JPS57118645A - Liquid processing equipment for semiconductor - Google Patents
Liquid processing equipment for semiconductorInfo
- Publication number
- JPS57118645A JPS57118645A JP569881A JP569881A JPS57118645A JP S57118645 A JPS57118645 A JP S57118645A JP 569881 A JP569881 A JP 569881A JP 569881 A JP569881 A JP 569881A JP S57118645 A JPS57118645 A JP S57118645A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- wafers
- observed
- windows
- condition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Abstract
PURPOSE:To prevent etching solution from remaining like drops of water and observe the etching condition accurately by a method wherein tge observation windows through which the processing condition is observed are attached aslant to an etching equipment of wafers. CONSTITUTION:The films on wafers 8 transferred into the etching region are etched by etching solution sprayed from nozzles 12. The etching condition is observed through slanted observation windows. As the windows are slanted, even if some of the etching solution sprayed from the nozzles scatters and wets the windows, the solution does not remain on the observation windows and drops downward, so that the processing condition of the wafers can be observed clearly. With this constitution, the processing condition of the films on the wafers can be observed accurately.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP569881A JPS57118645A (en) | 1981-01-16 | 1981-01-16 | Liquid processing equipment for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP569881A JPS57118645A (en) | 1981-01-16 | 1981-01-16 | Liquid processing equipment for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57118645A true JPS57118645A (en) | 1982-07-23 |
Family
ID=11618316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP569881A Pending JPS57118645A (en) | 1981-01-16 | 1981-01-16 | Liquid processing equipment for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57118645A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090834U (en) * | 1983-11-28 | 1985-06-21 | シグマ技術工業株式会社 | Processing tank |
-
1981
- 1981-01-16 JP JP569881A patent/JPS57118645A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090834U (en) * | 1983-11-28 | 1985-06-21 | シグマ技術工業株式会社 | Processing tank |
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