JPS57120358A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57120358A
JPS57120358A JP56005019A JP501981A JPS57120358A JP S57120358 A JPS57120358 A JP S57120358A JP 56005019 A JP56005019 A JP 56005019A JP 501981 A JP501981 A JP 501981A JP S57120358 A JPS57120358 A JP S57120358A
Authority
JP
Japan
Prior art keywords
plate
bonded
radiator
solder
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56005019A
Other languages
English (en)
Japanese (ja)
Other versions
JPS639665B2 (enExample
Inventor
Hitoshi Onuki
Tateo Tamamura
Masao Funiyu
Keiichi Kuniya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56005019A priority Critical patent/JPS57120358A/ja
Publication of JPS57120358A publication Critical patent/JPS57120358A/ja
Publication of JPS639665B2 publication Critical patent/JPS639665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/257—
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • H10W72/381—
    • H10W72/884—

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56005019A 1981-01-19 1981-01-19 Semiconductor device Granted JPS57120358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56005019A JPS57120358A (en) 1981-01-19 1981-01-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56005019A JPS57120358A (en) 1981-01-19 1981-01-19 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57120358A true JPS57120358A (en) 1982-07-27
JPS639665B2 JPS639665B2 (enExample) 1988-03-01

Family

ID=11599799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56005019A Granted JPS57120358A (en) 1981-01-19 1981-01-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57120358A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334932A (ja) * 1986-07-29 1988-02-15 Hitachi Cable Ltd パワ−ｉｃ装置の製造方法
JP2007162202A (ja) * 2005-12-16 2007-06-28 Sachiko Yokoyama マルチ頭巾

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316349U (enExample) * 1986-07-14 1988-02-03
JPH01302391A (ja) * 1988-05-31 1989-12-06 Nec Corp 画像表示装置
JPH03153299A (ja) * 1989-11-10 1991-07-01 Pfu Ltd 画像処理装置
JPH0464177A (ja) * 1990-07-03 1992-02-28 Nec Corp 画像表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334932A (ja) * 1986-07-29 1988-02-15 Hitachi Cable Ltd パワ−ｉｃ装置の製造方法
JP2007162202A (ja) * 2005-12-16 2007-06-28 Sachiko Yokoyama マルチ頭巾

Also Published As

Publication number Publication date
JPS639665B2 (enExample) 1988-03-01

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