JPS5636129A - Method and device for heat treatment of semiconductor thin plate - Google Patents

Method and device for heat treatment of semiconductor thin plate

Info

Publication number
JPS5636129A
JPS5636129A JP11042279A JP11042279A JPS5636129A JP S5636129 A JPS5636129 A JP S5636129A JP 11042279 A JP11042279 A JP 11042279A JP 11042279 A JP11042279 A JP 11042279A JP S5636129 A JPS5636129 A JP S5636129A
Authority
JP
Japan
Prior art keywords
core tube
furnace core
boat
heat treatment
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11042279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634343B2 (enrdf_load_stackoverflow
Inventor
Tetsuya Takagaki
Hiroto Nagatomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11042279A priority Critical patent/JPS5636129A/ja
Publication of JPS5636129A publication Critical patent/JPS5636129A/ja
Publication of JPS634343B2 publication Critical patent/JPS634343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP11042279A 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate Granted JPS5636129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11042279A JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11042279A JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Publications (2)

Publication Number Publication Date
JPS5636129A true JPS5636129A (en) 1981-04-09
JPS634343B2 JPS634343B2 (enrdf_load_stackoverflow) 1988-01-28

Family

ID=14535352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11042279A Granted JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Country Status (1)

Country Link
JP (1) JPS5636129A (enrdf_load_stackoverflow)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105335A (ja) * 1982-12-09 1984-06-18 Toshiba Corp ウエハ支持装置
JPS59200432A (ja) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd ウエハ−ボ−ト用の搬送用具
JPS59208824A (ja) * 1983-05-12 1984-11-27 ノ−トン・カンパニ− 半導体部材等の加熱装置
JPS607122A (ja) * 1983-06-01 1985-01-14 アムテック・システムズ・インコーポレーテッド 炉中での複数の半導体ウェハを処理する方法および装置
JPS6079714A (ja) * 1983-10-06 1985-05-07 Rohm Co Ltd 拡散炉
JPS60119715A (ja) * 1983-12-01 1985-06-27 Toshiba Ceramics Co Ltd 石英ガラス製半導体ウエハ−ボ−ト搬送用具
JPS6120319A (ja) * 1984-07-09 1986-01-29 Toshiba Ceramics Co Ltd 石英ガラス製ウエハボ−ト搬送治具
JPS6144832U (ja) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 ウエハ挿入用石英フオ−ク支持機構
US4620832A (en) * 1984-03-07 1986-11-04 Motion Manufacturing, Inc. Furnace loading system
JPS62281321A (ja) * 1986-05-30 1987-12-07 Fukui Shinetsu Sekiei:Kk ウエハ処理装置
JPH03141637A (ja) * 1989-10-26 1991-06-17 Toshiba Ceramics Co Ltd ウェハボート用の搬送治具
JPH03195018A (ja) * 1989-12-25 1991-08-26 Toshiba Ceramics Co Ltd 半導体ウェーハ搬送用治具
JPH0498827A (ja) * 1990-08-17 1992-03-31 Toshiba Ceramics Co Ltd 半導体ウェーハ処理用フォーク
JP2008291284A (ja) * 2007-05-22 2008-12-04 Aisin Takaoka Ltd 多段式加熱装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744650A (en) * 1971-10-26 1973-07-10 Semiconductor Elect Memories Boat mover for semiconductor fusion process
JPS5285731A (en) * 1976-01-09 1977-07-16 Hitachi Ltd Heat treatment furnace
JPS53123081A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor wafer heat treatment apparatus
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS55158626A (en) * 1979-05-30 1980-12-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Heat treating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744650A (en) * 1971-10-26 1973-07-10 Semiconductor Elect Memories Boat mover for semiconductor fusion process
JPS5285731A (en) * 1976-01-09 1977-07-16 Hitachi Ltd Heat treatment furnace
JPS53123081A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor wafer heat treatment apparatus
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS55158626A (en) * 1979-05-30 1980-12-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Heat treating apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105335A (ja) * 1982-12-09 1984-06-18 Toshiba Corp ウエハ支持装置
JPS59200432A (ja) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd ウエハ−ボ−ト用の搬送用具
JPS59208824A (ja) * 1983-05-12 1984-11-27 ノ−トン・カンパニ− 半導体部材等の加熱装置
JPS607122A (ja) * 1983-06-01 1985-01-14 アムテック・システムズ・インコーポレーテッド 炉中での複数の半導体ウェハを処理する方法および装置
JPS6079714A (ja) * 1983-10-06 1985-05-07 Rohm Co Ltd 拡散炉
JPS60119715A (ja) * 1983-12-01 1985-06-27 Toshiba Ceramics Co Ltd 石英ガラス製半導体ウエハ−ボ−ト搬送用具
US4620832A (en) * 1984-03-07 1986-11-04 Motion Manufacturing, Inc. Furnace loading system
JPS6120319A (ja) * 1984-07-09 1986-01-29 Toshiba Ceramics Co Ltd 石英ガラス製ウエハボ−ト搬送治具
JPS6144832U (ja) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 ウエハ挿入用石英フオ−ク支持機構
JPS62281321A (ja) * 1986-05-30 1987-12-07 Fukui Shinetsu Sekiei:Kk ウエハ処理装置
JPH03141637A (ja) * 1989-10-26 1991-06-17 Toshiba Ceramics Co Ltd ウェハボート用の搬送治具
JPH03195018A (ja) * 1989-12-25 1991-08-26 Toshiba Ceramics Co Ltd 半導体ウェーハ搬送用治具
JPH0498827A (ja) * 1990-08-17 1992-03-31 Toshiba Ceramics Co Ltd 半導体ウェーハ処理用フォーク
JP2008291284A (ja) * 2007-05-22 2008-12-04 Aisin Takaoka Ltd 多段式加熱装置

Also Published As

Publication number Publication date
JPS634343B2 (enrdf_load_stackoverflow) 1988-01-28

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