JPS5662352A - Semiconductor integrated circuit device for acoustic amplification circuit - Google Patents

Semiconductor integrated circuit device for acoustic amplification circuit

Info

Publication number
JPS5662352A
JPS5662352A JP13764579A JP13764579A JPS5662352A JP S5662352 A JPS5662352 A JP S5662352A JP 13764579 A JP13764579 A JP 13764579A JP 13764579 A JP13764579 A JP 13764579A JP S5662352 A JPS5662352 A JP S5662352A
Authority
JP
Japan
Prior art keywords
pad
wire bonding
line
potential
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13764579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6331105B2 (enExample
Inventor
Kunio Seki
Ritsuji Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13764579A priority Critical patent/JPS5662352A/ja
Priority to GB8032113A priority patent/GB2061617B/en
Priority to DE19803039261 priority patent/DE3039261A1/de
Priority to IT25539/80A priority patent/IT1134010B/it
Priority to US06/200,459 priority patent/US4403240A/en
Publication of JPS5662352A publication Critical patent/JPS5662352A/ja
Priority to SG630/84A priority patent/SG63084G/en
Priority to HK377/85A priority patent/HK37785A/xx
Priority to MY121/86A priority patent/MY8600121A/xx
Publication of JPS6331105B2 publication Critical patent/JPS6331105B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/211—Design considerations for internal polarisation
    • H10D89/311—Design considerations for internal polarisation in bipolar devices
    • H10W20/43—
    • H10W42/00—
    • H10W72/00—
    • H10W44/206—
    • H10W70/60—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/926—
    • H10W72/932—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Amplifiers (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP13764579A 1979-10-26 1979-10-26 Semiconductor integrated circuit device for acoustic amplification circuit Granted JPS5662352A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP13764579A JPS5662352A (en) 1979-10-26 1979-10-26 Semiconductor integrated circuit device for acoustic amplification circuit
GB8032113A GB2061617B (en) 1979-10-26 1980-10-06 Semiconductor integrated circuit device
DE19803039261 DE3039261A1 (de) 1979-10-26 1980-10-17 Integrierte halbleiterschaltungsvorrichtung
IT25539/80A IT1134010B (it) 1979-10-26 1980-10-23 Dispositivo avente un circuito integrato a semiconduttori
US06/200,459 US4403240A (en) 1979-10-26 1980-10-24 Integrated circuit with at least three ground pads
SG630/84A SG63084G (en) 1979-10-26 1984-09-01 Semiconductor integrated circuit device
HK377/85A HK37785A (en) 1979-10-26 1985-05-16 Semiconductor integrated circuit device
MY121/86A MY8600121A (en) 1979-10-26 1986-12-30 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13764579A JPS5662352A (en) 1979-10-26 1979-10-26 Semiconductor integrated circuit device for acoustic amplification circuit

Publications (2)

Publication Number Publication Date
JPS5662352A true JPS5662352A (en) 1981-05-28
JPS6331105B2 JPS6331105B2 (enExample) 1988-06-22

Family

ID=15203472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13764579A Granted JPS5662352A (en) 1979-10-26 1979-10-26 Semiconductor integrated circuit device for acoustic amplification circuit

Country Status (8)

Country Link
US (1) US4403240A (enExample)
JP (1) JPS5662352A (enExample)
DE (1) DE3039261A1 (enExample)
GB (1) GB2061617B (enExample)
HK (1) HK37785A (enExample)
IT (1) IT1134010B (enExample)
MY (1) MY8600121A (enExample)
SG (1) SG63084G (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210661A (en) * 1981-06-19 1982-12-24 Hitachi Ltd Semiconductor integrated circuit device
JPS5870564A (ja) * 1981-10-23 1983-04-27 Hitachi Ltd 集積回路の電源供給回路
JPS6079754U (ja) * 1983-11-07 1985-06-03 三洋電機株式会社 半導体集積回路装置
JPH0774196A (ja) * 1994-01-26 1995-03-17 Fujitsu Ltd 半導体集積回路装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157151A (ja) * 1982-03-15 1983-09-19 Mitsubishi Electric Corp 半導体集積回路装置
JPS594050A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
US4631572A (en) * 1983-09-27 1986-12-23 Trw Inc. Multiple path signal distribution to large scale integration chips
US4751458A (en) * 1984-04-02 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Test pads for integrated circuit chips
EP0204177A1 (de) * 1985-05-31 1986-12-10 Siemens Aktiengesellschaft Anschlussanordnung für einen integrierten Halbleiterschaltkreis
DE3626151C3 (de) * 1986-08-01 1995-06-14 Siemens Ag Spannungszuführungsanordnung für eine integrierte Halbleiterschaltung
JPH0249463A (ja) * 1988-05-27 1990-02-19 Matsushita Electron Corp 半導体装置
JPH0233801U (enExample) * 1988-08-22 1990-03-02
JPH03259561A (ja) * 1990-03-09 1991-11-19 Fujitsu Ltd 半導体装置
JP2917607B2 (ja) * 1991-10-02 1999-07-12 セイコーエプソン株式会社 半導体装置用リードフレーム
JP3246129B2 (ja) * 1993-10-01 2002-01-15 ソニー株式会社 半導体素子の製造方法
JP2807396B2 (ja) * 1993-05-25 1998-10-08 ローム株式会社 半導体装置
US5684332A (en) * 1994-05-27 1997-11-04 Advanced Semiconductor Engineering, Inc. Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
RU2133067C1 (ru) * 1996-02-20 1999-07-10 Завьялов Дмитрий Валентинович Интегральная схема
FR2769131B1 (fr) * 1997-09-29 1999-12-24 St Microelectronics Sa Dispositif semi-conducteur a deux plots de connexion de masse relies a une patte de connexion de masse et procede pour tester un tel dispositif
US6351040B1 (en) 1998-01-22 2002-02-26 Micron Technology, Inc. Method and apparatus for implementing selected functionality on an integrated circuit device
US6169331B1 (en) * 1998-08-28 2001-01-02 Micron Technology, Inc. Apparatus for electrically coupling bond pads of a microelectronic device
US6373143B1 (en) * 1998-09-24 2002-04-16 International Business Machines Corporation Integrated circuit having wirebond pads suitable for probing
AU2001268597A1 (en) * 2000-07-06 2002-01-21 Zeta, A Division Of Sierratech, Inc. A solid state power amplifying device
US6770982B1 (en) 2002-01-16 2004-08-03 Marvell International, Ltd. Semiconductor device power distribution system and method
US8258616B1 (en) 2002-01-16 2012-09-04 Marvell International Ltd. Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads
US6861762B1 (en) * 2002-05-01 2005-03-01 Marvell Semiconductor Israel Ltd. Flip chip with novel power and ground arrangement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (enExample) * 1972-09-18 1974-05-17
JPS5423387A (en) * 1977-07-22 1979-02-21 Hitachi Ltd Semiconductor integrated-circuit device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3558992A (en) 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
BE756061A (fr) * 1969-09-11 1971-03-11 Philips Nv Dispositif semi-conducteur

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (enExample) * 1972-09-18 1974-05-17
JPS5423387A (en) * 1977-07-22 1979-02-21 Hitachi Ltd Semiconductor integrated-circuit device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210661A (en) * 1981-06-19 1982-12-24 Hitachi Ltd Semiconductor integrated circuit device
JPS5870564A (ja) * 1981-10-23 1983-04-27 Hitachi Ltd 集積回路の電源供給回路
JPS6079754U (ja) * 1983-11-07 1985-06-03 三洋電機株式会社 半導体集積回路装置
JPH0774196A (ja) * 1994-01-26 1995-03-17 Fujitsu Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
IT1134010B (it) 1986-07-24
IT8025539A0 (it) 1980-10-23
MY8600121A (en) 1986-12-31
GB2061617A (en) 1981-05-13
SG63084G (en) 1985-03-29
JPS6331105B2 (enExample) 1988-06-22
HK37785A (en) 1985-05-24
US4403240A (en) 1983-09-06
DE3039261A1 (de) 1981-05-07
GB2061617B (en) 1983-12-21

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