JPS57121221A - Heat treatment jig - Google Patents
Heat treatment jigInfo
- Publication number
- JPS57121221A JPS57121221A JP638681A JP638681A JPS57121221A JP S57121221 A JPS57121221 A JP S57121221A JP 638681 A JP638681 A JP 638681A JP 638681 A JP638681 A JP 638681A JP S57121221 A JPS57121221 A JP S57121221A
- Authority
- JP
- Japan
- Prior art keywords
- core tube
- jig
- wafers
- heat treatment
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To unify the effect of heat treatment of wafers by a method wherein a jig for heat treatment on which materials to be treated are to be put and to be inserted in a core tube is made to have structure of which heat capacity is made to increase in proportion to advance toward the inner part of the core tube. CONSTITUTION:Height of circular arc type protruding parts 9 on both the sides of the jig 7 for temperature compensation is made to become higher gradually in proportion to advance toward the inner part of the core tube 1. When the wafers 5 are to be inserted in the core tube 1, a mounting jig 8 on which the wafers 5 are put is put on the jig 7 for temperature compensation, and the jig 7 for temperature compensation is inserted in the core tube 1 in this condition to heat treat the wafers 5. Because heat capacity of the jig 7 for temperature compensation becomes larger in proportion to advance toward the inner part, temperature drop in the core tube 1 is large because of temperature rise thereof, and distribution of temperature in the core tube 1 is unified as a result.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP638681A JPS57121221A (en) | 1981-01-21 | 1981-01-21 | Heat treatment jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP638681A JPS57121221A (en) | 1981-01-21 | 1981-01-21 | Heat treatment jig |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57121221A true JPS57121221A (en) | 1982-07-28 |
Family
ID=11636933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP638681A Pending JPS57121221A (en) | 1981-01-21 | 1981-01-21 | Heat treatment jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57121221A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS597739U (en) * | 1982-07-06 | 1984-01-19 | 株式会社日立ホームテック | electric hot plate |
-
1981
- 1981-01-21 JP JP638681A patent/JPS57121221A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS597739U (en) * | 1982-07-06 | 1984-01-19 | 株式会社日立ホームテック | electric hot plate |
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