an electronic instrument such as an oscilloscope, counter DMM, etc.
The present invention therefore enables a single circuit board to be loaded with components to be interconnected by circuit paths to form electronic circuits and electrical connectors to be inserted into the board in aligned rows to interconnect the circuit paths. The board is then, subjected to a soldering operation to solder the components and connectors in position whereafter it is tested. Areas of the board are removed adjacent the connectors so that the board is formed into a main circuit board and secondary circuit boards and the connectors are bent to position the secondary boards at an angle with respect to the main board.
While this invention has been particularly shown and described with reference to a preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
CLAlIVIS 1. A circuit board comprising a planar member of insulating material having spaced conductive circuit paths secured to at least one surface thereof, aligned openings provided in said planar member separated by areas to separate said member into a main section and a secondary section, and ends of some of said circuit paths disposed in alignment on each side of said openings for receiving electrical connectors therein to inter connect the circuit paths between the main section and secondary section, said areas upon being removed enabling said secondary section to be disposed at an angle with respect to said main section by bending said electrical connectors.
2. A circuit board according to claim 1 wherein said openings are oblong.
3. A method of making two circuit boards from one circuit board, comprising the steps of:
loading the circuit board with electrical components thereby forming electronic circuits connected together by circuit paths on the circuit board;
inserting electrical connectors into aligned ends of circuit paths disposed on each side of spaced openings in said circuit board with the electrical connectors extending across said openings to interconnect;
soldering the components and electrical connectors to their respective circuit paths;
testing the circuit board;
removing areas between said spaced openings to separate the circuit board into two circuit boards.
4. A method according to claim 3 which includes the further step of bending said electrical connectors thereby positioning one circuit board at an angle with respect to the other circuit board.
5. A circuit board substantially as hereinbefore described, with reference to and as illustrated in the accompanying drawings.
6. A method of making two circuit boards from one circuit board substantially as hereinbefore described.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (6)
1 0c are interconnected. The bights of electri- cal connectors 20 are crimped thereby deformed to form bending sections 22.The connectors are formed and inserted in the aligned holes in the ends of the circuit paths by a machine that cuts a continuously4ed tincoated copper wire to a desired length, the cut wire is formed into a U-shape and the bight is crimped, then the U-shaped connector is inserted into respective aligned holes.
In practice, board 10 is loaded with electrical components and these components and circuit paths form electronic circuits on boards 10a, lOb and 1 Oc and electrical connectors are inserted into the aligned holes across openings 12 to interconnect the circuits. The leads of the components and ends of the connectors can be inserted into the board holes manually, by operator-controlled ma- chines or by computer-controlled machines.
After insertion of the components and connectors into board 10, it is then soldered by conventional soldering techniques such as, for example, flow soldering. The board is then tested by conventional board-testing equipment, and, when testing has been completed, areas 14 are removed by cutting or the like
Boards 1 Ob and 1 Oc are then disposed at an angle with respect to board 1 Oa by bending connectors 20 about bending sections 22.
Thus, electrical connectors 20 act as hinge means as well as mechanical support means to support the boards relative to one another.
Boards 1 Ob and 1 Oc can be disposed at any angular disposition to accommodate any confi- guration. Thus, the completed board 10, with boards 1 Ob and 1 Oc disposed at right angles with respect to board 1 ova, can constitute the complete circuit arrangement for an electronic instrument and this board can be positioned in an electronic cabinet which will be an electronic instrument such as an oscilloscope, counter DMM, etc.
The present invention therefore enables a single circuit board to be loaded with components to be interconnected by circuit paths to form electronic circuits and electrical connectors to be inserted into the board in aligned rows to interconnect the circuit paths. The board is then, subjected to a soldering operation to solder the components and connectors in position whereafter it is tested. Areas of the board are removed adjacent the connectors so that the board is formed into a main circuit board and secondary circuit boards and the connectors are bent to position the secondary boards at an angle with respect to the main board.
While this invention has been particularly shown and described with reference to a preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
CLAlIVIS 1. A circuit board comprising a planar member of insulating material having spaced conductive circuit paths secured to at least one surface thereof, aligned openings provided in said planar member separated by areas to separate said member into a main section and a secondary section, and ends of some of said circuit paths disposed in alignment on each side of said openings for receiving electrical connectors therein to inter connect the circuit paths between the main section and secondary section, said areas upon being removed enabling said secondary section to be disposed at an angle with respect to said main section by bending said electrical connectors.
2. A circuit board according to claim 1 wherein said openings are oblong.
3. A method of making two circuit boards from one circuit board, comprising the steps of:
loading the circuit board with electrical components thereby forming electronic circuits connected together by circuit paths on the circuit board;
inserting electrical connectors into aligned ends of circuit paths disposed on each side of spaced openings in said circuit board with the electrical connectors extending across said openings to interconnect;
soldering the components and electrical connectors to their respective circuit paths;
testing the circuit board;
removing areas between said spaced openings to separate the circuit board into two circuit boards.
4. A method according to claim 3 which includes the further step of bending said electrical connectors thereby positioning one circuit board at an angle with respect to the other circuit board.
5. A circuit board substantially as hereinbefore described, with reference to and as illustrated in the accompanying drawings.
6. A method of making two circuit boards from one circuit board substantially as hereinbefore described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8728479A | 1979-10-23 | 1979-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2061623A true GB2061623A (en) | 1981-05-13 |
Family
ID=22204256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8029845A Withdrawn GB2061623A (en) | 1979-10-23 | 1980-09-16 | Interconnecting conductive paths between a main circuit board and adjacent circuit boards |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5673490A (en) |
| DE (1) | DE3040054A1 (en) |
| FR (1) | FR2468278A1 (en) |
| GB (1) | GB2061623A (en) |
| NL (1) | NL8005739A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0103347A1 (en) * | 1982-04-26 | 1984-03-21 | Kabushiki Kaisha Ishida Koki Seisakusho | Bendable circuit board and load cell using it |
| FR2536624A1 (en) * | 1982-11-24 | 1984-05-25 | Sev Alternateurs | Method for mounting an electrical and/or electronic circuit inside a case, and circuit and case which are obtained by the method. |
| US4502098A (en) * | 1981-02-10 | 1985-02-26 | Brown David F | Circuit assembly |
| FR2591054A1 (en) * | 1985-08-29 | 1987-06-05 | Merlin Gerin | Mounting for printed-circuit boards |
| US4742183A (en) * | 1986-10-24 | 1988-05-03 | Napco Security Systems, Inc. | Methods and techniques for fabricating foldable printed circuit boards |
| EP0489384A2 (en) * | 1990-12-06 | 1992-06-10 | Moulinex | Method for orienting at least one electronic component placed on a printed circuit board |
| US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
| EP1220587A2 (en) * | 2000-12-21 | 2002-07-03 | Xerox Corporation | Process for contemporaneous manufacture and interconnection between adjoining wiring boards |
| US6801436B2 (en) * | 2001-09-28 | 2004-10-05 | Intel Corporation | Extension mechanism and method for assembling overhanging components |
| EP1662849A2 (en) * | 2004-11-22 | 2006-05-31 | Valeo Vision | Method for manufacturing a three-dimensional interconnected support for light emmitting diodes |
| WO2008122262A2 (en) * | 2007-04-05 | 2008-10-16 | Kiekert Aktiengesellschaft | Component support for closing systems |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3346461A1 (en) * | 1983-12-22 | 1985-07-04 | Siemens AG, 1000 Berlin und 8000 München | Method for manufacturing a telephone station |
| DE3500554C1 (en) * | 1985-01-10 | 1986-01-09 | Degussa Ag, 6000 Frankfurt | Use of nickel alloys for glasses frames |
| DE3743163A1 (en) * | 1987-12-19 | 1989-06-29 | Olympia Aeg | Printed circuit board for an electrical circuit, especially in an office machine |
| DE3836033A1 (en) * | 1988-10-22 | 1990-04-26 | Hella Kg Hueck & Co | Electrical apparatus, especially for motor vehicles |
| DE202004021564U1 (en) * | 2004-08-02 | 2009-03-12 | Neuschäfer Elektronik GmbH | Connecting element for printed circuit boards |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1239226A (en) * | 1958-10-30 | 1960-08-19 | Philips Nv | Device chassis with wiring formed by metal layers, and method of manufacture thereof |
| AT256275B (en) * | 1965-06-01 | 1967-08-10 | Philips Nv | Circuit board which can be divided into at least two circuit board parts along a break line or break lines defined by a perforation, notches or the like |
| US3427715A (en) * | 1966-06-13 | 1969-02-18 | Motorola Inc | Printed circuit fabrication |
| CH607543A5 (en) * | 1976-11-15 | 1978-12-29 | Zbinden & Co | Two dimensional printed circuit board |
| US4085433A (en) * | 1976-11-22 | 1978-04-18 | Baranowski Conrad J | Method and apparatus for improving packaging density of discrete electronic components |
| US4227238A (en) * | 1977-09-28 | 1980-10-07 | Nippon Gakki Seizo Kabushiki Kaisha | Mounting and electrical connection means for operation unit for electric devices |
-
1980
- 1980-09-16 GB GB8029845A patent/GB2061623A/en not_active Withdrawn
- 1980-10-17 NL NL8005739A patent/NL8005739A/en not_active Application Discontinuation
- 1980-10-22 FR FR8022890A patent/FR2468278A1/en not_active Withdrawn
- 1980-10-23 DE DE19803040054 patent/DE3040054A1/en not_active Ceased
- 1980-10-23 JP JP14886280A patent/JPS5673490A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4502098A (en) * | 1981-02-10 | 1985-02-26 | Brown David F | Circuit assembly |
| EP0103347A1 (en) * | 1982-04-26 | 1984-03-21 | Kabushiki Kaisha Ishida Koki Seisakusho | Bendable circuit board and load cell using it |
| US4520339A (en) * | 1982-04-26 | 1985-05-28 | Kabushiki Kaisha Ishida Koki Seisakusho | Load cell with adjustable bridge circuit |
| FR2536624A1 (en) * | 1982-11-24 | 1984-05-25 | Sev Alternateurs | Method for mounting an electrical and/or electronic circuit inside a case, and circuit and case which are obtained by the method. |
| FR2591054A1 (en) * | 1985-08-29 | 1987-06-05 | Merlin Gerin | Mounting for printed-circuit boards |
| US4742183A (en) * | 1986-10-24 | 1988-05-03 | Napco Security Systems, Inc. | Methods and techniques for fabricating foldable printed circuit boards |
| EP0489384A3 (en) * | 1990-12-06 | 1993-02-24 | Moulinex | Method for orienting at least one electronic component placed on a printed circuit board |
| FR2670352A1 (en) * | 1990-12-06 | 1992-06-12 | Moulinex Sa | METHOD OF ORIENTATION OF AT LEAST ONE ELECTRONIC COMPONENT PLACED ON A PRINTED CIRCUIT BOARD. |
| EP0489384A2 (en) * | 1990-12-06 | 1992-06-10 | Moulinex | Method for orienting at least one electronic component placed on a printed circuit board |
| US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
| EP1220587A2 (en) * | 2000-12-21 | 2002-07-03 | Xerox Corporation | Process for contemporaneous manufacture and interconnection between adjoining wiring boards |
| EP1220587A3 (en) * | 2000-12-21 | 2004-04-14 | Xerox Corporation | Process for contemporaneous manufacture and interconnection between adjoining wiring boards |
| US6801436B2 (en) * | 2001-09-28 | 2004-10-05 | Intel Corporation | Extension mechanism and method for assembling overhanging components |
| US6917524B2 (en) | 2001-09-28 | 2005-07-12 | Intel Corporation | Extension mechanism and method for assembling overhanging components |
| EP1662849A2 (en) * | 2004-11-22 | 2006-05-31 | Valeo Vision | Method for manufacturing a three-dimensional interconnected support for light emmitting diodes |
| EP1662849A3 (en) * | 2004-11-22 | 2008-04-02 | Valeo Vision | Method for manufacturing a three-dimensional interconnected support for light emmitting diodes |
| WO2008122262A2 (en) * | 2007-04-05 | 2008-10-16 | Kiekert Aktiengesellschaft | Component support for closing systems |
| WO2008122262A3 (en) * | 2007-04-05 | 2009-01-22 | Kiekert Ag | Component support for closing systems |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5673490A (en) | 1981-06-18 |
| DE3040054A1 (en) | 1981-05-07 |
| NL8005739A (en) | 1981-04-27 |
| FR2468278A1 (en) | 1981-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |