JPS5637683A - Semiconductor rectifying device - Google Patents
Semiconductor rectifying deviceInfo
- Publication number
- JPS5637683A JPS5637683A JP11321679A JP11321679A JPS5637683A JP S5637683 A JPS5637683 A JP S5637683A JP 11321679 A JP11321679 A JP 11321679A JP 11321679 A JP11321679 A JP 11321679A JP S5637683 A JPS5637683 A JP S5637683A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- regions
- type semiconductor
- type
- electrons
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 8
- 238000009825 accumulation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/868—PIN diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11321679A JPS5637683A (en) | 1979-09-04 | 1979-09-04 | Semiconductor rectifying device |
GB8006652A GB2050694B (en) | 1979-05-07 | 1980-02-27 | Electrode structure for a semiconductor device |
NLAANVRAGE8001226,A NL188434C (nl) | 1979-05-07 | 1980-02-29 | Elektrodestructuur. |
DE19803008034 DE3008034A1 (de) | 1979-05-07 | 1980-03-03 | Elektrodenvorrichtung fuer eine halbleitervorrichtung |
FR8004965A FR2456389B1 (fr) | 1979-05-07 | 1980-03-05 | Structure d'electrodes pour dispositifs semi-conducteurs |
CA000347000A CA1150417A (en) | 1979-05-07 | 1980-03-05 | Electrode structure for a semiconductor device |
US06/512,942 US4587547A (en) | 1979-05-07 | 1983-07-12 | Electrode structure for a semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11321679A JPS5637683A (en) | 1979-09-04 | 1979-09-04 | Semiconductor rectifying device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14140185A Division JPS6139575A (ja) | 1985-06-27 | 1985-06-27 | 半導体整流装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5637683A true JPS5637683A (en) | 1981-04-11 |
JPS617757B2 JPS617757B2 (ja) | 1986-03-08 |
Family
ID=14606506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11321679A Granted JPS5637683A (en) | 1979-05-07 | 1979-09-04 | Semiconductor rectifying device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5637683A (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6074582A (ja) * | 1983-08-08 | 1985-04-26 | ゼネラル・エレクトリツク・カンパニイ | ピンチ整流器 |
JPH01501030A (ja) * | 1986-09-30 | 1989-04-06 | オイペック・オイロペーイッシェ・ゲゼルシャフト・フュール・ライスツングスハルプライター・エムベーハー・ウント・コンパニイ・コマンディートゲゼルシャフト | アノード側p領域と、隣接する低ドーピングされたnベース領域とを有する半導体構成素子 |
JPH01270348A (ja) * | 1988-04-22 | 1989-10-27 | Sanken Electric Co Ltd | ショットキバリア半導体装置 |
JPH02151067A (ja) * | 1988-12-02 | 1990-06-11 | Toshiba Corp | 半導体装置 |
US6299576B1 (en) | 1998-02-16 | 2001-10-09 | Asahi Kogaku Kogyo Kabushiki Kaisha | Assist tool for inserting a treatment tool into an endoscope, and a treatment tool to be used in the same |
JP2003051601A (ja) * | 2001-08-03 | 2003-02-21 | Fuji Electric Co Ltd | 半導体装置 |
WO2006112291A1 (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co., Ltd. | 半導体装置 |
JP2012142590A (ja) * | 2005-12-27 | 2012-07-26 | Qspeed Semiconductor Inc | 超高速リカバリダイオード |
US9253832B2 (en) | 2010-02-10 | 2016-02-02 | Power Integrations, Inc. | Power supply circuit with a control terminal for different functional modes of operation |
US9401660B2 (en) | 2009-10-06 | 2016-07-26 | Power Integrations, Inc. | Monolithic AC/DC converter for generating DC supply voltage |
WO2017149607A1 (ja) * | 2016-02-29 | 2017-09-08 | 三菱電機株式会社 | 半導体装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63190704U (ja) * | 1987-05-27 | 1988-12-08 | ||
JP2014063980A (ja) | 2012-08-30 | 2014-04-10 | Toshiba Corp | 半導体装置 |
-
1979
- 1979-09-04 JP JP11321679A patent/JPS5637683A/ja active Granted
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6074582A (ja) * | 1983-08-08 | 1985-04-26 | ゼネラル・エレクトリツク・カンパニイ | ピンチ整流器 |
US4641174A (en) * | 1983-08-08 | 1987-02-03 | General Electric Company | Pinch rectifier |
JPH0370907B2 (ja) * | 1983-08-08 | 1991-11-11 | Gen Electric | |
JPH01501030A (ja) * | 1986-09-30 | 1989-04-06 | オイペック・オイロペーイッシェ・ゲゼルシャフト・フュール・ライスツングスハルプライター・エムベーハー・ウント・コンパニイ・コマンディートゲゼルシャフト | アノード側p領域と、隣接する低ドーピングされたnベース領域とを有する半導体構成素子 |
JPH01270348A (ja) * | 1988-04-22 | 1989-10-27 | Sanken Electric Co Ltd | ショットキバリア半導体装置 |
JPH02151067A (ja) * | 1988-12-02 | 1990-06-11 | Toshiba Corp | 半導体装置 |
US5017976A (en) * | 1988-12-02 | 1991-05-21 | Kabushiki Kaisha Toshiba | Semiconductor device having intermediate layer for pinching off conductive path during reverse bias application |
US6299576B1 (en) | 1998-02-16 | 2001-10-09 | Asahi Kogaku Kogyo Kabushiki Kaisha | Assist tool for inserting a treatment tool into an endoscope, and a treatment tool to be used in the same |
JP2003051601A (ja) * | 2001-08-03 | 2003-02-21 | Fuji Electric Co Ltd | 半導体装置 |
WO2006112291A1 (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co., Ltd. | 半導体装置 |
JP2006295062A (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co Ltd | 半導体装置 |
US7535075B2 (en) | 2005-04-14 | 2009-05-19 | Rohm Co., Ltd. | Semiconductor device |
JP2012142590A (ja) * | 2005-12-27 | 2012-07-26 | Qspeed Semiconductor Inc | 超高速リカバリダイオード |
US9401660B2 (en) | 2009-10-06 | 2016-07-26 | Power Integrations, Inc. | Monolithic AC/DC converter for generating DC supply voltage |
US9253832B2 (en) | 2010-02-10 | 2016-02-02 | Power Integrations, Inc. | Power supply circuit with a control terminal for different functional modes of operation |
WO2017149607A1 (ja) * | 2016-02-29 | 2017-09-08 | 三菱電機株式会社 | 半導体装置 |
JPWO2017149607A1 (ja) * | 2016-02-29 | 2018-10-04 | 三菱電機株式会社 | 半導体装置 |
US10355142B2 (en) | 2016-02-29 | 2019-07-16 | Mitsubishi Electric Corporation | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS617757B2 (ja) | 1986-03-08 |
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