JPS5636129A - Method and device for heat treatment of semiconductor thin plate - Google Patents

Method and device for heat treatment of semiconductor thin plate

Info

Publication number
JPS5636129A
JPS5636129A JP11042279A JP11042279A JPS5636129A JP S5636129 A JPS5636129 A JP S5636129A JP 11042279 A JP11042279 A JP 11042279A JP 11042279 A JP11042279 A JP 11042279A JP S5636129 A JPS5636129 A JP S5636129A
Authority
JP
Japan
Prior art keywords
core tube
furnace core
boat
heat treatment
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11042279A
Other languages
Japanese (ja)
Other versions
JPS634343B2 (en
Inventor
Tetsuya Takagaki
Hiroto Nagatomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11042279A priority Critical patent/JPS5636129A/en
Publication of JPS5636129A publication Critical patent/JPS5636129A/en
Publication of JPS634343B2 publication Critical patent/JPS634343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To reduce the number of the heat treatment process and to minimize the device itself by a method wherein a boat that laid a semiconductor wafer and a laying jig is interposed in a furmace core tube and is heat treated at the state of holding in the furnace core tube. CONSTITUTION:The boat 9a whih is possibe to reciprocate in and out having a buffule 24 which is laid the laying jig 11A of the wafer 10, is interposed in the furnace core tube 5, the inside space in the boat is blicked with a inside coveing body 26 filled with an insulating material such as a glass fiber or others, and it is heat treated in the state of the upper portion of the outer circumference is blocked, with the outside covering body 28 that is filled with the insulating material. In this constitution, the number of reciprocating movement and the number of heat traatment process are reduced to improve the treatment efficiency, since it is not required to take out the semiconductor wafer or the laying jig, the device can be designd to minimize by reducing the furnace core tube length. Further, since there is the covering body, the blocking operation of the furnace core tube becomes unnecssary.
JP11042279A 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate Granted JPS5636129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11042279A JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11042279A JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Publications (2)

Publication Number Publication Date
JPS5636129A true JPS5636129A (en) 1981-04-09
JPS634343B2 JPS634343B2 (en) 1988-01-28

Family

ID=14535352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11042279A Granted JPS5636129A (en) 1979-08-31 1979-08-31 Method and device for heat treatment of semiconductor thin plate

Country Status (1)

Country Link
JP (1) JPS5636129A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105335A (en) * 1982-12-09 1984-06-18 Toshiba Corp Supporter for wafer
JPS59200432A (en) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd Tool for carrying wafer boat
JPS59208824A (en) * 1983-05-12 1984-11-27 ノ−トン・カンパニ− Heater of semiconductor member or the like
JPS607122A (en) * 1983-06-01 1985-01-14 アムテック・システムズ・インコーポレーテッド Method and device for treating plural semiconductor wafers in furnace
JPS6079714A (en) * 1983-10-06 1985-05-07 Rohm Co Ltd Diffusion furnace
JPS60119715A (en) * 1983-12-01 1985-06-27 Toshiba Ceramics Co Ltd Conveying implement for semiconductor wafer boat manufactured of quartz glass
JPS6120319A (en) * 1984-07-09 1986-01-29 Toshiba Ceramics Co Ltd Wafer boat transporting jig made of crystal glass
JPS6144832U (en) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 Quartz fork support mechanism for wafer insertion
US4620832A (en) * 1984-03-07 1986-11-04 Motion Manufacturing, Inc. Furnace loading system
JPS62281321A (en) * 1986-05-30 1987-12-07 Fukui Shinetsu Sekiei:Kk Wafer treating unit
JPH03141637A (en) * 1989-10-26 1991-06-17 Toshiba Ceramics Co Ltd Conveying jig for wafer boat
JPH03195018A (en) * 1989-12-25 1991-08-26 Toshiba Ceramics Co Ltd Jig for semiconductor wafer conveyance use
JPH0498827A (en) * 1990-08-17 1992-03-31 Toshiba Ceramics Co Ltd Processing fork for semiconductor wafer
JP2008291284A (en) * 2007-05-22 2008-12-04 Aisin Takaoka Ltd Multi-stage type heating apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744650A (en) * 1971-10-26 1973-07-10 Semiconductor Elect Memories Boat mover for semiconductor fusion process
JPS5285731A (en) * 1976-01-09 1977-07-16 Hitachi Ltd Heat treatment furnace
JPS53123081A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor wafer heat treatment apparatus
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS55158626A (en) * 1979-05-30 1980-12-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Heat treating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744650A (en) * 1971-10-26 1973-07-10 Semiconductor Elect Memories Boat mover for semiconductor fusion process
JPS5285731A (en) * 1976-01-09 1977-07-16 Hitachi Ltd Heat treatment furnace
JPS53123081A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor wafer heat treatment apparatus
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig
JPS55158626A (en) * 1979-05-30 1980-12-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Heat treating apparatus

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105335A (en) * 1982-12-09 1984-06-18 Toshiba Corp Supporter for wafer
JPS59200432A (en) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd Tool for carrying wafer boat
JPS59208824A (en) * 1983-05-12 1984-11-27 ノ−トン・カンパニ− Heater of semiconductor member or the like
JPS607122A (en) * 1983-06-01 1985-01-14 アムテック・システムズ・インコーポレーテッド Method and device for treating plural semiconductor wafers in furnace
JPH0262942B2 (en) * 1983-06-01 1990-12-27 Amutetsuku Shisutemuzu Inc
JPS6079714A (en) * 1983-10-06 1985-05-07 Rohm Co Ltd Diffusion furnace
JPS60119715A (en) * 1983-12-01 1985-06-27 Toshiba Ceramics Co Ltd Conveying implement for semiconductor wafer boat manufactured of quartz glass
JPH0468771B2 (en) * 1983-12-01 1992-11-04 Toshiba Ceramics Co
US4620832A (en) * 1984-03-07 1986-11-04 Motion Manufacturing, Inc. Furnace loading system
JPS6120319A (en) * 1984-07-09 1986-01-29 Toshiba Ceramics Co Ltd Wafer boat transporting jig made of crystal glass
JPH0142341Y2 (en) * 1984-08-24 1989-12-12
JPS6144832U (en) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 Quartz fork support mechanism for wafer insertion
JPS62281321A (en) * 1986-05-30 1987-12-07 Fukui Shinetsu Sekiei:Kk Wafer treating unit
JPH03141637A (en) * 1989-10-26 1991-06-17 Toshiba Ceramics Co Ltd Conveying jig for wafer boat
JPH03195018A (en) * 1989-12-25 1991-08-26 Toshiba Ceramics Co Ltd Jig for semiconductor wafer conveyance use
JPH0498827A (en) * 1990-08-17 1992-03-31 Toshiba Ceramics Co Ltd Processing fork for semiconductor wafer
JP2008291284A (en) * 2007-05-22 2008-12-04 Aisin Takaoka Ltd Multi-stage type heating apparatus

Also Published As

Publication number Publication date
JPS634343B2 (en) 1988-01-28

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