JPS60119715A - Conveying implement for semiconductor wafer boat manufactured of quartz glass - Google Patents
Conveying implement for semiconductor wafer boat manufactured of quartz glassInfo
- Publication number
- JPS60119715A JPS60119715A JP22546683A JP22546683A JPS60119715A JP S60119715 A JPS60119715 A JP S60119715A JP 22546683 A JP22546683 A JP 22546683A JP 22546683 A JP22546683 A JP 22546683A JP S60119715 A JPS60119715 A JP S60119715A
- Authority
- JP
- Japan
- Prior art keywords
- rib
- quartz glass
- bending
- wafer
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
- H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、半導体ウェーハを載置したウェーハボートを
炉芯管へ出入れり゛る際に用いるソフトランディング方
式のつ１−ハボート搬送用具に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a soft-landing type single-wafer boat transport tool used when a wafer boat carrying semiconductor wafers is moved into and out of a furnace core tube.
従来、この種のウェーハボート搬送用具は純度的な観点
から石英ガラス材質のものが主体である。ところが、こ
の石英ガラス製のものは高温の炉内に搬送用具の一端を
１Φ入し他端は室温で固定支持するものであるため、搬
送用具内に温度勾配がブし生する。この温度勾配によっ
て搬送用具の材質内に熱的応）Ｊが発生し、それが残留
応力として材質の機械的強度を低下させる。Conventionally, this type of wafer boat transport tool is mainly made of quartz glass from the viewpoint of purity. However, in this case of quartz glass, one end of the transport tool is placed in a high-temperature furnace by 1Φ, and the other end is fixedly supported at room temperature, so a temperature gradient occurs within the transport tool. This temperature gradient causes a thermal reaction (J) to occur in the material of the conveying tool, which reduces the mechanical strength of the material as residual stress.
このため、従来の石英ガラス製ウェーハボート搬送用具
は折れたり、先端がまがったりする欠点があった。For this reason, conventional wafer boat transport tools made of quartz glass have the drawback of being broken or having bent ends.
本発明は石英ガラス製半導体ウエーハボー１〜搬送用具
を補強して大きな曲げ強度を得ることを目的としたもの
である。The object of the present invention is to reinforce a quartz glass semiconductor wafer board 1 to a conveyance tool to obtain a large bending strength.
この目的を達成するための本発明の要旨とづるところは
一端が断面アーク形状のウェーハ保持部になっているラ
フ１−ランディング方式の石英ガラス製半導体ウェーハ
ボート搬送用具であってウェーハ保持部の内側部でかつ
最も曲げモーメントの大きくなる部分及びその近辺にリ
ブを設けた事を特徴とづる石英ガラ４製半導体ウェーハ
ボート搬送用具にある。The gist of the present invention to achieve this object is to provide a rough one-landing type quartz glass semiconductor wafer boat transport tool having a wafer holder having an arc-shaped cross section at one end, the inside of the wafer holder. This semiconductor wafer boat transport tool made of quartz glass 4 is characterized in that ribs are provided at the portion where the bending moment is greatest and in the vicinity thereof.
本光明のＱ？ましい実施態様にあっては、リブの長さが
ウェーハ保持部の全長の１／３程度である。Honkomyo's Q? In a preferred embodiment, the length of the rib is approximately ⅓ of the total length of the wafer holding portion.
以下、図面を参照して、本発明の詳細な説明づる。Hereinafter, the present invention will be described in detail with reference to the drawings.
第１図はこの発明による石英ガラス製半導体ウェーハボ
ート搬送用具の先端部分のみを示している。この発明に
よる搬送用具の搬送用具本体１の基端部は従来のものと
同様であり、従来の搬送装置（図示せず）の所定位置に
固定するものであるので、ここではそれらの構造を詳細
に説明しない。FIG. 1 shows only the tip portion of a quartz glass semiconductor wafer boat transport tool according to the present invention. The proximal end of the transport tool main body 1 of the transport tool according to the present invention is similar to that of the conventional one, and is fixed at a predetermined position of a conventional transport device (not shown), so the structure thereof will be described in detail here. do not explain.
搬送用具本体１は全体が管状又は棒状（図示例では円管
状）に構成されており、その搬送用具本体１の先端部分
にウェーハ保持部２が形成しである。ウェーハ保持部２
は縦断面形状がアーク形状となっており、その上に半導
体ウェーハボート（図示せず）を周知のように乗せて搬
送するようになっている。The entire transport tool main body 1 has a tubular or rod shape (in the illustrated example, a circular pipe shape), and a wafer holder 2 is formed at the tip of the transport tool main body 1. Wafer holding part 2
has an arc-shaped vertical cross-section, and a semiconductor wafer boat (not shown) is mounted on it for transportation as is well known.
リブ３はそのようなアーク形状のウェーハ保持部２の内
側部でかつもっとも曲げモーメントの大きくなる部分Ａ
及びその近辺に設りである。たとえば、図示例において
は、リブ３は板状であって、その両エツジがつ１−ハ保
持部３の両エツジに溶接により固定しである。The rib 3 is the inner part of the arc-shaped wafer holding part 2 and is the part A where the bending moment is the largest.
It is located in and around the area. For example, in the illustrated example, the rib 3 is plate-shaped, and both edges of the rib 3 are fixed to both edges of the holding part 3 by welding.
リブ３の長さはウェーＡ保持部２の全長の約１／３に設
定し、最大曲げモーメント力く生じる部分Ａのところか
ら先端に向ってｇ２ Ｉ：するのが望ましい。なぜなら
ば、通常番よ、最大ｌｌ１１げモーメントが生じる部分
Ａのところ−ｒ１斤れたり曲がったりすることが多、ｈ
ＸつだｈＸらである。It is preferable that the length of the rib 3 is set to about 1/3 of the total length of the wafer A holding portion 2, and that it extends from the portion A where the maximum bending moment occurs toward the tip. This is because, in normal cases, part A, where the maximum flexing moment occurs, -r1 is often bent or bent.
XtsudahX et al.
第３図及び第４図を参照して、ウェーＡ保持部２の変形
について詳細に説明づ“る。まず第３図から明らかなよ
うに、ウェーｌ−保持８１５２の長さに対するリブ３の
長さの割合１ｆｉ多くなればなるほど、ウェーハ保持部
２の曲（デ応力は減少づる。特に、リブ３の長さカヘウ
エーハ保持部２の全長に対して約１／３のところまぐは
曲げ応力が急激に減少し、そのあと【よ緩かに減少して
いることがわｈする。With reference to FIGS. 3 and 4, the deformation of the wafer A holding part 2 will be explained in detail. First, as is clear from FIG. As the ratio 1fi increases, the bending stress of the wafer holder 2 decreases.In particular, the bending stress of the wafer holder 2 increases sharply when the length of the rib 3 is approximately 1/3 of the total length of the wafer holder 2. It appears that there has been a gradual decrease in the number of people in Japan.
；した、第４図に示すように、ウェーッ＼保）存８１５
２の全長に対するリブ３の長さｈ（約１／３のところま
ではウェーハ保持部２の先端のだわみｍ（ウェーハ保持
部２の先端に６キログラムの荷重をかけた場合の、保持
部の長さに対するたわみの割合）が減少し、そのあとリ
ブ３の自重により再び増加していることがわかる。; As shown in Figure 4, save 815
The length h of the rib 3 relative to the total length of 2 (up to about 1/3 is the deflection m of the tip of the wafer holder 2 (when a load of 6 kg is applied to the tip of the wafer holder 2) It can be seen that the ratio of deflection to length) decreases, and then increases again due to the weight of the rib 3.
前述の第３図及び第４図のグラフから理解されるように
、リブ３をウェーハ保持部２の全長に対して約１／３の
長さに設定した１１・１、ウェーハ保持部２の曲げ現象
に対しで最す効果的に対処できることがわかる。実験に
依れば、リブ３がウェーハ保持部２の全長の１／３程度
の長さである時、２イ８以上の強度か（；）られた。As can be understood from the graphs in FIGS. 3 and 4, the wafer holder 2 is bent at 11.1, with the rib 3 set to approximately 1/3 of the total length of the wafer holder 2. It can be seen that the phenomenon can be dealt with most effectively. According to experiments, when the length of the rib 3 is about 1/3 of the total length of the wafer holding part 2, the strength is greater than 2i8.
リブ３の長さが短かい場合には、リブ３を設けたウェー
ハ保持部２の部分は強度が増１ｊ１１するが、リブ３の
先端部分での強度（まかねらず、その結果、リブ３の先
端イ」近でつＪ−ハ保持部２が折れたり曲がったりする
ことが避ｉフられない。また、ウェーハ保持部２の全長
にわたってリブ３を設けた場合には、リブ３の自重が作
用して、ウェーハ保持部２の先端のたわみ量が大きくな
る。When the length of the rib 3 is short, the strength of the portion of the wafer holding part 2 provided with the rib 3 increases 1j11, but the strength at the tip of the rib 3 (as a result, the strength of the rib 3 It is inevitable that the wafer holder 2 will break or bend near the tip of the wafer holder 2. Also, if the rib 3 is provided over the entire length of the wafer holder 2, the weight of the rib 3 will be As a result, the amount of deflection of the tip of the wafer holder 2 increases.
ウェーハ保持部２の先端のたわみ量が大きくなると、ウ
ェーハボートの搬送に問題が生じ易い。If the amount of deflection at the tip of the wafer holder 2 becomes large, problems tend to occur in the transportation of the wafer boat.
第１図はこの発明による石英ガラス製半導体つ〕−ハボ
ート搬送用具のウェーハ保持部を示づ側面図、第２図は
第１図のＡ−Ａの斜視図、第３図はウェーハ保持部の全
長に対するリブの長さとウェーハ保持部の曲げ応力との
関係を示づグラフ、第４図はウェーハ保持部の全長に対
するリブの長さとウェーハ保持部の先端のたわみ量との
関係を示づグラフである。
７・・・・・・搬送用具本体
２・・・・・・ウェーハ保持部
３・・・・・・リブ
特許出願人 東芝ゼラミックス株式会社第１図
第２図
第３図
第４図
リブの長さFig. 1 is a side view showing the wafer holder of the quartz glass semiconductor device according to the present invention; Fig. 2 is a perspective view taken along line A-A in Fig. 1; Figure 4 is a graph showing the relationship between the length of the rib and the bending stress of the wafer holder relative to the total length. Figure 4 is a graph showing the relationship between the length of the rib and the amount of deflection at the tip of the wafer holder relative to the total length of the wafer holder. be. 7... Carrying tool main body 2... Wafer holding part 3... Rib Patent applicant Toshiba Xeramix Corporation Figure 1 Figure 2 Figure 3 Figure 4 Rib length
Claims (1)
いるラフ１〜ランデイング方式の石英カラス製半導体つ
ェーへボー］−搬送用具にＪ３いて、ウェーハ保持部の
内側部でかつ最も曲げモーメントの大きくなる部分及び
その近辺にリブを設番プだ事を特徴とする石英ガラス製
半導体ウェーハボート搬送用具。 （２ンリブの長さがウェーハ保持部の全長の１／３程痕
であることを特徴とする特許請求の範囲第１項に記載の
石英ガラス製半導体ウェーハボート搬送用具。(1) Rough 1 to landing type quartz glass semiconductor wafer with one end serving as a wafer holder with an arc-shaped cross section] A quartz glass semiconductor wafer boat transport tool characterized by having ribs installed at and near parts where the bending moment becomes large. (The quartz glass semiconductor wafer boat transport tool according to claim 1, wherein the length of the two ribs is about 1/3 of the total length of the wafer holding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22546683A JPS60119715A (en) | 1983-12-01 | 1983-12-01 | Conveying implement for semiconductor wafer boat manufactured of quartz glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22546683A JPS60119715A (en) | 1983-12-01 | 1983-12-01 | Conveying implement for semiconductor wafer boat manufactured of quartz glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60119715A true JPS60119715A (en) | 1985-06-27 |
| JPH0468771B2 JPH0468771B2 (en) | 1992-11-04 |
Family
ID=16829760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22546683A Granted JPS60119715A (en) | 1983-12-01 | 1983-12-01 | Conveying implement for semiconductor wafer boat manufactured of quartz glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119715A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH024236U (en) * | 1989-06-12 | 1990-01-11 | ||
| US6631934B1 (en) * | 2000-06-02 | 2003-10-14 | Saint-Gobain Ceramics & Plastics, Inc. | Silicon carbide cantilever paddle |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636129A (en) * | 1979-08-31 | 1981-04-09 | Hitachi Ltd | Method and device for heat treatment of semiconductor thin plate |
-
1983
- 1983-12-01 JP JP22546683A patent/JPS60119715A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636129A (en) * | 1979-08-31 | 1981-04-09 | Hitachi Ltd | Method and device for heat treatment of semiconductor thin plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH024236U (en) * | 1989-06-12 | 1990-01-11 | ||
| JPH0632678Y2 (en) * | 1989-06-12 | 1994-08-24 | 信越石英株式会社 | Wafer boat holding jig |
| US6631934B1 (en) * | 2000-06-02 | 2003-10-14 | Saint-Gobain Ceramics & Plastics, Inc. | Silicon carbide cantilever paddle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0468771B2 (en) | 1992-11-04 |
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