JPS5683945A - Forming of surface protective film in semiconductor device - Google Patents

Forming of surface protective film in semiconductor device

Info

Publication number
JPS5683945A
JPS5683945A JP16103979A JP16103979A JPS5683945A JP S5683945 A JPS5683945 A JP S5683945A JP 16103979 A JP16103979 A JP 16103979A JP 16103979 A JP16103979 A JP 16103979A JP S5683945 A JPS5683945 A JP S5683945A
Authority
JP
Japan
Prior art keywords
protective film
semiconductor device
microwave
reduced
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16103979A
Other languages
English (en)
Other versions
JPS6154249B2 (ja
Inventor
Hiroshi Yano
Masanao Itoga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16103979A priority Critical patent/JPS5683945A/ja
Publication of JPS5683945A publication Critical patent/JPS5683945A/ja
Publication of JPS6154249B2 publication Critical patent/JPS6154249B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16103979A 1979-12-12 1979-12-12 Forming of surface protective film in semiconductor device Granted JPS5683945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16103979A JPS5683945A (en) 1979-12-12 1979-12-12 Forming of surface protective film in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16103979A JPS5683945A (en) 1979-12-12 1979-12-12 Forming of surface protective film in semiconductor device

Publications (2)

Publication Number Publication Date
JPS5683945A true JPS5683945A (en) 1981-07-08
JPS6154249B2 JPS6154249B2 (ja) 1986-11-21

Family

ID=15727428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16103979A Granted JPS5683945A (en) 1979-12-12 1979-12-12 Forming of surface protective film in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5683945A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006028271A (ja) * 2004-07-13 2006-02-02 Hitachi Chemical Dupont Microsystems Ltd マイクロ波硬化用熱閉環硬化型樹脂、該樹脂を含むマイクロ波硬化用熱閉環硬化型樹脂組成物、およびこの組成物から得られた硬化膜を有する電子デバイスを有する電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006028271A (ja) * 2004-07-13 2006-02-02 Hitachi Chemical Dupont Microsystems Ltd マイクロ波硬化用熱閉環硬化型樹脂、該樹脂を含むマイクロ波硬化用熱閉環硬化型樹脂組成物、およびこの組成物から得られた硬化膜を有する電子デバイスを有する電子部品

Also Published As

Publication number Publication date
JPS6154249B2 (ja) 1986-11-21

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