JPS639665B2 - - Google Patents

Info

Publication number
JPS639665B2
JPS639665B2 JP56005019A JP501981A JPS639665B2 JP S639665 B2 JPS639665 B2 JP S639665B2 JP 56005019 A JP56005019 A JP 56005019A JP 501981 A JP501981 A JP 501981A JP S639665 B2 JPS639665 B2 JP S639665B2
Authority
JP
Japan
Prior art keywords
semiconductor device
alumina
plate
solder
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56005019A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57120358A (en
Inventor
Hitoshi Oonuki
Tateo Tamamura
Masao Funyu
Keiichi Kunya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56005019A priority Critical patent/JPS57120358A/ja
Publication of JPS57120358A publication Critical patent/JPS57120358A/ja
Publication of JPS639665B2 publication Critical patent/JPS639665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56005019A 1981-01-19 1981-01-19 Semiconductor device Granted JPS57120358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56005019A JPS57120358A (en) 1981-01-19 1981-01-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56005019A JPS57120358A (en) 1981-01-19 1981-01-19 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57120358A JPS57120358A (en) 1982-07-27
JPS639665B2 true JPS639665B2 (enExample) 1988-03-01

Family

ID=11599799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56005019A Granted JPS57120358A (en) 1981-01-19 1981-01-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57120358A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316349U (enExample) * 1986-07-14 1988-02-03
JPH01302391A (ja) * 1988-05-31 1989-12-06 Nec Corp 画像表示装置
JPH03153299A (ja) * 1989-11-10 1991-07-01 Pfu Ltd 画像処理装置
JPH0464177A (ja) * 1990-07-03 1992-02-28 Nec Corp 画像表示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744190B2 (ja) * 1986-07-29 1995-05-15 日立電線株式会社 パワ−ｉｃ装置の製造方法
JP4716220B2 (ja) * 2005-12-16 2011-07-06 さち子 横山 マルチ頭巾

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316349U (enExample) * 1986-07-14 1988-02-03
JPH01302391A (ja) * 1988-05-31 1989-12-06 Nec Corp 画像表示装置
JPH03153299A (ja) * 1989-11-10 1991-07-01 Pfu Ltd 画像処理装置
JPH0464177A (ja) * 1990-07-03 1992-02-28 Nec Corp 画像表示装置

Also Published As

Publication number Publication date
JPS57120358A (en) 1982-07-27

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