JPS57106133A - Heat treatment for semiconductor wafer - Google Patents
Heat treatment for semiconductor waferInfo
- Publication number
- JPS57106133A JPS57106133A JP18341980A JP18341980A JPS57106133A JP S57106133 A JPS57106133 A JP S57106133A JP 18341980 A JP18341980 A JP 18341980A JP 18341980 A JP18341980 A JP 18341980A JP S57106133 A JPS57106133 A JP S57106133A
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- wafers
- semiconductor wafer
- furnace
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 abstract 6
- 230000001788 irregular Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To enhance the uniformity of a heat treatment for a semiconductor wafer by mounting semiconductor wafers at different interval among the wafers in a heat treatment furnace. CONSTITUTION:When semiconductor wafers 5 are inserted into and are treated in a heat treatment furnace 6, the different intervals among the wafers 5 are provided on a boare 4, and are inserted in this state into the furnace 6. The irregular thermal capacity in the furnace can be absorbed in this manner, the wafers can be uniformly treated without respect to the position, thereby eliminating the irregularity in the characteristics of the elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18341980A JPS57106133A (en) | 1980-12-24 | 1980-12-24 | Heat treatment for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18341980A JPS57106133A (en) | 1980-12-24 | 1980-12-24 | Heat treatment for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57106133A true JPS57106133A (en) | 1982-07-01 |
Family
ID=16135443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18341980A Pending JPS57106133A (en) | 1980-12-24 | 1980-12-24 | Heat treatment for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57106133A (en) |
-
1980
- 1980-12-24 JP JP18341980A patent/JPS57106133A/en active Pending
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