JPS634343B2 - - Google Patents

Info

Publication number
JPS634343B2
JPS634343B2 JP54110422A JP11042279A JPS634343B2 JP S634343 B2 JPS634343 B2 JP S634343B2 JP 54110422 A JP54110422 A JP 54110422A JP 11042279 A JP11042279 A JP 11042279A JP S634343 B2 JPS634343 B2 JP S634343B2
Authority
JP
Japan
Prior art keywords
boat
core tube
reactor core
heat treatment
semiconductor thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54110422A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5636129A (en
Inventor
Tetsuya Takagaki
Hiroto Nagatomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11042279A priority Critical patent/JPS5636129A/ja
Publication of JPS5636129A publication Critical patent/JPS5636129A/ja
Publication of JPS634343B2 publication Critical patent/JPS634343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP11042279A 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate Granted JPS5636129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11042279A JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11042279A JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Publications (2)

Publication Number Publication Date
JPS5636129A JPS5636129A (en) 1981-04-09
JPS634343B2 true JPS634343B2 (enrdf_load_stackoverflow) 1988-01-28

Family

ID=14535352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11042279A Granted JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Country Status (1)

Country Link
JP (1) JPS5636129A (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105335A (ja) * 1982-12-09 1984-06-18 Toshiba Corp ウエハ支持装置
JPS59200432A (ja) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd ウエハ−ボ−ト用の搬送用具
JPS59208824A (ja) * 1983-05-12 1984-11-27 ノ−トン・カンパニ− 半導体部材等の加熱装置
US4459104A (en) * 1983-06-01 1984-07-10 Quartz Engineering & Materials, Inc. Cantilever diffusion tube apparatus and method
JPS6079714A (ja) * 1983-10-06 1985-05-07 Rohm Co Ltd 拡散炉
JPS60119715A (ja) * 1983-12-01 1985-06-27 Toshiba Ceramics Co Ltd 石英ガラス製半導体ウエハ−ボ−ト搬送用具
US4620832A (en) * 1984-03-07 1986-11-04 Motion Manufacturing, Inc. Furnace loading system
JPH0612760B2 (ja) * 1984-07-09 1994-02-16 東芝セラミックス株式会社 石英ガラス製ウェハボ−ト搬送治具
JPS6144832U (ja) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 ウエハ挿入用石英フオ−ク支持機構
JPS62281321A (ja) * 1986-05-30 1987-12-07 Fukui Shinetsu Sekiei:Kk ウエハ処理装置
JP2601355B2 (ja) * 1989-10-26 1997-04-16 東芝セラミックス株式会社 ウェハボート用の搬送治具
JP2640691B2 (ja) * 1989-12-25 1997-08-13 東芝セラミックス株式会社 半導体ウェーハ搬送用治具
JPH0498827A (ja) * 1990-08-17 1992-03-31 Toshiba Ceramics Co Ltd 半導体ウェーハ処理用フォーク
JP5165279B2 (ja) * 2007-05-22 2013-03-21 アイシン高丘株式会社 多段式加熱装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744650A (en) * 1971-10-26 1973-07-10 Semiconductor Elect Memories Boat mover for semiconductor fusion process
JPS597913B2 (ja) * 1976-01-09 1984-02-21 株式会社日立製作所 熱処理炉
JPS53123081A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor wafer heat treatment apparatus
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS55158626A (en) * 1979-05-30 1980-12-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Heat treating apparatus

Also Published As

Publication number Publication date
JPS5636129A (en) 1981-04-09

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